半導体の世界市場2021-2031:機会分析・産業予測

◆英語タイトル:Semiconductor Market By Component (Memory Devices, Logic Devices, Analog IC, MPU, MCU, Sensors, Discrete Power Devices, Others), By Node Size (180nm, 130nm, 90nm, 65nm, 45/40nm, 32/28nm, 22/20nm, 16/14nm, 10/7nm, 7/5nm, 5nm), By Application (Telecommunication, Defense and Military, Industrial, Consumer Electronics, Automotive, Others): Global Opportunity Analysis and Industry Forecast, 2021-2031

Allied Market Researchが発行した調査報告書(ALD23JN092)◆商品コード:ALD23JN092
◆発行会社(リサーチ会社):Allied Market Research
◆発行日:2022年9月
◆ページ数:276
◆レポート形式:英語 / PDF
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◆産業分野:半導体
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❖ レポートの概要 ❖

Allied Market Research社の本調査レポートは、半導体の世界市場について広く調査し、イントロダクション、エグゼクティブサマリー、市場概要、コンポーネント別(メモリ装置、ロジック装置、アナログ IC、MPU、その他)分析、ノードサイズ別(180nm、130nm、90nm、65nm、その他)分析、用途別(通信、防衛・軍事、工業、家電、その他)分析、地域別(北米、ヨーロッパ、アジア太平洋、中南米・中東・アフリカ)分析、企業状況、企業情報などを整理しております。本レポート内には、Broadcom Inc.、QUALCOMM Incorporated、Samsung Electronics Co Ltd、SK Hynix Inc.、Taiwan Semiconductors、Texas Instruments Inc.、TOSHIBA Corporationなどの企業情報が含まれています。
・イントロダクション
・エグゼクティブサマリー
・市場概要
・世界の半導体市場規模:コンポーネント別
-メモリ装置における市場規模
-ロジック装置における市場規模
-アナログ ICにおける市場規模
-MPUにおける市場規模
-その他における市場規模
・世界の半導体市場規模:ノードサイズ別
-180nmノードにおける市場規模
-130nmノードにおける市場規模
-90nmノードにおける市場規模
-65nmノードにおける市場規模
-その他における市場規模
・世界の半導体市場規模:用途別
-通信用半導体の市場規模
-防衛・軍事用半導体の市場規模
-工業用半導体の市場規模
-家電用半導体の市場規模
-その他の市場規模
・世界の半導体市場規模:地域別
- 北米の半導体市場規模
- ヨーロッパの半導体市場規模
- アジア太平洋の半導体市場規模
- 中南米・中東・アフリカの半導体市場規模
・企業状況
・企業情報

半導体は、銅のような導体とガラスのような絶縁体の中間の電気伝導性を持つ材料です。半導体は、トランジスタ、太陽電池、発光ダイオード、量子ドット、デジタルおよびアナログ集積回路など、現代のエレクトロニクスの基礎となっています。半導体材料の導電率は、温度の上昇とともに増加し、金属とは逆の挙動を示します。

半導体は、電流を一方向により通しやすく、抵抗を変化させ、光や熱に敏感に反応するなど、さまざまな有用な特性を示すことができます。半導体材料の導電特性は、不純物の制御された添加、または電界や光の印加によって変更することができ、半導体で作られたデバイスは信号の増幅、スイッチング、エネルギー変換に非常に有用です。

半導体市場は、コンポーネント、ノードサイズ、アプリケーション、地域によって区分されます。コンポーネント別では、メモリデバイス、ロジックデバイス、アナログIC、MPU、MCU、センサー、ディスクリートパワーデバイス、その他に分類されます。ノードサイズ別では、180nm、130nm、90nm、65nm、45/40nm、32/28nm、22/20nm、16/14nm、10/7nm、7/5nmに分類されます。用途別では、通信、防衛・軍事、工業、家電、自動車、その他に分類されます。地域別では、北米(米国、カナダ、メキシコ)、欧州(フランス、ドイツ、英国、その他欧州)、アジア太平洋(中国、日本、インド、韓国、その他アジア太平洋)、LAMEA(中南米、中東、アフリカ)に市場を分けて分析しています。北米、特に米国は、世界の産業用半導体の重要な参加国であり続けています。同国の主要組織や政府機関は、この技術にリソースを集中的に投入しています。

半導体市場で事業を展開する主なプレーヤーには、Broadcom Inc.、Intel Corporation、Qualcomm Incorporated、Samsung Electronics Co Ltd.、SK Hynix Inc.、Taiwan Semiconductors、Texas Instruments Inc.、Toshiba Corporation、Maxim Integrated Products Inc.、Micron Technology Inc.などが含まれます。

〈ステークホルダーにとっての主なメリット〉
・本レポートは、2021年から2031年までの半導体市場分析の市場セグメント、現在の動向、予測、ダイナミクスを定量的に分析し、一般的な半導体市場の機会を特定します。
・主要な促進要因、阻害要因、機会に関する情報とともに市場調査を提供します。
・ポーターのファイブフォース分析により、バイヤーとサプライヤーの潜在力を明らかにし、ステークホルダーが利益重視のビジネス決定を下し、サプライヤーとバイヤーのネットワークを強化できるようにします。
・半導体市場のセグメンテーションを詳細に分析することで、市場機会を見極めることができます。
・各地域の主要国を世界市場への収益貢献度に応じてマッピングしています。
・市場プレイヤーのポジショニングはベンチマーキングを容易にし、市場プレイヤーの現在のポジションを明確に理解することができます。
・地域別および世界の半導体市場動向、主要企業、市場セグメント、応用分野、市場成長戦略の分析を含みます。

〈主要市場セグメント〉
コンポーネント別
メモリデバイス
ロジックデバイス
アナログIC
MPU
MCU
センサー
ディスクリートパワーデバイス
その他

ノードサイズ別
65nm
45/40nm
32/28nm
22/20nm
16/14nm
10/7nm
7/5nm
180nm
130nm
90nm
5nm

用途別
通信
防衛・軍事
工業
家電
自動車
その他

地域別
・北米
米国
カナダ
メキシコ
・ヨーロッパ
フランス
ドイツ
イギリス
その他のヨーロッパ
・アジア太平洋
中国
日本
インド
韓国
その他のアジア太平洋地域
・LAMEA
ラテンアメリカ
中東
アフリカ

〈主要市場プレイヤー〉
Broadcom Inc.
QUALCOMM Incorporated
Samsung Electronics Co Ltd
SK Hynix Inc.
Taiwan Semiconductors
Texas Instruments Inc.
株式会社東芝
Maxim Integrated Products Inc.
Micron Technology Inc.
NVIDIA Corporation
NXP Semiconductors
Analog Devices Inc.
Advanced Micro Devices, Inc.
Infineon Technologies
MediaTek Inc
STMicroelectronics
Intel Corporation

❖ レポートの目次 ❖

CHAPTER 1:INTRODUCTION
1.1.Report description
1.2.Key market segments
1.3.Key benefits to the stakeholders
1.4.Research Methodology
1.4.1.Secondary research
1.4.2.Primary research
1.4.3.Analyst tools and models
CHAPTER 2:EXECUTIVE SUMMARY
2.1.Key findings of the study
2.2.CXO Perspective
CHAPTER 3:MARKET OVERVIEW
3.1.Market definition and scope
3.2.Key findings
3.2.1.Top investment pockets
3.3.Porter’s five forces analysis
3.4.Top player positioning
3.5.Market dynamics
3.5.1.Drivers
3.5.2.Restraints
3.5.3.Opportunities
3.6.COVID-19 Impact Analysis on the market
CHAPTER 4: SEMICONDUCTOR MARKET, BY COMPONENT
4.1 Overview
4.1.1 Market size and forecast
4.2 Memory Devices
4.2.1 Key market trends, growth factors and opportunities
4.2.2 Market size and forecast, by region
4.2.3 Market share analysis by country
4.3 Logic Devices
4.3.1 Key market trends, growth factors and opportunities
4.3.2 Market size and forecast, by region
4.3.3 Market share analysis by country
4.4 Analog IC
4.4.1 Key market trends, growth factors and opportunities
4.4.2 Market size and forecast, by region
4.4.3 Market share analysis by country
4.5 MPU
4.5.1 Key market trends, growth factors and opportunities
4.5.2 Market size and forecast, by region
4.5.3 Market share analysis by country
4.6 MCU
4.6.1 Key market trends, growth factors and opportunities
4.6.2 Market size and forecast, by region
4.6.3 Market share analysis by country
4.7 Sensors
4.7.1 Key market trends, growth factors and opportunities
4.7.2 Market size and forecast, by region
4.7.3 Market share analysis by country
4.8 Discrete Power Devices
4.8.1 Key market trends, growth factors and opportunities
4.8.2 Market size and forecast, by region
4.8.3 Market share analysis by country
4.9 Others
4.9.1 Key market trends, growth factors and opportunities
4.9.2 Market size and forecast, by region
4.9.3 Market share analysis by country
CHAPTER 5: SEMICONDUCTOR MARKET, BY NODE SIZE
5.1 Overview
5.1.1 Market size and forecast
5.2 180nm
5.2.1 Key market trends, growth factors and opportunities
5.2.2 Market size and forecast, by region
5.2.3 Market share analysis by country
5.3 130nm
5.3.1 Key market trends, growth factors and opportunities
5.3.2 Market size and forecast, by region
5.3.3 Market share analysis by country
5.4 90nm
5.4.1 Key market trends, growth factors and opportunities
5.4.2 Market size and forecast, by region
5.4.3 Market share analysis by country
5.5 65nm
5.5.1 Key market trends, growth factors and opportunities
5.5.2 Market size and forecast, by region
5.5.3 Market share analysis by country
5.6 45/40nm
5.6.1 Key market trends, growth factors and opportunities
5.6.2 Market size and forecast, by region
5.6.3 Market share analysis by country
5.7 32/28nm
5.7.1 Key market trends, growth factors and opportunities
5.7.2 Market size and forecast, by region
5.7.3 Market share analysis by country
5.8 22/20nm
5.8.1 Key market trends, growth factors and opportunities
5.8.2 Market size and forecast, by region
5.8.3 Market share analysis by country
5.9 16/14nm
5.9.1 Key market trends, growth factors and opportunities
5.9.2 Market size and forecast, by region
5.9.3 Market share analysis by country
6.0 10/7nm
6.0.1 Key market trends, growth factors and opportunities
6.0.2 Market size and forecast, by region
6.0.3 Market share analysis by country
6.1 7/5nm
6.1.1 Key market trends, growth factors and opportunities
6.1.2 Market size and forecast, by region
6.1.3 Market share analysis by country
6.2 5nm
6.2.1 Key market trends, growth factors and opportunities
6.2.2 Market size and forecast, by region
6.2.3 Market share analysis by country
CHAPTER 6: SEMICONDUCTOR MARKET, BY APPLICATION
6.1 Overview
6.1.1 Market size and forecast
6.2 Telecommunication
6.2.1 Key market trends, growth factors and opportunities
6.2.2 Market size and forecast, by region
6.2.3 Market share analysis by country
6.3 Defense and Military
6.3.1 Key market trends, growth factors and opportunities
6.3.2 Market size and forecast, by region
6.3.3 Market share analysis by country
6.4 Industrial
6.4.1 Key market trends, growth factors and opportunities
6.4.2 Market size and forecast, by region
6.4.3 Market share analysis by country
6.5 Consumer Electronics
6.5.1 Key market trends, growth factors and opportunities
6.5.2 Market size and forecast, by region
6.5.3 Market share analysis by country
6.6 Automotive
6.6.1 Key market trends, growth factors and opportunities
6.6.2 Market size and forecast, by region
6.6.3 Market share analysis by country
6.7 Others
6.7.1 Key market trends, growth factors and opportunities
6.7.2 Market size and forecast, by region
6.7.3 Market share analysis by country
CHAPTER 7: SEMICONDUCTOR MARKET, BY REGION
7.1 Overview
7.1.1 Market size and forecast
7.2 North America
7.2.1 Key trends and opportunities
7.2.2 North America Market size and forecast, by Component
7.2.3 North America Market size and forecast, by Node Size
7.2.4 North America Market size and forecast, by Application
7.2.5 North America Market size and forecast, by country
7.2.5.1 U.S.
7.2.5.1.1 Key market trends, growth factors and opportunities
7.2.5.1.2 Market size and forecast, by Component
7.2.5.1.3 Market size and forecast, by Node Size
7.2.5.1.4 Market size and forecast, by Application
7.2.5.2 Canada
7.2.5.2.1 Key market trends, growth factors and opportunities
7.2.5.2.2 Market size and forecast, by Component
7.2.5.2.3 Market size and forecast, by Node Size
7.2.5.2.4 Market size and forecast, by Application
7.2.5.3 Mexico
7.2.5.3.1 Key market trends, growth factors and opportunities
7.2.5.3.2 Market size and forecast, by Component
7.2.5.3.3 Market size and forecast, by Node Size
7.2.5.3.4 Market size and forecast, by Application
7.3 Europe
7.3.1 Key trends and opportunities
7.3.2 Europe Market size and forecast, by Component
7.3.3 Europe Market size and forecast, by Node Size
7.3.4 Europe Market size and forecast, by Application
7.3.5 Europe Market size and forecast, by country
7.3.5.1 France
7.3.5.1.1 Key market trends, growth factors and opportunities
7.3.5.1.2 Market size and forecast, by Component
7.3.5.1.3 Market size and forecast, by Node Size
7.3.5.1.4 Market size and forecast, by Application
7.3.5.2 Germany
7.3.5.2.1 Key market trends, growth factors and opportunities
7.3.5.2.2 Market size and forecast, by Component
7.3.5.2.3 Market size and forecast, by Node Size
7.3.5.2.4 Market size and forecast, by Application
7.3.5.3 UK
7.3.5.3.1 Key market trends, growth factors and opportunities
7.3.5.3.2 Market size and forecast, by Component
7.3.5.3.3 Market size and forecast, by Node Size
7.3.5.3.4 Market size and forecast, by Application
7.3.5.4 Rest of Europe
7.3.5.4.1 Key market trends, growth factors and opportunities
7.3.5.4.2 Market size and forecast, by Component
7.3.5.4.3 Market size and forecast, by Node Size
7.3.5.4.4 Market size and forecast, by Application
7.4 Asia-Pacific
7.4.1 Key trends and opportunities
7.4.2 Asia-Pacific Market size and forecast, by Component
7.4.3 Asia-Pacific Market size and forecast, by Node Size
7.4.4 Asia-Pacific Market size and forecast, by Application
7.4.5 Asia-Pacific Market size and forecast, by country
7.4.5.1 China
7.4.5.1.1 Key market trends, growth factors and opportunities
7.4.5.1.2 Market size and forecast, by Component
7.4.5.1.3 Market size and forecast, by Node Size
7.4.5.1.4 Market size and forecast, by Application
7.4.5.2 Japan
7.4.5.2.1 Key market trends, growth factors and opportunities
7.4.5.2.2 Market size and forecast, by Component
7.4.5.2.3 Market size and forecast, by Node Size
7.4.5.2.4 Market size and forecast, by Application
7.4.5.3 India
7.4.5.3.1 Key market trends, growth factors and opportunities
7.4.5.3.2 Market size and forecast, by Component
7.4.5.3.3 Market size and forecast, by Node Size
7.4.5.3.4 Market size and forecast, by Application
7.4.5.4 South Korea
7.4.5.4.1 Key market trends, growth factors and opportunities
7.4.5.4.2 Market size and forecast, by Component
7.4.5.4.3 Market size and forecast, by Node Size
7.4.5.4.4 Market size and forecast, by Application
7.4.5.5 Rest of Asia-Pacific
7.4.5.5.1 Key market trends, growth factors and opportunities
7.4.5.5.2 Market size and forecast, by Component
7.4.5.5.3 Market size and forecast, by Node Size
7.4.5.5.4 Market size and forecast, by Application
7.5 LAMEA
7.5.1 Key trends and opportunities
7.5.2 LAMEA Market size and forecast, by Component
7.5.3 LAMEA Market size and forecast, by Node Size
7.5.4 LAMEA Market size and forecast, by Application
7.5.5 LAMEA Market size and forecast, by country
7.5.5.1 Latin America
7.5.5.1.1 Key market trends, growth factors and opportunities
7.5.5.1.2 Market size and forecast, by Component
7.5.5.1.3 Market size and forecast, by Node Size
7.5.5.1.4 Market size and forecast, by Application
7.5.5.2 Middle East
7.5.5.2.1 Key market trends, growth factors and opportunities
7.5.5.2.2 Market size and forecast, by Component
7.5.5.2.3 Market size and forecast, by Node Size
7.5.5.2.4 Market size and forecast, by Application
7.5.5.3 Africa
7.5.5.3.1 Key market trends, growth factors and opportunities
7.5.5.3.2 Market size and forecast, by Component
7.5.5.3.3 Market size and forecast, by Node Size
7.5.5.3.4 Market size and forecast, by Application
CHAPTER 8: COMPANY LANDSCAPE
8.1. Introduction
8.2. Top winning strategies
8.3. Product Mapping of Top 10 Player
8.4. Competitive Dashboard
8.5. Competitive Heatmap
8.6. Key developments
CHAPTER 9: COMPANY PROFILES
9.1 Broadcom Inc.
9.1.1 Company overview
9.1.2 Company snapshot
9.1.3 Operating business segments
9.1.4 Product portfolio
9.1.5 Business performance
9.1.6 Key strategic moves and developments
9.2 QUALCOMM Incorporated
9.2.1 Company overview
9.2.2 Company snapshot
9.2.3 Operating business segments
9.2.4 Product portfolio
9.2.5 Business performance
9.2.6 Key strategic moves and developments
9.3 Samsung Electronics Co Ltd
9.3.1 Company overview
9.3.2 Company snapshot
9.3.3 Operating business segments
9.3.4 Product portfolio
9.3.5 Business performance
9.3.6 Key strategic moves and developments
9.4 SK Hynix Inc.
9.4.1 Company overview
9.4.2 Company snapshot
9.4.3 Operating business segments
9.4.4 Product portfolio
9.4.5 Business performance
9.4.6 Key strategic moves and developments
9.5 Taiwan Semiconductors
9.5.1 Company overview
9.5.2 Company snapshot
9.5.3 Operating business segments
9.5.4 Product portfolio
9.5.5 Business performance
9.5.6 Key strategic moves and developments
9.6 Texas Instruments Inc.
9.6.1 Company overview
9.6.2 Company snapshot
9.6.3 Operating business segments
9.6.4 Product portfolio
9.6.5 Business performance
9.6.6 Key strategic moves and developments
9.7 TOSHIBA Corporation
9.7.1 Company overview
9.7.2 Company snapshot
9.7.3 Operating business segments
9.7.4 Product portfolio
9.7.5 Business performance
9.7.6 Key strategic moves and developments
9.8 Maxim Integrated Products Inc.
9.8.1 Company overview
9.8.2 Company snapshot
9.8.3 Operating business segments
9.8.4 Product portfolio
9.8.5 Business performance
9.8.6 Key strategic moves and developments
9.9 Micron Technology Inc.
9.9.1 Company overview
9.9.2 Company snapshot
9.9.3 Operating business segments
9.9.4 Product portfolio
9.9.5 Business performance
9.9.6 Key strategic moves and developments
9.10 NVIDIA Corporation
9.10.1 Company overview
9.10.2 Company snapshot
9.10.3 Operating business segments
9.10.4 Product portfolio
9.10.5 Business performance
9.10.6 Key strategic moves and developments
9.11 NXP Semiconductors
9.11.1 Company overview
9.11.2 Company snapshot
9.11.3 Operating business segments
9.11.4 Product portfolio
9.11.5 Business performance
9.11.6 Key strategic moves and developments
9.12 Analog Devices Inc.
9.12.1 Company overview
9.12.2 Company snapshot
9.12.3 Operating business segments
9.12.4 Product portfolio
9.12.5 Business performance
9.12.6 Key strategic moves and developments
9.13 Advanced Micro Devices, Inc.
9.13.1 Company overview
9.13.2 Company snapshot
9.13.3 Operating business segments
9.13.4 Product portfolio
9.13.5 Business performance
9.13.6 Key strategic moves and developments
9.14 Infineon Technologies
9.14.1 Company overview
9.14.2 Company snapshot
9.14.3 Operating business segments
9.14.4 Product portfolio
9.14.5 Business performance
9.14.6 Key strategic moves and developments
9.15 MediaTek Inc
9.15.1 Company overview
9.15.2 Company snapshot
9.15.3 Operating business segments
9.15.4 Product portfolio
9.15.5 Business performance
9.15.6 Key strategic moves and developments
9.16 STMicroelectronics
9.16.1 Company overview
9.16.2 Company snapshot
9.16.3 Operating business segments
9.16.4 Product portfolio
9.16.5 Business performance
9.16.6 Key strategic moves and developments
9.17 Intel Corporation
9.17.1 Company overview
9.17.2 Company snapshot
9.17.3 Operating business segments
9.17.4 Product portfolio
9.17.5 Business performance
9.17.6 Key strategic moves and developments



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