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半導体成形材料の世界市場2022：液体、粒状

◆英語タイトル：Global Semiconductor Molding Compounds Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028
	◆商品コード：GIR22NO5544 ◆発行会社（リサーチ会社）：GlobalInfoResearch ◆発行日：2022年11月（※2025年版があります。お問い合わせください。） ◆ページ数：116 ◆レポート形式：英語 / PDF ◆納品方法：Eメール（注文後2-3日） ◆調査対象地域：グローバル ◆産業分野：化学＆材料

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❖ レポートの概要 ❖

半導体成形材料市場レポートは、世界の市場規模、地域および国レベルの市場規模、セグメント市場の成長性、市場シェア、競争環境、販売分析、国内および世界の市場プレーヤーの影響、バリューチェーンの最適化、最近の動向、機会分析、市場成長の戦略的な分析、製品発売、地域市場の拡大などに関する情報を提供します。
GlobalInfoResearchの最新の調査によると、世界の半導体成形材料の市場規模は2021年のxxx米ドルから2028年にはxxx米ドルと推定され、xxx％の成長率で成長すると予想されます。

半導体成形材料市場は種類と用途によって区分されます。2017年～2028年において、量と金額の観点から種類別および用途別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。

種類別セグメントは次をカバーします。
・液体、粒状

用途別セグメントは次のように区分されます。
・ウエハーレベルパッケージング、フラットパネルパッケージング、その他

世界の半導体成形材料市場の主要な市場プレーヤーは以下のとおりです。
・Sumitomo Bakelite、Hitachi Chemical、Chang Chun Group、Hysol Huawei Electronics、Panasonic、Kyocera、KCC、Samsung SDI、Eternal Materials、Jiangsu zhongpeng new material、Shin-Etsu Chemical、Hexion、Nepes、Tianjin Kaihua Insulating Material、HHCK、Scienchem、Sino-tech Electronic Material

地域別セグメントは次の地域・国をカバーします。
・北米（米国、カナダ、メキシコ）
・ヨーロッパ（ドイツ、フランス、イギリス、ロシア、イタリア）
・アジア太平洋（日本、中国、韓国、インド、東南アジア、オーストラリア）
・南アメリカ（ブラジル、アルゼンチン、コロンビア）
・中東およびアフリカ（サウジアラビア、UAE、エジプト、南アフリカ）

本調査レポートの内容は計15章あります。
・第1章では、半導体成形材料製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。
・第2章では、主要な半導体成形材料メーカーの企業概要、2019年～2022年までの半導体成形材料の価格、販売量、売上、市場シェアを掲載しています。
・第3章では、主要な半導体成形材料メーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。
・第4章では、2017年～2028年までの地域別半導体成形材料の販売量、売上、成長性を示しています。
・第5、6章では、2017年～2028年までの半導体成形材料の種類別と用途別の市場規模、市場シェアと成長率を掲載しています。
・第7、8、9、10、11章では、2017年～2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年～2028年までの主要地域での半導体成形材料市場予測を収録しています。
・第12章では、主要な原材料、主要なサプライヤー、および半導体成形材料の産業チェーンを掲載しています。
・第13、14、15章では、半導体成形材料の販売チャネル、販売業者、顧客、調査結果と結論、付録、データソースなどについて説明します。

***** 目次(一部) *****

・市場概要
- 半導体成形材料の概要
- 種類別分析（2017年vs2021年vs2028年）：液体、粒状
- 用途別分析（2017年vs2021年vs2028年）：ウエハーレベルパッケージング、フラットパネルパッケージング、その他
- 世界の半導体成形材料市場規模・予測
- 世界の半導体成形材料生産能力分析
- 市場の成長要因・阻害要因・動向
・メーカー情報（企業概要、製品概要、販売量、価格、売上）
- Sumitomo Bakelite、Hitachi Chemical、Chang Chun Group、Hysol Huawei Electronics、Panasonic、Kyocera、KCC、Samsung SDI、Eternal Materials、Jiangsu zhongpeng new material、Shin-Etsu Chemical、Hexion、Nepes、Tianjin Kaihua Insulating Material、HHCK、Scienchem、Sino-tech Electronic Material
・メーカー別市場シェア・市場集中度
・地域別市場分析2017年-2028年
・種類別分析2017年-2028年：液体、粒状
・用途別分析2017年-2028年：ウエハーレベルパッケージング、フラットパネルパッケージング、その他
・半導体成形材料の北米市場
- 種類別市場規模2017年-2028年
- 用途別市場規模2017年-2028年
- 主要国別市場規模：アメリカ、カナダ、メキシコなど
・半導体成形材料のヨーロッパ市場
- 種類別市場規模2017年-2028年
- 用途別市場規模2017年-2028年
- 主要国別市場規模：ドイツ、イギリス、フランス、ロシア、イタリアなど
・半導体成形材料のアジア市場
- 種類別市場規模2017年-2028年
- 用途別市場規模2017年-2028年
- 主要国別市場規模：中国、日本、韓国、インド、東南アジア、オーストラリアなど
・半導体成形材料の南米市場
- 種類別市場規模2017年-2028年
- 用途別市場規模2017年-2028年
- 主要国別市場規模：ブラジル、アルゼンチンなど
・半導体成形材料の中東・アフリカ市場
- 種類別市場規模2017年-2028年
- 用途別市場規模2017年-2028年
- 主要国別市場規模：サウジアラビア、トルコ、エジプト、南アフリカなど
・原材料および産業チェーン
・販売チャネル、流通業者・代理店、顧客リスト
・調査の結果・結論

The Semiconductor Molding Compounds market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.
According to our (Global Info Research) latest study, due to COVID-19 pandemic, the global Semiconductor Molding Compounds market size is estimated to be worth US$ million in 2021 and is forecast to a readjusted size of USD million by 2028 with a CAGR of % during forecast period 2022-2028. Wafer Level Packaging accounting for % of the Semiconductor Molding Compounds global market in 2021, is projected to value USD million by 2028, growing at a % CAGR in next six years. While Liquid segment is altered to a % CAGR between 2022 and 2028.
Global key manufacturers of Semiconductor Molding Compounds include Sumitomo Bakelite, Hitachi Chemical, Chang Chun Group, Hysol Huawei Electronics, and Panasonic, etc. In terms of revenue, the global top four players hold a share over % in 2021.
Market segmentation
Semiconductor Molding Compounds market is split by Type and by Application. For the period 2017-2028, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type, covers
Liquid
Granular
Market segment by Application can be divided into
Wafer Level Packaging
Flat Panel Packaging
Others
The key market players for global Semiconductor Molding Compounds market are listed below:
Sumitomo Bakelite
Hitachi Chemical
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Samsung SDI
Eternal Materials
Jiangsu zhongpeng new material
Shin-Etsu Chemical
Hexion
Nepes
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Sino-tech Electronic Material
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Semiconductor Molding Compounds product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Semiconductor Molding Compounds, with price, sales, revenue and global market share of Semiconductor Molding Compounds from 2019 to 2022.
Chapter 3, the Semiconductor Molding Compounds competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Semiconductor Molding Compounds breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2017 to 2028.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2017 to 2028.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2017 to 2022.and Semiconductor Molding Compounds market forecast, by regions, type and application, with sales and revenue, from 2023 to 2028.
Chapter 12, the key raw materials and key suppliers, and industry chain of Semiconductor Molding Compounds.
Chapter 13, 14, and 15, to describe Semiconductor Molding Compounds sales channel, distributors, customers, research findings and conclusion, appendix and data source.

❖ レポートの目次 ❖

1 Market Overview
1.1 Semiconductor Molding Compounds Introduction
1.2 Market Analysis by Type
1.2.1 Overview: Global Semiconductor Molding Compounds Revenue by Type: 2017 Versus 2021 Versus 2028
1.2.2 Liquid
1.2.3 Granular
1.3 Market Analysis by Application
1.3.1 Overview: Global Semiconductor Molding Compounds Revenue by Application: 2017 Versus 2021 Versus 2028
1.3.2 Wafer Level Packaging
1.3.3 Flat Panel Packaging
1.3.4 Others
1.4 Global Semiconductor Molding Compounds Market Size & Forecast
1.4.1 Global Semiconductor Molding Compounds Sales in Value (2017 & 2021 & 2028)
1.4.2 Global Semiconductor Molding Compounds Sales in Volume (2017-2028)
1.4.3 Global Semiconductor Molding Compounds Price (2017-2028)
1.5 Global Semiconductor Molding Compounds Production Capacity Analysis
1.5.1 Global Semiconductor Molding Compounds Total Production Capacity (2017-2028)
1.5.2 Global Semiconductor Molding Compounds Production Capacity by Geographic Region
1.6 Market Drivers, Restraints and Trends
1.6.1 Semiconductor Molding Compounds Market Drivers
1.6.2 Semiconductor Molding Compounds Market Restraints
1.6.3 Semiconductor Molding Compounds Trends Analysis
2 Manufacturers Profiles
2.1 Sumitomo Bakelite
2.1.1 Sumitomo Bakelite Details
2.1.2 Sumitomo Bakelite Major Business
2.1.3 Sumitomo Bakelite Semiconductor Molding Compounds Product and Services
2.1.4 Sumitomo Bakelite Semiconductor Molding Compounds Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.2 Hitachi Chemical
2.2.1 Hitachi Chemical Details
2.2.2 Hitachi Chemical Major Business
2.2.3 Hitachi Chemical Semiconductor Molding Compounds Product and Services
2.2.4 Hitachi Chemical Semiconductor Molding Compounds Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.3 Chang Chun Group
2.3.1 Chang Chun Group Details
2.3.2 Chang Chun Group Major Business
2.3.3 Chang Chun Group Semiconductor Molding Compounds Product and Services
2.3.4 Chang Chun Group Semiconductor Molding Compounds Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.4 Hysol Huawei Electronics
2.4.1 Hysol Huawei Electronics Details
2.4.2 Hysol Huawei Electronics Major Business
2.4.3 Hysol Huawei Electronics Semiconductor Molding Compounds Product and Services
2.4.4 Hysol Huawei Electronics Semiconductor Molding Compounds Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.5 Panasonic
2.5.1 Panasonic Details
2.5.2 Panasonic Major Business
2.5.3 Panasonic Semiconductor Molding Compounds Product and Services
2.5.4 Panasonic Semiconductor Molding Compounds Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.6 Kyocera
2.6.1 Kyocera Details
2.6.2 Kyocera Major Business
2.6.3 Kyocera Semiconductor Molding Compounds Product and Services
2.6.4 Kyocera Semiconductor Molding Compounds Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.7 KCC
2.7.1 KCC Details
2.7.2 KCC Major Business
2.7.3 KCC Semiconductor Molding Compounds Product and Services
2.7.4 KCC Semiconductor Molding Compounds Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.8 Samsung SDI
2.8.1 Samsung SDI Details
2.8.2 Samsung SDI Major Business
2.8.3 Samsung SDI Semiconductor Molding Compounds Product and Services
2.8.4 Samsung SDI Semiconductor Molding Compounds Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.9 Eternal Materials
2.9.1 Eternal Materials Details
2.9.2 Eternal Materials Major Business
2.9.3 Eternal Materials Semiconductor Molding Compounds Product and Services
2.9.4 Eternal Materials Semiconductor Molding Compounds Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.10 Jiangsu zhongpeng new material
2.10.1 Jiangsu zhongpeng new material Details
2.10.2 Jiangsu zhongpeng new material Major Business
2.10.3 Jiangsu zhongpeng new material Semiconductor Molding Compounds Product and Services
2.10.4 Jiangsu zhongpeng new material Semiconductor Molding Compounds Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.11 Shin-Etsu Chemical
2.11.1 Shin-Etsu Chemical Details
2.11.2 Shin-Etsu Chemical Major Business
2.11.3 Shin-Etsu Chemical Semiconductor Molding Compounds Product and Services
2.11.4 Shin-Etsu Chemical Semiconductor Molding Compounds Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.12 Hexion
2.12.1 Hexion Details
2.12.2 Hexion Major Business
2.12.3 Hexion Semiconductor Molding Compounds Product and Services
2.12.4 Hexion Semiconductor Molding Compounds Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.13 Nepes
2.13.1 Nepes Details
2.13.2 Nepes Major Business
2.13.3 Nepes Semiconductor Molding Compounds Product and Services
2.13.4 Nepes Semiconductor Molding Compounds Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.14 Tianjin Kaihua Insulating Material
2.14.1 Tianjin Kaihua Insulating Material Details
2.14.2 Tianjin Kaihua Insulating Material Major Business
2.14.3 Tianjin Kaihua Insulating Material Semiconductor Molding Compounds Product and Services
2.14.4 Tianjin Kaihua Insulating Material Semiconductor Molding Compounds Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.15 HHCK
2.15.1 HHCK Details
2.15.2 HHCK Major Business
2.15.3 HHCK Semiconductor Molding Compounds Product and Services
2.15.4 HHCK Semiconductor Molding Compounds Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.16 Scienchem
2.16.1 Scienchem Details
2.16.2 Scienchem Major Business
2.16.3 Scienchem Semiconductor Molding Compounds Product and Services
2.16.4 Scienchem Semiconductor Molding Compounds Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.17 Sino-tech Electronic Material
2.17.1 Sino-tech Electronic Material Details
2.17.2 Sino-tech Electronic Material Major Business
2.17.3 Sino-tech Electronic Material Semiconductor Molding Compounds Product and Services
2.17.4 Sino-tech Electronic Material Semiconductor Molding Compounds Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
3 Semiconductor Molding Compounds Breakdown Data by Manufacturer
3.1 Global Semiconductor Molding Compounds Sales in Volume by Manufacturer (2019, 2020, 2021, and 2022)
3.2 Global Semiconductor Molding Compounds Revenue by Manufacturer (2019, 2020, 2021, and 2022)
3.3 Key Manufacturer Market Position in Semiconductor Molding Compounds
3.4 Market Concentration Rate
3.4.1 Top 3 Semiconductor Molding Compounds Manufacturer Market Share in 2021
3.4.2 Top 6 Semiconductor Molding Compounds Manufacturer Market Share in 2021
3.5 Global Semiconductor Molding Compounds Production Capacity by Company: 2021 VS 2022
3.6 Manufacturer by Geography: Head Office and Semiconductor Molding Compounds Production Site
3.7 New Entrant and Capacity Expansion Plans
3.8 Mergers & Acquisitions
4 Market Analysis by Region
4.1 Global Semiconductor Molding Compounds Market Size by Region
4.1.1 Global Semiconductor Molding Compounds Sales in Volume by Region (2017-2028)
4.1.2 Global Semiconductor Molding Compounds Revenue by Region (2017-2028)
4.2 North America Semiconductor Molding Compounds Revenue (2017-2028)
4.3 Europe Semiconductor Molding Compounds Revenue (2017-2028)
4.4 Asia-Pacific Semiconductor Molding Compounds Revenue (2017-2028)
4.5 South America Semiconductor Molding Compounds Revenue (2017-2028)
4.6 Middle East and Africa Semiconductor Molding Compounds Revenue (2017-2028)
5 Market Segment by Type
5.1 Global Semiconductor Molding Compounds Sales in Volume by Type (2017-2028)
5.2 Global Semiconductor Molding Compounds Revenue by Type (2017-2028)
5.3 Global Semiconductor Molding Compounds Price by Type (2017-2028)
6 Market Segment by Application
6.1 Global Semiconductor Molding Compounds Sales in Volume by Application (2017-2028)
6.2 Global Semiconductor Molding Compounds Revenue by Application (2017-2028)
6.3 Global Semiconductor Molding Compounds Price by Application (2017-2028)
7 North America by Country, by Type, and by Application
7.1 North America Semiconductor Molding Compounds Sales by Type (2017-2028)
7.2 North America Semiconductor Molding Compounds Sales by Application (2017-2028)
7.3 North America Semiconductor Molding Compounds Market Size by Country
7.3.1 North America Semiconductor Molding Compounds Sales in Volume by Country (2017-2028)
7.3.2 North America Semiconductor Molding Compounds Revenue by Country (2017-2028)
7.3.3 United States Market Size and Forecast (2017-2028)
7.3.4 Canada Market Size and Forecast (2017-2028)
7.3.5 Mexico Market Size and Forecast (2017-2028)
8 Europe by Country, by Type, and by Application
8.1 Europe Semiconductor Molding Compounds Sales by Type (2017-2028)
8.2 Europe Semiconductor Molding Compounds Sales by Application (2017-2028)
8.3 Europe Semiconductor Molding Compounds Market Size by Country
8.3.1 Europe Semiconductor Molding Compounds Sales in Volume by Country (2017-2028)
8.3.2 Europe Semiconductor Molding Compounds Revenue by Country (2017-2028)
8.3.3 Germany Market Size and Forecast (2017-2028)
8.3.4 France Market Size and Forecast (2017-2028)
8.3.5 United Kingdom Market Size and Forecast (2017-2028)
8.3.6 Russia Market Size and Forecast (2017-2028)
8.3.7 Italy Market Size and Forecast (2017-2028)
9 Asia-Pacific by Region, by Type, and by Application
9.1 Asia-Pacific Semiconductor Molding Compounds Sales by Type (2017-2028)
9.2 Asia-Pacific Semiconductor Molding Compounds Sales by Application (2017-2028)
9.3 Asia-Pacific Semiconductor Molding Compounds Market Size by Region
9.3.1 Asia-Pacific Semiconductor Molding Compounds Sales in Volume by Region (2017-2028)
9.3.2 Asia-Pacific Semiconductor Molding Compounds Revenue by Region (2017-2028)
9.3.3 China Market Size and Forecast (2017-2028)
9.3.4 Japan Market Size and Forecast (2017-2028)
9.3.5 Korea Market Size and Forecast (2017-2028)
9.3.6 India Market Size and Forecast (2017-2028)
9.3.7 Southeast Asia Market Size and Forecast (2017-2028)
9.3.8 Australia Market Size and Forecast (2017-2028)
10 South America by Region, by Type, and by Application
10.1 South America Semiconductor Molding Compounds Sales by Type (2017-2028)
10.2 South America Semiconductor Molding Compounds Sales by Application (2017-2028)
10.3 South America Semiconductor Molding Compounds Market Size by Country
10.3.1 South America Semiconductor Molding Compounds Sales in Volume by Country (2017-2028)
10.3.2 South America Semiconductor Molding Compounds Revenue by Country (2017-2028)
10.3.3 Brazil Market Size and Forecast (2017-2028)
10.3.4 Argentina Market Size and Forecast (2017-2028)
11 Middle East & Africa by Country, by Type, and by Application
11.1 Middle East & Africa Semiconductor Molding Compounds Sales by Type (2017-2028)
11.2 Middle East & Africa Semiconductor Molding Compounds Sales by Application (2017-2028)
11.3 Middle East & Africa Semiconductor Molding Compounds Market Size by Country
11.3.1 Middle East & Africa Semiconductor Molding Compounds Sales in Volume by Country (2017-2028)
11.3.2 Middle East & Africa Semiconductor Molding Compounds Revenue by Country (2017-2028)
11.3.3 Turkey Market Size and Forecast (2017-2028)
11.3.4 Egypt Market Size and Forecast (2017-2028)
11.3.5 Saudi Arabia Market Size and Forecast (2017-2028)
11.3.6 South Africa Market Size and Forecast (2017-2028)
12 Raw Material and Industry Chain
12.1 Raw Material of Semiconductor Molding Compounds and Key Manufacturers
12.2 Manufacturing Costs Percentage of Semiconductor Molding Compounds
12.3 Semiconductor Molding Compounds Production Process
12.4 Semiconductor Molding Compounds Industrial Chain
13 Sales Channel, Distributors, Traders and Dealers
13.1 Sales Channel
13.1.1 Direct Marketing
13.1.2 Indirect Marketing
13.2 Semiconductor Molding Compounds Typical Distributors
13.3 Semiconductor Molding Compounds Typical Customers
14 Research Findings and Conclusion
15 Appendix
15.1 Methodology
15.2 Research Process and Data Source
15.3 Disclaimer

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半導体成形材料の世界市場2022：液体、粒状

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