カテゴリー： QYResearch, 世界, 産業機械/建設

世界のウェハ薄化装置市場インサイト及び予測（全自動、半自動）

◆英語タイトル：Global Wafer Thinning Equipment Market Insights, Forecast to 2028
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❖ レポートの概要 ❖

COVID-19のパンデミックにより、ウェハ薄化装置のグローバル市場規模は2022年にUS$xxxと推定され、調査期間中のCAGRはxxx％で、2028年までに再調整された規模はUS$xxxになると予測されています。この医療危機による経済変化を十分に考慮すると、2021年にウェハ薄化装置の世界市場のxxx％を占める「全自動」タイプは、2028年までにUS$xxxの規模になり、パンデミック後の修正xxx％CAGRで成長すると予測されています。一方、「200mmウェーハ」セグメントは、この予測期間を通じてxxx％のCAGRに変更されます。
ウェハ薄化装置の中国市場規模は2021年にUS$xxxと分析されており、米国とヨーロッパの市場規模はそれぞれUS$xxxとUS$xxxです。米国の割合は2021年にxxx％であり、中国とヨーロッパはそれぞれxxx％とxxx％です。中国の割合は2028年にxxx％に達し、対象期間を通じてxxx％のCAGRを記録すると予測されています。日本、韓国、東南アジアはアジアで注目市場であり、今後6年間のCAGRはそれぞれxxx％、xxx％、xxx％になる見通しです。ヨーロッパのウェハ薄化装置市場については、ドイツは2028年までにUS$xxxに達すると予測されており、予測期間中のCAGRはxxx％になる見通しです。

ウェハ薄化装置のグローバル主要企業には、DISCO、Tokyo Seimitsu、Arnold Gruppe、GigaMat、Strasbaugh、Daitron、Dynavest、CETC、Hwatsing Technology Co.,Ltd.、Zhejiang Jingsheng Mechanical & Electrical Co.,Ltd.などがあります。2021年、世界のトップ5プレイヤーは売上ベースで約xxx％の市場シェアを占めています。

ウェハ薄化装置市場は、種類と用途によって区分されます。世界のウェハ薄化装置市場のプレーヤー、利害関係者、およびその他の参加者は、当レポートを有益なリソースとして使用することで優位に立つことができます。セグメント分析は、2017年～2028年期間のタイプ別および用途別の販売量、売上、予測に焦点を当てています。

【種類別セグメント】
全自動、半自動

【用途別セグメント】
200mmウェーハ、300mmウェーハ、その他

【掲載地域】
北米：アメリカ、カナダ
ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア
アジア太平洋：日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア
中南米：メキシコ、ブラジル、アルゼンチン
中東・アフリカ：トルコ、サウジアラビア、UAE

【目次（一部）】

・調査の範囲
- ウェハ薄化装置製品概要
- 種類別市場（全自動、半自動）
- 用途別市場（200mmウェーハ、300mmウェーハ、その他）
- 調査の目的
・エグゼクティブサマリー
- 世界のウェハ薄化装置販売量予測2017-2028
- 世界のウェハ薄化装置売上予測2017-2028
- ウェハ薄化装置の地域別販売量
- ウェハ薄化装置の地域別売上
- 北米市場
- ヨーロッパ市場
- アジア太平洋市場
- 中南米市場
- 中東・アフリカ市場
・メーカーの競争状況
- 主要メーカー別ウェハ薄化装置販売量
- 主要メーカー別ウェハ薄化装置売上
- 主要メーカー別ウェハ薄化装置価格
- 競争状況の分析
- 企業M&A動向
・種類別市場規模（全自動、半自動）
- ウェハ薄化装置の種類別販売量
- ウェハ薄化装置の種類別売上
- ウェハ薄化装置の種類別価格
・用途別市場規模（200mmウェーハ、300mmウェーハ、その他）
- ウェハ薄化装置の用途別販売量
- ウェハ薄化装置の用途別売上
- ウェハ薄化装置の用途別価格
・北米市場
- 北米のウェハ薄化装置市場規模（種類別、用途別）
- 主要国別のウェハ薄化装置市場規模（アメリカ、カナダ）
・ヨーロッパ市場
- ヨーロッパのウェハ薄化装置市場規模（種類別、用途別）
- 主要国別のウェハ薄化装置市場規模（ドイツ、フランス、イギリス、イタリア、ロシア）
・アジア太平洋市場
- アジア太平洋のウェハ薄化装置市場規模（種類別、用途別）
- 主要国別のウェハ薄化装置市場規模（日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア）
・中南米市場
- 中南米のウェハ薄化装置市場規模（種類別、用途別）
- 主要国別のウェハ薄化装置市場規模（メキシコ、ブラジル、アルゼンチン）
・中東・アフリカ市場
- 中東・アフリカのウェハ薄化装置市場規模（種類別、用途別）
- 主要国別のウェハ薄化装置市場規模（トルコ、サウジアラビア）
・企業情報
DISCO、Tokyo Seimitsu、Arnold Gruppe、GigaMat、Strasbaugh、Daitron、Dynavest、CETC、Hwatsing Technology Co.,Ltd.、Zhejiang Jingsheng Mechanical & Electrical Co.,Ltd.
・産業チェーン及び販売チャネル分析
- ウェハ薄化装置の産業チェーン分析
- ウェハ薄化装置の原材料
- ウェハ薄化装置の生産プロセス
- ウェハ薄化装置の販売及びマーケティング
- ウェハ薄化装置の主要顧客
・マーケットドライバー、機会、課題、リスク要因分析
- ウェハ薄化装置の産業動向
- ウェハ薄化装置のマーケットドライバー
- ウェハ薄化装置の課題
- ウェハ薄化装置の阻害要因
・主な調査結果

Market Analysis and Insights: Global Wafer Thinning Equipment Market
Due to the COVID-19 pandemic, the global Wafer Thinning Equipment market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the forecast period 2022-2028. Fully considering the economic change by this health crisis, Fully Automatic accounting for % of the Wafer Thinning Equipment global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While 200mm Wafer segment is altered to an % CAGR throughout this forecast period.
China Wafer Thinning Equipment market size is valued at US$ million in 2021, while the US and Europe Wafer Thinning Equipment are US$ million and US$ million, severally. The proportion of the US is % in 2021, while China and Europe are % and % respectively, and it is predicted that China proportion will reach % in 2028, trailing a CAGR of % through the analysis period 2022-2028. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR %, %, and % respectively for the next 6-year period. As for the Europe Wafer Thinning Equipment landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period 2022-2028.
The global key manufacturers of Wafer Thinning Equipment include DISCO, Tokyo Seimitsu, Arnold Gruppe, GigaMat, Strasbaugh, Daitron, Dynavest, CETC and Hwatsing Technology Co.,Ltd. and etc. In 2021, the global top five players have a share approximately % in terms of revenue.
In terms of production side, this report researches the Wafer Thinning Equipment capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of Wafer Thinning Equipment by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global Wafer Thinning Equipment Scope and Segment
Wafer Thinning Equipment market is segmented by Type and by Application. Players, stakeholders, and other participants in the global Wafer Thinning Equipment market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
Fully Automatic
Semi-automatic
Segment by Application
200mm Wafer
300mm Wafer
Others
By Company
DISCO
Tokyo Seimitsu
Arnold Gruppe
GigaMat
Strasbaugh
Daitron
Dynavest
CETC
Hwatsing Technology Co.,Ltd.
Zhejiang Jingsheng Mechanical & Electrical Co.,Ltd.
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Colombia
Middle East & Africa
Turkey
Saudi Arabia
UAE

❖ レポートの目次 ❖

1 Study Coverage
1.1 Wafer Thinning Equipment Product Introduction
1.2 Market by Type
1.2.1 Global Wafer Thinning Equipment Market Size by Type, 2017 VS 2021 VS 2028
1.2.2 Fully Automatic
1.2.3 Semi-automatic
1.3 Market by Application
1.3.1 Global Wafer Thinning Equipment Market Size by Application, 2017 VS 2021 VS 2028
1.3.2 200mm Wafer
1.3.3 300mm Wafer
1.3.4 Others
1.4 Study Objectives
1.5 Years Considered
2 Global Wafer Thinning Equipment Production
2.1 Global Wafer Thinning Equipment Production Capacity (2017-2028)
2.2 Global Wafer Thinning Equipment Production by Region: 2017 VS 2021 VS 2028
2.3 Global Wafer Thinning Equipment Production by Region
2.3.1 Global Wafer Thinning Equipment Historic Production by Region (2017-2022)
2.3.2 Global Wafer Thinning Equipment Forecasted Production by Region (2023-2028)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
3 Global Wafer Thinning Equipment Sales in Volume & Value Estimates and Forecasts
3.1 Global Wafer Thinning Equipment Sales Estimates and Forecasts 2017-2028
3.2 Global Wafer Thinning Equipment Revenue Estimates and Forecasts 2017-2028
3.3 Global Wafer Thinning Equipment Revenue by Region: 2017 VS 2021 VS 2028
3.4 Global Wafer Thinning Equipment Sales by Region
3.4.1 Global Wafer Thinning Equipment Sales by Region (2017-2022)
3.4.2 Global Sales Wafer Thinning Equipment by Region (2023-2028)
3.5 Global Wafer Thinning Equipment Revenue by Region
3.5.1 Global Wafer Thinning Equipment Revenue by Region (2017-2022)
3.5.2 Global Wafer Thinning Equipment Revenue by Region (2023-2028)
3.6 North America
3.7 Europe
3.8 Asia-Pacific
3.9 Latin America
3.10 Middle East & Africa
4 Competition by Manufactures
4.1 Global Wafer Thinning Equipment Production Capacity by Manufacturers
4.2 Global Wafer Thinning Equipment Sales by Manufacturers
4.2.1 Global Wafer Thinning Equipment Sales by Manufacturers (2017-2022)
4.2.2 Global Wafer Thinning Equipment Sales Market Share by Manufacturers (2017-2022)
4.2.3 Global Top 10 and Top 5 Largest Manufacturers of Wafer Thinning Equipment in 2021
4.3 Global Wafer Thinning Equipment Revenue by Manufacturers
4.3.1 Global Wafer Thinning Equipment Revenue by Manufacturers (2017-2022)
4.3.2 Global Wafer Thinning Equipment Revenue Market Share by Manufacturers (2017-2022)
4.3.3 Global Top 10 and Top 5 Companies by Wafer Thinning Equipment Revenue in 2021
4.4 Global Wafer Thinning Equipment Sales Price by Manufacturers
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global Wafer Thinning Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.5.3 Global Wafer Thinning Equipment Manufacturers Geographical Distribution
4.6 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global Wafer Thinning Equipment Sales by Type
5.1.1 Global Wafer Thinning Equipment Historical Sales by Type (2017-2022)
5.1.2 Global Wafer Thinning Equipment Forecasted Sales by Type (2023-2028)
5.1.3 Global Wafer Thinning Equipment Sales Market Share by Type (2017-2028)
5.2 Global Wafer Thinning Equipment Revenue by Type
5.2.1 Global Wafer Thinning Equipment Historical Revenue by Type (2017-2022)
5.2.2 Global Wafer Thinning Equipment Forecasted Revenue by Type (2023-2028)
5.2.3 Global Wafer Thinning Equipment Revenue Market Share by Type (2017-2028)
5.3 Global Wafer Thinning Equipment Price by Type
5.3.1 Global Wafer Thinning Equipment Price by Type (2017-2022)
5.3.2 Global Wafer Thinning Equipment Price Forecast by Type (2023-2028)
6 Market Size by Application
6.1 Global Wafer Thinning Equipment Sales by Application
6.1.1 Global Wafer Thinning Equipment Historical Sales by Application (2017-2022)
6.1.2 Global Wafer Thinning Equipment Forecasted Sales by Application (2023-2028)
6.1.3 Global Wafer Thinning Equipment Sales Market Share by Application (2017-2028)
6.2 Global Wafer Thinning Equipment Revenue by Application
6.2.1 Global Wafer Thinning Equipment Historical Revenue by Application (2017-2022)
6.2.2 Global Wafer Thinning Equipment Forecasted Revenue by Application (2023-2028)
6.2.3 Global Wafer Thinning Equipment Revenue Market Share by Application (2017-2028)
6.3 Global Wafer Thinning Equipment Price by Application
6.3.1 Global Wafer Thinning Equipment Price by Application (2017-2022)
6.3.2 Global Wafer Thinning Equipment Price Forecast by Application (2023-2028)
7 North America
7.1 North America Wafer Thinning Equipment Market Size by Type
7.1.1 North America Wafer Thinning Equipment Sales by Type (2017-2028)
7.1.2 North America Wafer Thinning Equipment Revenue by Type (2017-2028)
7.2 North America Wafer Thinning Equipment Market Size by Application
7.2.1 North America Wafer Thinning Equipment Sales by Application (2017-2028)
7.2.2 North America Wafer Thinning Equipment Revenue by Application (2017-2028)
7.3 North America Wafer Thinning Equipment Sales by Country
7.3.1 North America Wafer Thinning Equipment Sales by Country (2017-2028)
7.3.2 North America Wafer Thinning Equipment Revenue by Country (2017-2028)
7.3.3 United States
7.3.4 Canada
8 Europe
8.1 Europe Wafer Thinning Equipment Market Size by Type
8.1.1 Europe Wafer Thinning Equipment Sales by Type (2017-2028)
8.1.2 Europe Wafer Thinning Equipment Revenue by Type (2017-2028)
8.2 Europe Wafer Thinning Equipment Market Size by Application
8.2.1 Europe Wafer Thinning Equipment Sales by Application (2017-2028)
8.2.2 Europe Wafer Thinning Equipment Revenue by Application (2017-2028)
8.3 Europe Wafer Thinning Equipment Sales by Country
8.3.1 Europe Wafer Thinning Equipment Sales by Country (2017-2028)
8.3.2 Europe Wafer Thinning Equipment Revenue by Country (2017-2028)
8.3.3 Germany
8.3.4 France
8.3.5 U.K.
8.3.6 Italy
8.3.7 Russia
9 Asia Pacific
9.1 Asia Pacific Wafer Thinning Equipment Market Size by Type
9.1.1 Asia Pacific Wafer Thinning Equipment Sales by Type (2017-2028)
9.1.2 Asia Pacific Wafer Thinning Equipment Revenue by Type (2017-2028)
9.2 Asia Pacific Wafer Thinning Equipment Market Size by Application
9.2.1 Asia Pacific Wafer Thinning Equipment Sales by Application (2017-2028)
9.2.2 Asia Pacific Wafer Thinning Equipment Revenue by Application (2017-2028)
9.3 Asia Pacific Wafer Thinning Equipment Sales by Region
9.3.1 Asia Pacific Wafer Thinning Equipment Sales by Region (2017-2028)
9.3.2 Asia Pacific Wafer Thinning Equipment Revenue by Region (2017-2028)
9.3.3 China
9.3.4 Japan
9.3.5 South Korea
9.3.6 India
9.3.7 Australia
9.3.8 China Taiwan
9.3.9 Indonesia
9.3.10 Thailand
9.3.11 Malaysia
10 Latin America
10.1 Latin America Wafer Thinning Equipment Market Size by Type
10.1.1 Latin America Wafer Thinning Equipment Sales by Type (2017-2028)
10.1.2 Latin America Wafer Thinning Equipment Revenue by Type (2017-2028)
10.2 Latin America Wafer Thinning Equipment Market Size by Application
10.2.1 Latin America Wafer Thinning Equipment Sales by Application (2017-2028)
10.2.2 Latin America Wafer Thinning Equipment Revenue by Application (2017-2028)
10.3 Latin America Wafer Thinning Equipment Sales by Country
10.3.1 Latin America Wafer Thinning Equipment Sales by Country (2017-2028)
10.3.2 Latin America Wafer Thinning Equipment Revenue by Country (2017-2028)
10.3.3 Mexico
10.3.4 Brazil
10.3.5 Argentina
10.3.6 Colombia
11 Middle East and Africa
11.1 Middle East and Africa Wafer Thinning Equipment Market Size by Type
11.1.1 Middle East and Africa Wafer Thinning Equipment Sales by Type (2017-2028)
11.1.2 Middle East and Africa Wafer Thinning Equipment Revenue by Type (2017-2028)
11.2 Middle East and Africa Wafer Thinning Equipment Market Size by Application
11.2.1 Middle East and Africa Wafer Thinning Equipment Sales by Application (2017-2028)
11.2.2 Middle East and Africa Wafer Thinning Equipment Revenue by Application (2017-2028)
11.3 Middle East and Africa Wafer Thinning Equipment Sales by Country
11.3.1 Middle East and Africa Wafer Thinning Equipment Sales by Country (2017-2028)
11.3.2 Middle East and Africa Wafer Thinning Equipment Revenue by Country (2017-2028)
11.3.3 Turkey
11.3.4 Saudi Arabia
11.3.5 UAE
12 Corporate Profiles
12.1 DISCO
12.1.1 DISCO Corporation Information
12.1.2 DISCO Overview
12.1.3 DISCO Wafer Thinning Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.1.4 DISCO Wafer Thinning Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 DISCO Recent Developments
12.2 Tokyo Seimitsu
12.2.1 Tokyo Seimitsu Corporation Information
12.2.2 Tokyo Seimitsu Overview
12.2.3 Tokyo Seimitsu Wafer Thinning Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.2.4 Tokyo Seimitsu Wafer Thinning Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Tokyo Seimitsu Recent Developments
12.3 Arnold Gruppe
12.3.1 Arnold Gruppe Corporation Information
12.3.2 Arnold Gruppe Overview
12.3.3 Arnold Gruppe Wafer Thinning Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.3.4 Arnold Gruppe Wafer Thinning Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 Arnold Gruppe Recent Developments
12.4 GigaMat
12.4.1 GigaMat Corporation Information
12.4.2 GigaMat Overview
12.4.3 GigaMat Wafer Thinning Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.4.4 GigaMat Wafer Thinning Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 GigaMat Recent Developments
12.5 Strasbaugh
12.5.1 Strasbaugh Corporation Information
12.5.2 Strasbaugh Overview
12.5.3 Strasbaugh Wafer Thinning Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.5.4 Strasbaugh Wafer Thinning Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 Strasbaugh Recent Developments
12.6 Daitron
12.6.1 Daitron Corporation Information
12.6.2 Daitron Overview
12.6.3 Daitron Wafer Thinning Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.6.4 Daitron Wafer Thinning Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 Daitron Recent Developments
12.7 Dynavest
12.7.1 Dynavest Corporation Information
12.7.2 Dynavest Overview
12.7.3 Dynavest Wafer Thinning Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.7.4 Dynavest Wafer Thinning Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 Dynavest Recent Developments
12.8 CETC
12.8.1 CETC Corporation Information
12.8.2 CETC Overview
12.8.3 CETC Wafer Thinning Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.8.4 CETC Wafer Thinning Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 CETC Recent Developments
12.9 Hwatsing Technology Co.,Ltd.
12.9.1 Hwatsing Technology Co.,Ltd. Corporation Information
12.9.2 Hwatsing Technology Co.,Ltd. Overview
12.9.3 Hwatsing Technology Co.,Ltd. Wafer Thinning Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.9.4 Hwatsing Technology Co.,Ltd. Wafer Thinning Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 Hwatsing Technology Co.,Ltd. Recent Developments
12.10 Zhejiang Jingsheng Mechanical & Electrical Co.,Ltd.
12.10.1 Zhejiang Jingsheng Mechanical & Electrical Co.,Ltd. Corporation Information
12.10.2 Zhejiang Jingsheng Mechanical & Electrical Co.,Ltd. Overview
12.10.3 Zhejiang Jingsheng Mechanical & Electrical Co.,Ltd. Wafer Thinning Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.10.4 Zhejiang Jingsheng Mechanical & Electrical Co.,Ltd. Wafer Thinning Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 Zhejiang Jingsheng Mechanical & Electrical Co.,Ltd. Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 Wafer Thinning Equipment Industry Chain Analysis
13.2 Wafer Thinning Equipment Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 Wafer Thinning Equipment Production Mode & Process
13.4 Wafer Thinning Equipment Sales and Marketing
13.4.1 Wafer Thinning Equipment Sales Channels
13.4.2 Wafer Thinning Equipment Distributors
13.5 Wafer Thinning Equipment Customers
14 Market Drivers, Opportunities, Challenges and Risks Factors Analysis
14.1 Wafer Thinning Equipment Industry Trends
14.2 Wafer Thinning Equipment Market Drivers
14.3 Wafer Thinning Equipment Market Challenges
14.4 Wafer Thinning Equipment Market Restraints
15 Key Finding in The Global Wafer Thinning Equipment Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer

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世界のウェハ薄化装置市場インサイト及び予測（全自動、半自動）

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