カテゴリー： IMARC, IT/電子, 世界

半導体ファウンドリーの世界市場2023-2028：産業動向、シェア、規模、成長、機会・予測

◆英語タイトル：Semiconductor Foundry Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028

IMARCが発行した調査報告書（IMARC23FE0117）◆商品コード：IMARC23FE0117
◆発行会社（リサーチ会社）：IMARC
◆発行日：2023年2月1日
◆ページ数：144
◆レポート形式：英語 / PDF
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❖ レポートの概要 ❖

IMARC社の本調査資料によると、世界の半導体ファウンドリー市場規模が2022年を基準に778億ドルに達しています。今後、2028年には1,129億ドルになり、2023年から2028年の間に6.2％の成長率を示すと見込まれます。本資料では、半導体ファウンドリーの世界市場を調査し、序論、範囲・手法、エグゼクティブサマリー、イントロダクション、テクノロジーノード別（10/7/5nm、16/14nm、20nm、45/40nm、その他）分析、ファウンドリー別（ピュアプレイファウンドリー、IDM）分析、用途別（通信、家電、コンピューター、自動車、その他）分析、地域別（北米、アジア太平洋、ヨーロッパ、中南米、中東・アフリカ）分析、SWOT分析、バリューチェーン分析、ファイブフォース分析、価格分析、競争状況など、以下のように掲載しています。また、企業情報として、Advanced Circuits Inc., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Becker & Müller Circuit Printing GmbH, Jabil Inc., Murrietta Circuits, Nippon Mektron Ltd. (NOK Corporation), Sumitomo Corporation, TTM Technologies Inc., Unimicron Technology Corporation (United Microelectronics Corporation), Würth Elektronik GmbH & Co. KG (Würth Group) and Zhen Ding Technology Holding Limited.などが含まれています。
・序論
・範囲・手法
・エグゼクティブサマリー
・イントロダクション
・世界の半導体ファウンドリー市場規模：テクノロジーノード別
- 10/7/5nmにおける市場規模
- 16/14nmにおける市場規模
- 20nmにおける市場規模
- 45/40nmにおける市場規模
- その他テクノロジーノードにおける市場規模
・世界の半導体ファウンドリー市場規模：ファウンドリー別
- ピュアプレイファウンドリーにおける市場規模
- IDMにおける市場規模
・世界の半導体ファウンドリー市場規模：用途別
- 通信における市場規模
- 家電における市場規模
- コンピューターにおける市場規模
- 自動車における市場規模
- その他用途における市場規模
・世界の半導体ファウンドリー市場規模：地域別
- 北米の半導体ファウンドリー市場規模
- アジア太平洋の半導体ファウンドリー市場規模
- ヨーロッパの半導体ファウンドリー市場規模
- 中南米の半導体ファウンドリー市場規模
- 中東・アフリカの半導体ファウンドリー市場規模
・SWOT分析
・バリューチェーン分析
・ファイブフォース分析
・価格分析
・競争状況

The global semiconductor foundry market size reached US$ 77.8 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 112.9 Billion by 2028, exhibiting a growth rate (CAGR) of 6.2% during 2023-2028.

A semiconductor foundry, also known as a fab and fabrication plant, refers to a factory wherein devices like integrated circuits (ICs) are manufactured using photolithography. The process involves photographing the circuit pattern on a photosensitive substrate and chemically etching the background. ICs are produced in different technological nodes like 7nm, 10nm, 20nm, etc., which cater to multiple applications. Semiconductor foundries comprise a clean room with a regulated environment for eliminating dust and vibrations, as well as keeping the humidity and temperature within a controlled range. First developed in the late 1980s, they generally include integrated device manufacturers (IDMs) that focus mainly on manufacturing.

The growing demand for ICs for use in automobiles, consumer electronics, medical devices, military equipment and smart home appliances is one of the major factors driving the market growth. Also, the rising penetration for the Internet of Things (IoT)-enabled devices across the globe is positively influencing the demand for ICs. IoT devices make decisions by processing information and help users in connecting various devices to the internet. As a result, they are employed in multiple industries, including retail, medical, automotive and electronics. Furthermore, support from governments of numerous countries for the development of semiconductor technology is spurring the growth of the market. For instance, the New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES) and Cree, Inc., a leader in silicon carbide (SiC) technology, announced their partnership on September 23, 2019 for developing the world’s first 200mm SiC wafer fabrication facility in Marcy, near Utica. The company will invest US$ 1 Billion in this project, with a US$ 500 million grant from Empire State Development, the umbrella organization for New York state’s economic development.

Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global semiconductor foundry market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on technology node, foundry type and application.

Breakup by Technology Node:

10/7/5nm
16/14nm
20nm
45/40nm
Others

Breakup by Foundry Type:

Pure Play Foundry
IDMs

Breakup by Application:

Communication
Consumer Electronics
Computer
Automotive
Others

Breakup by Region:

North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa

Competitive Landscape:
The competitive landscape of the industry has also been examined with some of the key players being TSMC, DB HiTek, Fujitsu Semiconductor, GlobalFoundries, Magnachip, Powerchip, Samsung Group, Semiconductor Manufacturing International Corporation, STMicroelectronics, Tower Semiconductor Ltd., United Microelectronics Corporation, X-Fab, etc.

Key Questions Answered in This Report
1. What was the size of the global semiconductor foundry market in 2022?
2. What is the expected growth rate of the global semiconductor foundry market during 2023-2028?
3. What are the key factors driving the global semiconductor foundry market?
4. What has been the impact of COVID-19 on the global semiconductor foundry market?
5. What is the breakup of the global semiconductor foundry market based on the technology node?
6. What is the breakup of the global semiconductor foundry market based on the foundry type?
7. What is the breakup of the global semiconductor foundry market based on the application?
8. What are the key regions in the global semiconductor foundry market?
9. Who are the key players/companies in the global semiconductor foundry market?

❖ レポートの目次 ❖

1 Preface
2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
4.1 Overview
4.2 Key Industry Trends
5 Global Semiconductor Foundry Market
5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast
6 Market Breakup by Technology Node
6.1 10/7/5nm
6.1.1 Market Trends
6.1.2 Market Forecast
6.2 16/14nm
6.2.1 Market Trends
6.2.2 Market Forecast
6.3 20nm
6.3.1 Market Trends
6.3.2 Market Forecast
6.4 45/40nm
6.4.1 Market Trends
6.4.2 Market Forecast
6.5 Others
6.5.1 Market Trends
6.5.2 Market Forecast
7 Market Breakup by Foundry Type
7.1 Pure Play Foundry
7.1.1 Market Trends
7.1.2 Market Forecast
7.2 IDMs
7.2.1 Market Trends
7.2.2 Market Forecast
8 Market Breakup by Application
8.1 Communication
8.1.1 Market Trends
8.1.2 Market Forecast
8.2 Consumer Electronics
8.2.1 Market Trends
8.2.2 Market Forecast
8.3 Computer
8.3.1 Market Trends
8.3.2 Market Forecast
8.4 Automotive
8.4.1 Market Trends
8.4.2 Market Forecast
8.5 Others
8.5.1 Market Trends
8.5.2 Market Forecast
9 Market Breakup by Region
9.1 North America
9.1.1 United States
9.1.1.1 Market Trends
9.1.1.2 Market Forecast
9.1.2 Canada
9.1.2.1 Market Trends
9.1.2.2 Market Forecast
9.2 Asia Pacific
9.2.1 China
9.2.1.1 Market Trends
9.2.1.2 Market Forecast
9.2.2 Japan
9.2.2.1 Market Trends
9.2.2.2 Market Forecast
9.2.3 India
9.2.3.1 Market Trends
9.2.3.2 Market Forecast
9.2.4 South Korea
9.2.4.1 Market Trends
9.2.4.2 Market Forecast
9.2.5 Australia
9.2.5.1 Market Trends
9.2.5.2 Market Forecast
9.2.6 Indonesia
9.2.6.1 Market Trends
9.2.6.2 Market Forecast
9.2.7 Others
9.2.7.1 Market Trends
9.2.7.2 Market Forecast
9.3 Europe
9.3.1 Germany
9.3.1.1 Market Trends
9.3.1.2 Market Forecast
9.3.2 France
9.3.2.1 Market Trends
9.3.2.2 Market Forecast
9.3.3 United Kingdom
9.3.3.1 Market Trends
9.3.3.2 Market Forecast
9.3.4 Italy
9.3.4.1 Market Trends
9.3.4.2 Market Forecast
9.3.5 Spain
9.3.5.1 Market Trends
9.3.5.2 Market Forecast
9.3.6 Russia
9.3.6.1 Market Trends
9.3.6.2 Market Forecast
9.3.7 Others
9.3.7.1 Market Trends
9.3.7.2 Market Forecast
9.4 Latin America
9.4.1 Brazil
9.4.1.1 Market Trends
9.4.1.2 Market Forecast
9.4.2 Mexico
9.4.2.1 Market Trends
9.4.2.2 Market Forecast
9.4.3 Others
9.4.3.1 Market Trends
9.4.3.2 Market Forecast
9.5 Middle East and Africa
9.5.1 Market Trends
9.5.2 Market Breakup by Country
9.5.3 Market Forecast
10 SWOT Analysis
10.1 Overview
10.2 Strengths
10.3 Weaknesses
10.4 Opportunities
10.5 Threats
11 Value Chain Analysis
12 Porters Five Forces Analysis
12.1 Overview
12.2 Bargaining Power of Buyers
12.3 Bargaining Power of Suppliers
12.4 Degree of Competition
12.5 Threat of New Entrants
12.6 Threat of Substitutes
13 Competitive Landscape
13.1 Market Structure
13.2 Key Players
13.3 Profiles of Key Players
13.3.1 TSMC
13.3.1.1 Company Overview
13.3.1.2 Product Portfolio
13.3.2 DB HiTek
13.3.2.1 Company Overview
13.3.2.2 Product Portfolio
13.3.2.3 Financials
13.3.3 Fujitsu Semiconductor Limited
13.3.3.1 Company Overview
13.3.3.2 Product Portfolio
13.3.3.3 Financials
13.3.3.4 SWOT Analysis
13.3.4 GlobalFoundries
13.3.4.1 Company Overview
13.3.4.2 Product Portfolio
13.3.5 Magnachip
13.3.5.1 Company Overview
13.3.5.2 Product Portfolio
13.3.6 Powerchip
13.3.6.1 Company Overview
13.3.6.2 Product Portfolio
13.3.7 Samsung Group
13.3.7.1 Company Overview
13.3.7.2 Product Portfolio
13.3.7.3 Financials
13.3.7.4 SWOT Analysis
13.3.8 Semiconductor Manufacturing International Corporation
13.3.8.1 Company Overview
13.3.8.2 Product Portfolio
13.3.8.3 Financials
13.3.9 STMicroelectronics
13.3.9.1 Company Overview
13.3.9.2 Product Portfolio
13.3.9.3 Financials
13.3.9.4 SWOT Analysis
13.3.10 Tower Semiconductor Ltd.
13.3.10.1 Company Overview
13.3.10.2 Product Portfolio
13.3.10.3 Financials
13.3.11 United Microelectronics Corporation
13.3.11.1 Company Overview
13.3.11.2 Product Portfolio
13.3.11.3 Financials
13.3.11.4 SWOT Analysis
13.3.12 X-Fab
13.3.12.1 Company Overview
13.3.12.2 Product Portfolio



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