外部委託半導体組立・テストサービスの世界市場見通し2023年-2029年

◆英語タイトル：Outsourced Semiconductor Assembly and Test Service Market, Global Outlook and Forecast 2023-2029

Market Monitor Globalが発行した調査報告書（MMG23FB1135）

◆商品コード：MMG23FB1135
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◆発行日：2023年2月
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❖ レポートの概要 ❖

当調査レポートは次の情報を含め、世界の外部委託半導体組立・テストサービス市場規模と予測を収録しています。・世界の外部委託半導体組立・テストサービス市場：売上、2018年-2023年、2024年-2029年
・世界の外部委託半導体組立・テストサービス市場：販売量、2018年-2023年、2024年-2029年
・世界のトップ5企業、2022年

世界の外部委託半導体組立・テストサービス市場は2022年に000Mドルと評価され、予測期間中に000％のCAGRで2029年までに000Mドルに達すると予測されています。米国市場は2022年に000Mドルと推定されており、中国は2029年までに000Mドルに達すると予測されています。「組立サービス」セグメントは今後6年間、000%のCAGRで2029年までに000Mドルに成長すると予測されています。

外部委託半導体組立・テストサービスのグローバル主要企業は、ASE、Amkor Technology、JCET、SPIL、Powertech Technology Inc.、TongFu Microelectronics、Tianshui Huatian Technology、UTAC、Chipbond Technology、Hana Micron、OSE、Walton Advanced Engineering、NEPES、Unisem、ChipMOS Technologies、Signetics、Carsem、KYECなどです。2022年にトップ5企業がグローバル売上シェアの約000%を占めています。

MARKET MONITOR GLOBAL（MMG）は、外部委託半導体組立・テストサービスのメーカー、サプライヤー、流通業者、および業界の専門家を調査しました。これには、販売量、売上、需要、価格変動、製品タイプ、最近の動向と計画、産業トレンド、成長要因、課題、阻害要因、潜在的なリスクなどが含まれます。

【セグメント別市場分析】

世界の外部委託半導体組立・テストサービス市場：タイプ別、2018年-2023年、2024年-2029年
世界の外部委託半導体組立・テストサービス市場：タイプ別市場シェア、2022年
・組立サービス、テストサービス

世界の外部委託半導体組立・テストサービス市場：用途別、2018年-2023年、2024年-2029年
世界の外部委託半導体組立・テストサービス市場：用途別市場シェア、2022年
・通信、自動車、コンピューティング、家電、その他

世界の外部委託半導体組立・テストサービス市場：地域・国別、2018年-2023年、2024年-2029年
世界の外部委託半導体組立・テストサービス市場：地域別市場シェア、2022年
・北米：アメリカ、カナダ、メキシコ
・ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア
・アジア：中国、日本、韓国、東南アジア、インド
・南米：ブラジル、アルゼンチン
・中東・アフリカ：トルコ、イスラエル、サウジアラビア、UAE

【競合分析】

また、当レポートは主要な市場参加者の分析を提供します。
・主要企業における外部委託半導体組立・テストサービスのグローバル売上、2018年-2023年
・主要企業における外部委託半導体組立・テストサービスのグローバル売上シェア、2022年
・主要企業における外部委託半導体組立・テストサービスのグローバル販売量、2018年-2023年
・主要企業における外部委託半導体組立・テストサービスのグローバル販売量シェア、2022年

さらに、当レポートは主要企業のプロファイルを提示します。
ASE、Amkor Technology、JCET、SPIL、Powertech Technology Inc.、TongFu Microelectronics、Tianshui Huatian Technology、UTAC、Chipbond Technology、Hana Micron、OSE、Walton Advanced Engineering、NEPES、Unisem、ChipMOS Technologies、Signetics、Carsem、KYEC

*************************************************************

・調査・分析レポートの概要
外部委託半導体組立・テストサービス市場の定義
市場セグメント
世界の外部委託半導体組立・テストサービス市場概要
当レポートの特徴・ベネフィット
調査手法と情報源

・世界の外部委託半導体組立・テストサービス市場規模
世界の外部委託半導体組立・テストサービス市場規模：2022年 VS 2029年
世界の外部委託半導体組立・テストサービス市場規模と予測 2018年-2029年

・競争状況
グローバルトップ企業
売上ベースでのグローバルトップ企業
企業別グローバルでの外部委託半導体組立・テストサービスの売上
グローバルトップ3およびトップ5企業、2022年売上ベース
グローバル企業の外部委託半導体組立・テストサービス製品タイプ
グローバルにおけるティア1、ティア2、ティア3企業

・タイプ別市場分析
タイプ区分：組立サービス、テストサービス
外部委託半導体組立・テストサービスのタイプ別グローバル売上・予測

・用途別市場分析
用途区分：通信、自動車、コンピューティング、家電、その他
外部委託半導体組立・テストサービスの用途別グローバル売上・予測

・地域別市場分析
地域別外部委託半導体組立・テストサービス市場規模 2022年と2029年
地域別外部委託半導体組立・テストサービス売上・予測
北米市場：アメリカ、カナダ、メキシコ
ヨーロッパ市場：ドイツ、フランス、イギリス、イタリア、ロシア
アジア市場：中国、日本、韓国、東南アジア、インド
南米市場：ブラジル、アルゼンチン
中東・アフリカ市場：トルコ、イスラエル、サウジアラビア、UAE

・主要企業のプロファイル（企業概要、事業概要、主要製品、売上、ニュースなど）
ASE、Amkor Technology、JCET、SPIL、Powertech Technology Inc.、TongFu Microelectronics、Tianshui Huatian Technology、UTAC、Chipbond Technology、Hana Micron、OSE、Walton Advanced Engineering、NEPES、Unisem、ChipMOS Technologies、Signetics、Carsem、KYEC
...

This report aims to provide a comprehensive presentation of the global market for Outsourced Semiconductor Assembly and Test Service, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Outsourced Semiconductor Assembly and Test Service. This report contains market size and forecasts of Outsourced Semiconductor Assembly and Test Service in global, including the following market information:
Global Outsourced Semiconductor Assembly and Test Service Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)
The global Outsourced Semiconductor Assembly and Test Service market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is to reach $ Million.
Assembly Service Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Outsourced Semiconductor Assembly and Test Service include ASE, Amkor Technology, JCET, SPIL, Powertech Technology Inc., TongFu Microelectronics, Tianshui Huatian Technology, UTAC and Chipbond Technology, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Outsourced Semiconductor Assembly and Test Service companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
[Total Market by Segment]
Global Outsourced Semiconductor Assembly and Test Service Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global Outsourced Semiconductor Assembly and Test Service Market Segment Percentages, by Type, 2022 (%)
Assembly Service
Test Service
Global Outsourced Semiconductor Assembly and Test Service Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global Outsourced Semiconductor Assembly and Test Service Market Segment Percentages, by Application, 2022 (%)
Communications
Automotive
Computing
Consumer Electronics
Others
Global Outsourced Semiconductor Assembly and Test Service Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global Outsourced Semiconductor Assembly and Test Service Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Outsourced Semiconductor Assembly and Test Service revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies Outsourced Semiconductor Assembly and Test Service revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASE
Amkor Technology
JCET
SPIL
Powertech Technology Inc.
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS Technologies
Signetics
Carsem
KYEC
Outline of Major Chapters:
Chapter 1: Introduces the definition of Outsourced Semiconductor Assembly and Test Service, market overview.
Chapter 2: Global Outsourced Semiconductor Assembly and Test Service market size in revenue.
Chapter 3: Detailed analysis of Outsourced Semiconductor Assembly and Test Service company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Outsourced Semiconductor Assembly and Test Service in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.

❖ レポートの目次 ❖

1 Introduction to Research & Analysis Reports
1.1 Outsourced Semiconductor Assembly and Test Service Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Outsourced Semiconductor Assembly and Test Service Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Outsourced Semiconductor Assembly and Test Service Overall Market Size
2.1 Global Outsourced Semiconductor Assembly and Test Service Market Size: 2022 VS 2029
2.2 Global Outsourced Semiconductor Assembly and Test Service Market Size, Prospects & Forecasts: 2018-2029
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
3.1 Top Outsourced Semiconductor Assembly and Test Service Players in Global Market
3.2 Top Global Outsourced Semiconductor Assembly and Test Service Companies Ranked by Revenue
3.3 Global Outsourced Semiconductor Assembly and Test Service Revenue by Companies
3.4 Top 3 and Top 5 Outsourced Semiconductor Assembly and Test Service Companies in Global Market, by Revenue in 2022
3.5 Global Companies Outsourced Semiconductor Assembly and Test Service Product Type
3.6 Tier 1, Tier 2 and Tier 3 Outsourced Semiconductor Assembly and Test Service Players in Global Market
3.6.1 List of Global Tier 1 Outsourced Semiconductor Assembly and Test Service Companies
3.6.2 List of Global Tier 2 and Tier 3 Outsourced Semiconductor Assembly and Test Service Companies
4 Market Sights by Product
4.1 Overview
4.1.1 By Type – Global Outsourced Semiconductor Assembly and Test Service Market Size Markets, 2022 & 2029
4.1.2 Assembly Service
4.1.3 Test Service
4.2 By Type – Global Outsourced Semiconductor Assembly and Test Service Revenue & Forecasts
4.2.1 By Type – Global Outsourced Semiconductor Assembly and Test Service Revenue, 2018-2023
4.2.2 By Type – Global Outsourced Semiconductor Assembly and Test Service Revenue, 2024-2029
4.2.3 By Type – Global Outsourced Semiconductor Assembly and Test Service Revenue Market Share, 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global Outsourced Semiconductor Assembly and Test Service Market Size, 2022 & 2029
5.1.2 Communications
5.1.3 Automotive
5.1.4 Computing
5.1.5 Consumer Electronics
5.1.6 Others
5.2 By Application – Global Outsourced Semiconductor Assembly and Test Service Revenue & Forecasts
5.2.1 By Application – Global Outsourced Semiconductor Assembly and Test Service Revenue, 2018-2023
5.2.2 By Application – Global Outsourced Semiconductor Assembly and Test Service Revenue, 2024-2029
5.2.3 By Application – Global Outsourced Semiconductor Assembly and Test Service Revenue Market Share, 2018-2029
6 Sights by Region
6.1 By Region – Global Outsourced Semiconductor Assembly and Test Service Market Size, 2022 & 2029
6.2 By Region – Global Outsourced Semiconductor Assembly and Test Service Revenue & Forecasts
6.2.1 By Region – Global Outsourced Semiconductor Assembly and Test Service Revenue, 2018-2023
6.2.2 By Region – Global Outsourced Semiconductor Assembly and Test Service Revenue, 2024-2029
6.2.3 By Region – Global Outsourced Semiconductor Assembly and Test Service Revenue Market Share, 2018-2029
6.3 North America
6.3.1 By Country – North America Outsourced Semiconductor Assembly and Test Service Revenue, 2018-2029
6.3.2 US Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.3.3 Canada Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.3.4 Mexico Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.4 Europe
6.4.1 By Country – Europe Outsourced Semiconductor Assembly and Test Service Revenue, 2018-2029
6.4.2 Germany Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.4.3 France Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.4.4 U.K. Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.4.5 Italy Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.4.6 Russia Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.4.7 Nordic Countries Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.4.8 Benelux Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.5 Asia
6.5.1 By Region – Asia Outsourced Semiconductor Assembly and Test Service Revenue, 2018-2029
6.5.2 China Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.5.3 Japan Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.5.4 South Korea Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.5.5 Southeast Asia Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.5.6 India Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.6 South America
6.6.1 By Country – South America Outsourced Semiconductor Assembly and Test Service Revenue, 2018-2029
6.6.2 Brazil Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.6.3 Argentina Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.7 Middle East & Africa
6.7.1 By Country – Middle East & Africa Outsourced Semiconductor Assembly and Test Service Revenue, 2018-2029
6.7.2 Turkey Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.7.3 Israel Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.7.4 Saudi Arabia Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
6.7.5 UAE Outsourced Semiconductor Assembly and Test Service Market Size, 2018-2029
7 Outsourced Semiconductor Assembly and Test Service Companies Profiles
7.1 ASE
7.1.1 ASE Company Summary
7.1.2 ASE Business Overview
7.1.3 ASE Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.1.4 ASE Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.1.5 ASE Key News & Latest Developments
7.2 Amkor Technology
7.2.1 Amkor Technology Company Summary
7.2.2 Amkor Technology Business Overview
7.2.3 Amkor Technology Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.2.4 Amkor Technology Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.2.5 Amkor Technology Key News & Latest Developments
7.3 JCET
7.3.1 JCET Company Summary
7.3.2 JCET Business Overview
7.3.3 JCET Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.3.4 JCET Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.3.5 JCET Key News & Latest Developments
7.4 SPIL
7.4.1 SPIL Company Summary
7.4.2 SPIL Business Overview
7.4.3 SPIL Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.4.4 SPIL Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.4.5 SPIL Key News & Latest Developments
7.5 Powertech Technology Inc.
7.5.1 Powertech Technology Inc. Company Summary
7.5.2 Powertech Technology Inc. Business Overview
7.5.3 Powertech Technology Inc. Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.5.4 Powertech Technology Inc. Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.5.5 Powertech Technology Inc. Key News & Latest Developments
7.6 TongFu Microelectronics
7.6.1 TongFu Microelectronics Company Summary
7.6.2 TongFu Microelectronics Business Overview
7.6.3 TongFu Microelectronics Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.6.4 TongFu Microelectronics Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.6.5 TongFu Microelectronics Key News & Latest Developments
7.7 Tianshui Huatian Technology
7.7.1 Tianshui Huatian Technology Company Summary
7.7.2 Tianshui Huatian Technology Business Overview
7.7.3 Tianshui Huatian Technology Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.7.4 Tianshui Huatian Technology Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.7.5 Tianshui Huatian Technology Key News & Latest Developments
7.8 UTAC
7.8.1 UTAC Company Summary
7.8.2 UTAC Business Overview
7.8.3 UTAC Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.8.4 UTAC Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.8.5 UTAC Key News & Latest Developments
7.9 Chipbond Technology
7.9.1 Chipbond Technology Company Summary
7.9.2 Chipbond Technology Business Overview
7.9.3 Chipbond Technology Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.9.4 Chipbond Technology Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.9.5 Chipbond Technology Key News & Latest Developments
7.10 Hana Micron
7.10.1 Hana Micron Company Summary
7.10.2 Hana Micron Business Overview
7.10.3 Hana Micron Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.10.4 Hana Micron Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.10.5 Hana Micron Key News & Latest Developments
7.11 OSE
7.11.1 OSE Company Summary
7.11.2 OSE Business Overview
7.11.3 OSE Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.11.4 OSE Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.11.5 OSE Key News & Latest Developments
7.12 Walton Advanced Engineering
7.12.1 Walton Advanced Engineering Company Summary
7.12.2 Walton Advanced Engineering Business Overview
7.12.3 Walton Advanced Engineering Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.12.4 Walton Advanced Engineering Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.12.5 Walton Advanced Engineering Key News & Latest Developments
7.13 NEPES
7.13.1 NEPES Company Summary
7.13.2 NEPES Business Overview
7.13.3 NEPES Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.13.4 NEPES Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.13.5 NEPES Key News & Latest Developments
7.14 Unisem
7.14.1 Unisem Company Summary
7.14.2 Unisem Business Overview
7.14.3 Unisem Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.14.4 Unisem Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.14.5 Unisem Key News & Latest Developments
7.15 ChipMOS Technologies
7.15.1 ChipMOS Technologies Company Summary
7.15.2 ChipMOS Technologies Business Overview
7.15.3 ChipMOS Technologies Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.15.4 ChipMOS Technologies Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.15.5 ChipMOS Technologies Key News & Latest Developments
7.16 Signetics
7.16.1 Signetics Company Summary
7.16.2 Signetics Business Overview
7.16.3 Signetics Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.16.4 Signetics Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.16.5 Signetics Key News & Latest Developments
7.17 Carsem
7.17.1 Carsem Company Summary
7.17.2 Carsem Business Overview
7.17.3 Carsem Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.17.4 Carsem Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.17.5 Carsem Key News & Latest Developments
7.18 KYEC
7.18.1 KYEC Company Summary
7.18.2 KYEC Business Overview
7.18.3 KYEC Outsourced Semiconductor Assembly and Test Service Major Product Offerings
7.18.4 KYEC Outsourced Semiconductor Assembly and Test Service Revenue in Global Market (2018-2023)
7.18.5 KYEC Key News & Latest Developments
8 Conclusion
9 Appendix
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer

❖ 免責事項 ❖
http://www.globalresearch.jp/disclaimer

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外部委託半導体組立・テストサービスの世界市場見通し2023年-2029年

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