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ウェーハ処理及び組立装置の世界市場2022：化学機械研磨（CMP）装置、エッチング装置、薄膜成膜装置、フォトレジスト加工装置、組立装置

◆英語タイトル：Global Wafer Processing and Assembly Equipment Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028
	◆商品コード：GIR22NO16359 ◆発行会社（リサーチ会社）：GlobalInfoResearch ◆発行日：2022年11月（※2025年版があります。お問い合わせください。） ◆ページ数：104 ◆レポート形式：英語 / PDF ◆納品方法：Eメール（注文後2-3日） ◆調査対象地域：グローバル ◆産業分野：産業機器

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❖ レポートの概要 ❖

ウェーハ処理及び組立装置市場レポートは、世界の市場規模、地域および国レベルの市場規模、セグメント市場の成長性、市場シェア、競争環境、販売分析、国内および世界の市場プレーヤーの影響、バリューチェーンの最適化、最近の動向、機会分析、市場成長の戦略的な分析、製品発売、地域市場の拡大などに関する情報を提供します。
GlobalInfoResearchの最新の調査によると、世界のウェーハ処理及び組立装置の市場規模は2021年のxxx米ドルから2028年にはxxx米ドルと推定され、xxx％の成長率で成長すると予想されます。

ウェーハ処理及び組立装置市場は種類と用途によって区分されます。2017年～2028年において、量と金額の観点から種類別および用途別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。

種類別セグメントは次をカバーします。
・化学機械研磨（CMP）装置、エッチング装置、薄膜成膜装置、フォトレジスト加工装置、組立装置

用途別セグメントは次のように区分されます。
・OEM、アフターマーケット

世界のウェーハ処理及び組立装置市場の主要な市場プレーヤーは以下のとおりです。
・Applied Materials、ASML、Tokyo Electron、Lam Research、KLA、Hitachi High-Technologies、Disco、ASM Pacific Technology、Kulicke and Soffa Industries、BE Semiconductor、Towa

地域別セグメントは次の地域・国をカバーします。
・北米（米国、カナダ、メキシコ）
・ヨーロッパ（ドイツ、フランス、イギリス、ロシア、イタリア）
・アジア太平洋（日本、中国、韓国、インド、東南アジア、オーストラリア）
・南アメリカ（ブラジル、アルゼンチン、コロンビア）
・中東およびアフリカ（サウジアラビア、UAE、エジプト、南アフリカ）

本調査レポートの内容は計15章あります。
・第1章では、ウェーハ処理及び組立装置製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。
・第2章では、主要なウェーハ処理及び組立装置メーカーの企業概要、2019年～2022年までのウェーハ処理及び組立装置の価格、販売量、売上、市場シェアを掲載しています。
・第3章では、主要なウェーハ処理及び組立装置メーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。
・第4章では、2017年～2028年までの地域別ウェーハ処理及び組立装置の販売量、売上、成長性を示しています。
・第5、6章では、2017年～2028年までのウェーハ処理及び組立装置の種類別と用途別の市場規模、市場シェアと成長率を掲載しています。
・第7、8、9、10、11章では、2017年～2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年～2028年までの主要地域でのウェーハ処理及び組立装置市場予測を収録しています。
・第12章では、主要な原材料、主要なサプライヤー、およびウェーハ処理及び組立装置の産業チェーンを掲載しています。
・第13、14、15章では、ウェーハ処理及び組立装置の販売チャネル、販売業者、顧客、調査結果と結論、付録、データソースなどについて説明します。

***** 目次(一部) *****

・市場概要
- ウェーハ処理及び組立装置の概要
- 種類別分析（2017年vs2021年vs2028年）：化学機械研磨（CMP）装置、エッチング装置、薄膜成膜装置、フォトレジスト加工装置、組立装置
- 用途別分析（2017年vs2021年vs2028年）：OEM、アフターマーケット
- 世界のウェーハ処理及び組立装置市場規模・予測
- 世界のウェーハ処理及び組立装置生産能力分析
- 市場の成長要因・阻害要因・動向
・メーカー情報（企業概要、製品概要、販売量、価格、売上）
- Applied Materials、ASML、Tokyo Electron、Lam Research、KLA、Hitachi High-Technologies、Disco、ASM Pacific Technology、Kulicke and Soffa Industries、BE Semiconductor、Towa
・メーカー別市場シェア・市場集中度
・地域別市場分析2017年-2028年
・種類別分析2017年-2028年：化学機械研磨（CMP）装置、エッチング装置、薄膜成膜装置、フォトレジスト加工装置、組立装置
・用途別分析2017年-2028年：OEM、アフターマーケット
・ウェーハ処理及び組立装置の北米市場
- 種類別市場規模2017年-2028年
- 用途別市場規模2017年-2028年
- 主要国別市場規模：アメリカ、カナダ、メキシコなど
・ウェーハ処理及び組立装置のヨーロッパ市場
- 種類別市場規模2017年-2028年
- 用途別市場規模2017年-2028年
- 主要国別市場規模：ドイツ、イギリス、フランス、ロシア、イタリアなど
・ウェーハ処理及び組立装置のアジア市場
- 種類別市場規模2017年-2028年
- 用途別市場規模2017年-2028年
- 主要国別市場規模：中国、日本、韓国、インド、東南アジア、オーストラリアなど
・ウェーハ処理及び組立装置の南米市場
- 種類別市場規模2017年-2028年
- 用途別市場規模2017年-2028年
- 主要国別市場規模：ブラジル、アルゼンチンなど
・ウェーハ処理及び組立装置の中東・アフリカ市場
- 種類別市場規模2017年-2028年
- 用途別市場規模2017年-2028年
- 主要国別市場規模：サウジアラビア、トルコ、エジプト、南アフリカなど
・原材料および産業チェーン
・販売チャネル、流通業者・代理店、顧客リスト
・調査の結果・結論

The Wafer Processing and Assembly Equipment market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.
According to our (Global Info Research) latest study, due to COVID-19 pandemic, the global Wafer Processing and Assembly Equipment market size is estimated to be worth US$ million in 2021 and is forecast to a readjusted size of USD million by 2028 with a CAGR of % during forecast period 2022-2028. OEM accounting for % of the Wafer Processing and Assembly Equipment global market in 2021, is projected to value USD million by 2028, growing at a % CAGR in next six years. While Chemical Mechanical Polishing (CMP) Equipment segment is altered to a % CAGR between 2022 and 2028.
Global key manufacturers of Wafer Processing and Assembly Equipment include Applied Materials, ASML, Tokyo Electron, Lam Research, and KLA, etc. In terms of revenue, the global top four players hold a share over % in 2021.
Market segmentation
Wafer Processing and Assembly Equipment market is split by Type and by Application. For the period 2017-2028, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type, covers
Chemical Mechanical Polishing (CMP) Equipment
Etching Equipment
Thin Film Deposition Equipment
Photoresist Processing Equipment
Assembly Equipment
Market segment by Application can be divided into
OEM
Aftermarket
The key market players for global Wafer Processing and Assembly Equipment market are listed below:
Applied Materials
ASML
Tokyo Electron
Lam Research
KLA
Hitachi High-Technologies
Disco
ASM Pacific Technology
Kulicke and Soffa Industries
BE Semiconductor
Towa
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Processing and Assembly Equipment product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Wafer Processing and Assembly Equipment, with price, sales, revenue and global market share of Wafer Processing and Assembly Equipment from 2019 to 2022.
Chapter 3, the Wafer Processing and Assembly Equipment competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Processing and Assembly Equipment breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2017 to 2028.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2017 to 2028.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2017 to 2022.and Wafer Processing and Assembly Equipment market forecast, by regions, type and application, with sales and revenue, from 2023 to 2028.
Chapter 12, the key raw materials and key suppliers, and industry chain of Wafer Processing and Assembly Equipment.
Chapter 13, 14, and 15, to describe Wafer Processing and Assembly Equipment sales channel, distributors, customers, research findings and conclusion, appendix and data source.

❖ レポートの目次 ❖

1 Market Overview
1.1 Wafer Processing and Assembly Equipment Introduction
1.2 Market Analysis by Type
1.2.1 Overview: Global Wafer Processing and Assembly Equipment Revenue by Type: 2017 Versus 2021 Versus 2028
1.2.2 Chemical Mechanical Polishing (CMP) Equipment
1.2.3 Etching Equipment
1.2.4 Thin Film Deposition Equipment
1.2.5 Photoresist Processing Equipment
1.2.6 Assembly Equipment
1.3 Market Analysis by Application
1.3.1 Overview: Global Wafer Processing and Assembly Equipment Revenue by Application: 2017 Versus 2021 Versus 2028
1.3.2 OEM
1.3.3 Aftermarket
1.4 Global Wafer Processing and Assembly Equipment Market Size & Forecast
1.4.1 Global Wafer Processing and Assembly Equipment Sales in Value (2017 & 2021 & 2028)
1.4.2 Global Wafer Processing and Assembly Equipment Sales in Volume (2017-2028)
1.4.3 Global Wafer Processing and Assembly Equipment Price (2017-2028)
1.5 Global Wafer Processing and Assembly Equipment Production Capacity Analysis
1.5.1 Global Wafer Processing and Assembly Equipment Total Production Capacity (2017-2028)
1.5.2 Global Wafer Processing and Assembly Equipment Production Capacity by Geographic Region
1.6 Market Drivers, Restraints and Trends
1.6.1 Wafer Processing and Assembly Equipment Market Drivers
1.6.2 Wafer Processing and Assembly Equipment Market Restraints
1.6.3 Wafer Processing and Assembly Equipment Trends Analysis
2 Manufacturers Profiles
2.1 Applied Materials
2.1.1 Applied Materials Details
2.1.2 Applied Materials Major Business
2.1.3 Applied Materials Wafer Processing and Assembly Equipment Product and Services
2.1.4 Applied Materials Wafer Processing and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.2 ASML
2.2.1 ASML Details
2.2.2 ASML Major Business
2.2.3 ASML Wafer Processing and Assembly Equipment Product and Services
2.2.4 ASML Wafer Processing and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.3 Tokyo Electron
2.3.1 Tokyo Electron Details
2.3.2 Tokyo Electron Major Business
2.3.3 Tokyo Electron Wafer Processing and Assembly Equipment Product and Services
2.3.4 Tokyo Electron Wafer Processing and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.4 Lam Research
2.4.1 Lam Research Details
2.4.2 Lam Research Major Business
2.4.3 Lam Research Wafer Processing and Assembly Equipment Product and Services
2.4.4 Lam Research Wafer Processing and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.5 KLA
2.5.1 KLA Details
2.5.2 KLA Major Business
2.5.3 KLA Wafer Processing and Assembly Equipment Product and Services
2.5.4 KLA Wafer Processing and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.6 Hitachi High-Technologies
2.6.1 Hitachi High-Technologies Details
2.6.2 Hitachi High-Technologies Major Business
2.6.3 Hitachi High-Technologies Wafer Processing and Assembly Equipment Product and Services
2.6.4 Hitachi High-Technologies Wafer Processing and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.7 Disco
2.7.1 Disco Details
2.7.2 Disco Major Business
2.7.3 Disco Wafer Processing and Assembly Equipment Product and Services
2.7.4 Disco Wafer Processing and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.8 ASM Pacific Technology
2.8.1 ASM Pacific Technology Details
2.8.2 ASM Pacific Technology Major Business
2.8.3 ASM Pacific Technology Wafer Processing and Assembly Equipment Product and Services
2.8.4 ASM Pacific Technology Wafer Processing and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.9 Kulicke and Soffa Industries
2.9.1 Kulicke and Soffa Industries Details
2.9.2 Kulicke and Soffa Industries Major Business
2.9.3 Kulicke and Soffa Industries Wafer Processing and Assembly Equipment Product and Services
2.9.4 Kulicke and Soffa Industries Wafer Processing and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.10 BE Semiconductor
2.10.1 BE Semiconductor Details
2.10.2 BE Semiconductor Major Business
2.10.3 BE Semiconductor Wafer Processing and Assembly Equipment Product and Services
2.10.4 BE Semiconductor Wafer Processing and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.11 Towa
2.11.1 Towa Details
2.11.2 Towa Major Business
2.11.3 Towa Wafer Processing and Assembly Equipment Product and Services
2.11.4 Towa Wafer Processing and Assembly Equipment Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
3 Wafer Processing and Assembly Equipment Breakdown Data by Manufacturer
3.1 Global Wafer Processing and Assembly Equipment Sales in Volume by Manufacturer (2019, 2020, 2021, and 2022)
3.2 Global Wafer Processing and Assembly Equipment Revenue by Manufacturer (2019, 2020, 2021, and 2022)
3.3 Key Manufacturer Market Position in Wafer Processing and Assembly Equipment
3.4 Market Concentration Rate
3.4.1 Top 3 Wafer Processing and Assembly Equipment Manufacturer Market Share in 2021
3.4.2 Top 6 Wafer Processing and Assembly Equipment Manufacturer Market Share in 2021
3.5 Global Wafer Processing and Assembly Equipment Production Capacity by Company: 2021 VS 2022
3.6 Manufacturer by Geography: Head Office and Wafer Processing and Assembly Equipment Production Site
3.7 New Entrant and Capacity Expansion Plans
3.8 Mergers & Acquisitions
4 Market Analysis by Region
4.1 Global Wafer Processing and Assembly Equipment Market Size by Region
4.1.1 Global Wafer Processing and Assembly Equipment Sales in Volume by Region (2017-2028)
4.1.2 Global Wafer Processing and Assembly Equipment Revenue by Region (2017-2028)
4.2 North America Wafer Processing and Assembly Equipment Revenue (2017-2028)
4.3 Europe Wafer Processing and Assembly Equipment Revenue (2017-2028)
4.4 Asia-Pacific Wafer Processing and Assembly Equipment Revenue (2017-2028)
4.5 South America Wafer Processing and Assembly Equipment Revenue (2017-2028)
4.6 Middle East and Africa Wafer Processing and Assembly Equipment Revenue (2017-2028)
5 Market Segment by Type
5.1 Global Wafer Processing and Assembly Equipment Sales in Volume by Type (2017-2028)
5.2 Global Wafer Processing and Assembly Equipment Revenue by Type (2017-2028)
5.3 Global Wafer Processing and Assembly Equipment Price by Type (2017-2028)
6 Market Segment by Application
6.1 Global Wafer Processing and Assembly Equipment Sales in Volume by Application (2017-2028)
6.2 Global Wafer Processing and Assembly Equipment Revenue by Application (2017-2028)
6.3 Global Wafer Processing and Assembly Equipment Price by Application (2017-2028)
7 North America by Country, by Type, and by Application
7.1 North America Wafer Processing and Assembly Equipment Sales by Type (2017-2028)
7.2 North America Wafer Processing and Assembly Equipment Sales by Application (2017-2028)
7.3 North America Wafer Processing and Assembly Equipment Market Size by Country
7.3.1 North America Wafer Processing and Assembly Equipment Sales in Volume by Country (2017-2028)
7.3.2 North America Wafer Processing and Assembly Equipment Revenue by Country (2017-2028)
7.3.3 United States Market Size and Forecast (2017-2028)
7.3.4 Canada Market Size and Forecast (2017-2028)
7.3.5 Mexico Market Size and Forecast (2017-2028)
8 Europe by Country, by Type, and by Application
8.1 Europe Wafer Processing and Assembly Equipment Sales by Type (2017-2028)
8.2 Europe Wafer Processing and Assembly Equipment Sales by Application (2017-2028)
8.3 Europe Wafer Processing and Assembly Equipment Market Size by Country
8.3.1 Europe Wafer Processing and Assembly Equipment Sales in Volume by Country (2017-2028)
8.3.2 Europe Wafer Processing and Assembly Equipment Revenue by Country (2017-2028)
8.3.3 Germany Market Size and Forecast (2017-2028)
8.3.4 France Market Size and Forecast (2017-2028)
8.3.5 United Kingdom Market Size and Forecast (2017-2028)
8.3.6 Russia Market Size and Forecast (2017-2028)
8.3.7 Italy Market Size and Forecast (2017-2028)
9 Asia-Pacific by Region, by Type, and by Application
9.1 Asia-Pacific Wafer Processing and Assembly Equipment Sales by Type (2017-2028)
9.2 Asia-Pacific Wafer Processing and Assembly Equipment Sales by Application (2017-2028)
9.3 Asia-Pacific Wafer Processing and Assembly Equipment Market Size by Region
9.3.1 Asia-Pacific Wafer Processing and Assembly Equipment Sales in Volume by Region (2017-2028)
9.3.2 Asia-Pacific Wafer Processing and Assembly Equipment Revenue by Region (2017-2028)
9.3.3 China Market Size and Forecast (2017-2028)
9.3.4 Japan Market Size and Forecast (2017-2028)
9.3.5 Korea Market Size and Forecast (2017-2028)
9.3.6 India Market Size and Forecast (2017-2028)
9.3.7 Southeast Asia Market Size and Forecast (2017-2028)
9.3.8 Australia Market Size and Forecast (2017-2028)
10 South America by Region, by Type, and by Application
10.1 South America Wafer Processing and Assembly Equipment Sales by Type (2017-2028)
10.2 South America Wafer Processing and Assembly Equipment Sales by Application (2017-2028)
10.3 South America Wafer Processing and Assembly Equipment Market Size by Country
10.3.1 South America Wafer Processing and Assembly Equipment Sales in Volume by Country (2017-2028)
10.3.2 South America Wafer Processing and Assembly Equipment Revenue by Country (2017-2028)
10.3.3 Brazil Market Size and Forecast (2017-2028)
10.3.4 Argentina Market Size and Forecast (2017-2028)
11 Middle East & Africa by Country, by Type, and by Application
11.1 Middle East & Africa Wafer Processing and Assembly Equipment Sales by Type (2017-2028)
11.2 Middle East & Africa Wafer Processing and Assembly Equipment Sales by Application (2017-2028)
11.3 Middle East & Africa Wafer Processing and Assembly Equipment Market Size by Country
11.3.1 Middle East & Africa Wafer Processing and Assembly Equipment Sales in Volume by Country (2017-2028)
11.3.2 Middle East & Africa Wafer Processing and Assembly Equipment Revenue by Country (2017-2028)
11.3.3 Turkey Market Size and Forecast (2017-2028)
11.3.4 Egypt Market Size and Forecast (2017-2028)
11.3.5 Saudi Arabia Market Size and Forecast (2017-2028)
11.3.6 South Africa Market Size and Forecast (2017-2028)
12 Raw Material and Industry Chain
12.1 Raw Material of Wafer Processing and Assembly Equipment and Key Manufacturers
12.2 Manufacturing Costs Percentage of Wafer Processing and Assembly Equipment
12.3 Wafer Processing and Assembly Equipment Production Process
12.4 Wafer Processing and Assembly Equipment Industrial Chain
13 Sales Channel, Distributors, Traders and Dealers
13.1 Sales Channel
13.1.1 Direct Marketing
13.1.2 Indirect Marketing
13.2 Wafer Processing and Assembly Equipment Typical Distributors
13.3 Wafer Processing and Assembly Equipment Typical Customers
14 Research Findings and Conclusion
15 Appendix
15.1 Methodology
15.2 Research Process and Data Source
15.3 Disclaimer

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ウェーハ処理及び組立装置の世界市場2022：化学機械研磨（CMP）装置、エッチング装置、薄膜成膜装置、フォトレジスト加工装置、組立装置

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