ハイエンドIC基板の世界市場見通し2023年-2029年

◆英語タイトル:High-end IC Substrate Market, Global Outlook and Forecast 2023-2029

Market Monitor Globalが発行した調査報告書(MMG23FB1093)◆商品コード:MMG23FB1093
◆発行会社(リサーチ会社):Market Monitor Global
◆発行日:2023年2月
◆ページ数:78
◆レポート形式:英語 / PDF
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❖ レポートの概要 ❖

当調査レポートは次の情報を含め、世界のハイエンドIC基板市場規模と予測を収録しています。・世界のハイエンドIC基板市場:売上、2018年-2023年、2024年-2029年
・世界のハイエンドIC基板市場:販売量、2018年-2023年、2024年-2029年
・世界のトップ5企業、2022年

世界のハイエンドIC基板市場は2022年に000Mドルと評価され、予測期間中に000%のCAGRで2029年までに000Mドルに達すると予測されています。米国市場は2022年に000Mドルと推定されており、中国は2029年までに000Mドルに達すると予測されています。「複合FC CSP(EAD/PLP)」セグメントは今後6年間、000%のCAGRで2029年までに000Mドルに成長すると予測されています。

ハイエンドIC基板のグローバル主要企業は、ASE Metarial、SEM、Unimicron、Ibiden、Shinko Electric Industries、Kinsus、Nanya、AT&S、Shennan Circuit、Shenzhen Fastprint Circuit Technology、TTM Technologiesなどです。2022年にトップ5企業がグローバル売上シェアの約000%を占めています。

MARKET MONITOR GLOBAL(MMG)は、ハイエンドIC基板のメーカー、サプライヤー、流通業者、および業界の専門家を調査しました。これには、販売量、売上、需要、価格変動、製品タイプ、最近の動向と計画、産業トレンド、成長要因、課題、阻害要因、潜在的なリスクなどが含まれます。

【セグメント別市場分析】

世界のハイエンドIC基板市場:タイプ別、2018年-2023年、2024年-2029年
世界のハイエンドIC基板市場:タイプ別市場シェア、2022年
・複合FC CSP(EAD/PLP)、複合FC BGA(CPU)

世界のハイエンドIC基板市場:用途別、2018年-2023年、2024年-2029年
世界のハイエンドIC基板市場:用途別市場シェア、2022年
・3C電子、自動車・運輸、IT・通信、その他

世界のハイエンドIC基板市場:地域・国別、2018年-2023年、2024年-2029年
世界のハイエンドIC基板市場:地域別市場シェア、2022年
・北米:アメリカ、カナダ、メキシコ
・ヨーロッパ:ドイツ、フランス、イギリス、イタリア、ロシア
・アジア:中国、日本、韓国、東南アジア、インド
・南米:ブラジル、アルゼンチン
・中東・アフリカ:トルコ、イスラエル、サウジアラビア、UAE

【競合分析】

また、当レポートは主要な市場参加者の分析を提供します。
・主要企業におけるハイエンドIC基板のグローバル売上、2018年-2023年
・主要企業におけるハイエンドIC基板のグローバル売上シェア、2022年
・主要企業におけるハイエンドIC基板のグローバル販売量、2018年-2023年
・主要企業におけるハイエンドIC基板のグローバル販売量シェア、2022年

さらに、当レポートは主要企業のプロファイルを提示します。
ASE Metarial、SEM、Unimicron、Ibiden、Shinko Electric Industries、Kinsus、Nanya、AT&S、Shennan Circuit、Shenzhen Fastprint Circuit Technology、TTM Technologies

*************************************************************

・調査・分析レポートの概要
ハイエンドIC基板市場の定義
市場セグメント
世界のハイエンドIC基板市場概要
当レポートの特徴・ベネフィット
調査手法と情報源

・世界のハイエンドIC基板市場規模
世界のハイエンドIC基板市場規模:2022年 VS 2029年
世界のハイエンドIC基板市場規模と予測 2018年-2029年

・競争状況
グローバルトップ企業
売上ベースでのグローバルトップ企業
企業別グローバルでのハイエンドIC基板の売上
グローバルトップ3およびトップ5企業、2022年売上ベース
グローバル企業のハイエンドIC基板製品タイプ
グローバルにおけるティア1、ティア2、ティア3企業

・タイプ別市場分析
タイプ区分:複合FC CSP(EAD/PLP)、複合FC BGA(CPU)
ハイエンドIC基板のタイプ別グローバル売上・予測

・用途別市場分析
用途区分:3C電子、自動車・運輸、IT・通信、その他
ハイエンドIC基板の用途別グローバル売上・予測

・地域別市場分析
地域別ハイエンドIC基板市場規模 2022年と2029年
地域別ハイエンドIC基板売上・予測
北米市場:アメリカ、カナダ、メキシコ
ヨーロッパ市場:ドイツ、フランス、イギリス、イタリア、ロシア
アジア市場:中国、日本、韓国、東南アジア、インド
南米市場:ブラジル、アルゼンチン
中東・アフリカ市場:トルコ、イスラエル、サウジアラビア、UAE

・主要企業のプロファイル(企業概要、事業概要、主要製品、売上、ニュースなど)
ASE Metarial、SEM、Unimicron、Ibiden、Shinko Electric Industries、Kinsus、Nanya、AT&S、Shennan Circuit、Shenzhen Fastprint Circuit Technology、TTM Technologies
...

This report aims to provide a comprehensive presentation of the global market for High-end IC Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding High-end IC Substrate. This report contains market size and forecasts of High-end IC Substrate in global, including the following market information:
Global High-end IC Substrate Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global High-end IC Substrate Market Sales, 2018-2023, 2024-2029, (K Units)
Global top five High-end IC Substrate companies in 2022 (%)
The global High-end IC Substrate market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Complex FC CSP (EAD/PLP) Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of High-end IC Substrate include ASE Metarial, SEM, Unimicron, Ibiden, Shinko Electric Industries, Kinsus, Nanya, AT&S and Shennan Circuit, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the High-end IC Substrate manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
[Total Market by Segment]
Global High-end IC Substrate Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global High-end IC Substrate Market Segment Percentages, by Type, 2022 (%)
Complex FC CSP (EAD/PLP)
Complex FC BGA (CPU)
Global High-end IC Substrate Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global High-end IC Substrate Market Segment Percentages, by Application, 2022 (%)
3C Electronics
Automotive and Transportation
IT and Telecom
Others
Global High-end IC Substrate Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global High-end IC Substrate Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies High-end IC Substrate revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies High-end IC Substrate revenues share in global market, 2022 (%)
Key companies High-end IC Substrate sales in global market, 2018-2023 (Estimated), (K Units)
Key companies High-end IC Substrate sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASE Metarial
SEM
Unimicron
Ibiden
Shinko Electric Industries
Kinsus
Nanya
AT&S
Shennan Circuit
Shenzhen Fastprint Circuit Technology
TTM Technologies
Outline of Major Chapters:
Chapter 1: Introduces the definition of High-end IC Substrate, market overview.
Chapter 2: Global High-end IC Substrate market size in revenue and volume.
Chapter 3: Detailed analysis of High-end IC Substrate manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of High-end IC Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global High-end IC Substrate capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.

❖ レポートの目次 ❖

1 Introduction to Research & Analysis Reports
1.1 High-end IC Substrate Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global High-end IC Substrate Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global High-end IC Substrate Overall Market Size
2.1 Global High-end IC Substrate Market Size: 2022 VS 2029
2.2 Global High-end IC Substrate Revenue, Prospects & Forecasts: 2018-2029
2.3 Global High-end IC Substrate Sales: 2018-2029
3 Company Landscape
3.1 Top High-end IC Substrate Players in Global Market
3.2 Top Global High-end IC Substrate Companies Ranked by Revenue
3.3 Global High-end IC Substrate Revenue by Companies
3.4 Global High-end IC Substrate Sales by Companies
3.5 Global High-end IC Substrate Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 High-end IC Substrate Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers High-end IC Substrate Product Type
3.8 Tier 1, Tier 2 and Tier 3 High-end IC Substrate Players in Global Market
3.8.1 List of Global Tier 1 High-end IC Substrate Companies
3.8.2 List of Global Tier 2 and Tier 3 High-end IC Substrate Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type – Global High-end IC Substrate Market Size Markets, 2022 & 2029
4.1.2 Complex FC CSP (EAD/PLP)
4.1.3 Complex FC BGA (CPU)
4.2 By Type – Global High-end IC Substrate Revenue & Forecasts
4.2.1 By Type – Global High-end IC Substrate Revenue, 2018-2023
4.2.2 By Type – Global High-end IC Substrate Revenue, 2024-2029
4.2.3 By Type – Global High-end IC Substrate Revenue Market Share, 2018-2029
4.3 By Type – Global High-end IC Substrate Sales & Forecasts
4.3.1 By Type – Global High-end IC Substrate Sales, 2018-2023
4.3.2 By Type – Global High-end IC Substrate Sales, 2024-2029
4.3.3 By Type – Global High-end IC Substrate Sales Market Share, 2018-2029
4.4 By Type – Global High-end IC Substrate Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global High-end IC Substrate Market Size, 2022 & 2029
5.1.2 3C Electronics
5.1.3 Automotive and Transportation
5.1.4 IT and Telecom
5.1.5 Others
5.2 By Application – Global High-end IC Substrate Revenue & Forecasts
5.2.1 By Application – Global High-end IC Substrate Revenue, 2018-2023
5.2.2 By Application – Global High-end IC Substrate Revenue, 2024-2029
5.2.3 By Application – Global High-end IC Substrate Revenue Market Share, 2018-2029
5.3 By Application – Global High-end IC Substrate Sales & Forecasts
5.3.1 By Application – Global High-end IC Substrate Sales, 2018-2023
5.3.2 By Application – Global High-end IC Substrate Sales, 2024-2029
5.3.3 By Application – Global High-end IC Substrate Sales Market Share, 2018-2029
5.4 By Application – Global High-end IC Substrate Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region – Global High-end IC Substrate Market Size, 2022 & 2029
6.2 By Region – Global High-end IC Substrate Revenue & Forecasts
6.2.1 By Region – Global High-end IC Substrate Revenue, 2018-2023
6.2.2 By Region – Global High-end IC Substrate Revenue, 2024-2029
6.2.3 By Region – Global High-end IC Substrate Revenue Market Share, 2018-2029
6.3 By Region – Global High-end IC Substrate Sales & Forecasts
6.3.1 By Region – Global High-end IC Substrate Sales, 2018-2023
6.3.2 By Region – Global High-end IC Substrate Sales, 2024-2029
6.3.3 By Region – Global High-end IC Substrate Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country – North America High-end IC Substrate Revenue, 2018-2029
6.4.2 By Country – North America High-end IC Substrate Sales, 2018-2029
6.4.3 US High-end IC Substrate Market Size, 2018-2029
6.4.4 Canada High-end IC Substrate Market Size, 2018-2029
6.4.5 Mexico High-end IC Substrate Market Size, 2018-2029
6.5 Europe
6.5.1 By Country – Europe High-end IC Substrate Revenue, 2018-2029
6.5.2 By Country – Europe High-end IC Substrate Sales, 2018-2029
6.5.3 Germany High-end IC Substrate Market Size, 2018-2029
6.5.4 France High-end IC Substrate Market Size, 2018-2029
6.5.5 U.K. High-end IC Substrate Market Size, 2018-2029
6.5.6 Italy High-end IC Substrate Market Size, 2018-2029
6.5.7 Russia High-end IC Substrate Market Size, 2018-2029
6.5.8 Nordic Countries High-end IC Substrate Market Size, 2018-2029
6.5.9 Benelux High-end IC Substrate Market Size, 2018-2029
6.6 Asia
6.6.1 By Region – Asia High-end IC Substrate Revenue, 2018-2029
6.6.2 By Region – Asia High-end IC Substrate Sales, 2018-2029
6.6.3 China High-end IC Substrate Market Size, 2018-2029
6.6.4 Japan High-end IC Substrate Market Size, 2018-2029
6.6.5 South Korea High-end IC Substrate Market Size, 2018-2029
6.6.6 Southeast Asia High-end IC Substrate Market Size, 2018-2029
6.6.7 India High-end IC Substrate Market Size, 2018-2029
6.7 South America
6.7.1 By Country – South America High-end IC Substrate Revenue, 2018-2029
6.7.2 By Country – South America High-end IC Substrate Sales, 2018-2029
6.7.3 Brazil High-end IC Substrate Market Size, 2018-2029
6.7.4 Argentina High-end IC Substrate Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country – Middle East & Africa High-end IC Substrate Revenue, 2018-2029
6.8.2 By Country – Middle East & Africa High-end IC Substrate Sales, 2018-2029
6.8.3 Turkey High-end IC Substrate Market Size, 2018-2029
6.8.4 Israel High-end IC Substrate Market Size, 2018-2029
6.8.5 Saudi Arabia High-end IC Substrate Market Size, 2018-2029
6.8.6 UAE High-end IC Substrate Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 ASE Metarial
7.1.1 ASE Metarial Company Summary
7.1.2 ASE Metarial Business Overview
7.1.3 ASE Metarial High-end IC Substrate Major Product Offerings
7.1.4 ASE Metarial High-end IC Substrate Sales and Revenue in Global (2018-2023)
7.1.5 ASE Metarial Key News & Latest Developments
7.2 SEM
7.2.1 SEM Company Summary
7.2.2 SEM Business Overview
7.2.3 SEM High-end IC Substrate Major Product Offerings
7.2.4 SEM High-end IC Substrate Sales and Revenue in Global (2018-2023)
7.2.5 SEM Key News & Latest Developments
7.3 Unimicron
7.3.1 Unimicron Company Summary
7.3.2 Unimicron Business Overview
7.3.3 Unimicron High-end IC Substrate Major Product Offerings
7.3.4 Unimicron High-end IC Substrate Sales and Revenue in Global (2018-2023)
7.3.5 Unimicron Key News & Latest Developments
7.4 Ibiden
7.4.1 Ibiden Company Summary
7.4.2 Ibiden Business Overview
7.4.3 Ibiden High-end IC Substrate Major Product Offerings
7.4.4 Ibiden High-end IC Substrate Sales and Revenue in Global (2018-2023)
7.4.5 Ibiden Key News & Latest Developments
7.5 Shinko Electric Industries
7.5.1 Shinko Electric Industries Company Summary
7.5.2 Shinko Electric Industries Business Overview
7.5.3 Shinko Electric Industries High-end IC Substrate Major Product Offerings
7.5.4 Shinko Electric Industries High-end IC Substrate Sales and Revenue in Global (2018-2023)
7.5.5 Shinko Electric Industries Key News & Latest Developments
7.6 Kinsus
7.6.1 Kinsus Company Summary
7.6.2 Kinsus Business Overview
7.6.3 Kinsus High-end IC Substrate Major Product Offerings
7.6.4 Kinsus High-end IC Substrate Sales and Revenue in Global (2018-2023)
7.6.5 Kinsus Key News & Latest Developments
7.7 Nanya
7.7.1 Nanya Company Summary
7.7.2 Nanya Business Overview
7.7.3 Nanya High-end IC Substrate Major Product Offerings
7.7.4 Nanya High-end IC Substrate Sales and Revenue in Global (2018-2023)
7.7.5 Nanya Key News & Latest Developments
7.8 AT&S
7.8.1 AT&S Company Summary
7.8.2 AT&S Business Overview
7.8.3 AT&S High-end IC Substrate Major Product Offerings
7.8.4 AT&S High-end IC Substrate Sales and Revenue in Global (2018-2023)
7.8.5 AT&S Key News & Latest Developments
7.9 Shennan Circuit
7.9.1 Shennan Circuit Company Summary
7.9.2 Shennan Circuit Business Overview
7.9.3 Shennan Circuit High-end IC Substrate Major Product Offerings
7.9.4 Shennan Circuit High-end IC Substrate Sales and Revenue in Global (2018-2023)
7.9.5 Shennan Circuit Key News & Latest Developments
7.10 Shenzhen Fastprint Circuit Technology
7.10.1 Shenzhen Fastprint Circuit Technology Company Summary
7.10.2 Shenzhen Fastprint Circuit Technology Business Overview
7.10.3 Shenzhen Fastprint Circuit Technology High-end IC Substrate Major Product Offerings
7.10.4 Shenzhen Fastprint Circuit Technology High-end IC Substrate Sales and Revenue in Global (2018-2023)
7.10.5 Shenzhen Fastprint Circuit Technology Key News & Latest Developments
7.11 TTM Technologies
7.11.1 TTM Technologies Company Summary
7.11.2 TTM Technologies High-end IC Substrate Business Overview
7.11.3 TTM Technologies High-end IC Substrate Major Product Offerings
7.11.4 TTM Technologies High-end IC Substrate Sales and Revenue in Global (2018-2023)
7.11.5 TTM Technologies Key News & Latest Developments
8 Global High-end IC Substrate Production Capacity, Analysis
8.1 Global High-end IC Substrate Production Capacity, 2018-2029
8.2 High-end IC Substrate Production Capacity of Key Manufacturers in Global Market
8.3 Global High-end IC Substrate Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 High-end IC Substrate Supply Chain Analysis
10.1 High-end IC Substrate Industry Value Chain
10.2 High-end IC Substrate Upstream Market
10.3 High-end IC Substrate Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 High-end IC Substrate Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer



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