カテゴリー： QYResearch, 世界, 産業機械/建設

ウェーハパッケージング/試験装置のグローバル市場2023年：ウェーハエッジ研削、ウェーハダイシングマシン、ウェーハテスタ、ウェーハソータ、ウェーハプローバ

◆英語タイトル：Global Wafer Packaging and Testing Equipment Market Research Report 2023

QYResearchが発行した調査報告書（QYR23MA7377）◆商品コード：QYR23MA7377
◆発行会社（リサーチ会社）：QYResearch
◆発行日：2023年3月
◆ページ数：116
◆レポート形式：英語 / PDF
◆納品方法：Eメール（受注後2-3営業日）
◆調査対象地域：グローバル
◆産業分野：産業機械
◆販売価格オプション（消費税別）
Single User（1名様閲覧用）USD2,900 ⇒換算￥440,800見積依頼/購入/質問フォーム
Multi User（5名様閲覧用）USD4,350 ⇒換算￥661,200見積依頼/購入/質問フォーム
Enterprise License（同一法人内共有可）USD5,800 ⇒換算￥881,600見積依頼/購入/質問フォーム
※販売価格オプションの説明はこちらで、ご利用ガイドはこちらでご確認いただけます。
※お支払金額は「換算金額（日本円）＋消費税＋配送料（Eメール納品は無料）」です。
※Eメールによる納品の場合、通常ご注文当日～2日以内に納品致します。
※レポート納品後、納品日＋5日以内に請求書を発行・送付致します。（請求書発行日より2ヶ月以内の銀行振込条件、カード払いに変更可）
※上記の日本語題名はH&Iグローバルリサーチが翻訳したものです。英語版原本には日本語表記はありません。
※為替レートは適宜修正・更新しております。リアルタイム更新ではありません。

❖ レポートの概要 ❖

本調査レポートは世界のウェーハパッケージング/試験装置市場について調査・分析し、世界のウェーハパッケージング/試験装置市場概要、メーカー別競争状況、地域別生産量、地域別消費量、タイプ別セグメント分析（ウェーハエッジ研削、ウェーハダイシングマシン、ウェーハテスタ、ウェーハソータ、ウェーハプローバ）、用途別セグメント分析（自動車/運輸、家電、通信、その他）、主要企業のプロファイル、市場動向などに関する情報を掲載しています。主要企業としては、Tokyo Seimitsu、Besi、DISCO Corporation、TOWA Corporation、Toray Engineering、China Electronics Technology Group、Revasum、GL Tech Co、Dynatex International、Jiangsu Jing Chuang Advanced Electronic Technology、Cohu, Inc.、Hangzhou ChangChuan Technology Co.,Ltd.、Japan Electronic Materials、FormFactor, Inc、Teradyne、ASM Pacific Technology、Kulicke & Soffa Industries、KLA-Tencor、Camtek、Applied Materials、JHT Design、Advantest Corporation、Okamoto Semiconductor Equipment Division、WAIDA MFG、Hunan Yujing Machinery、Onto Innovation、SEMES、Optimation Technology, Inc.、Yamaha Motor Robotics Holdingsなどが含まれています。世界のウェーハパッケージング/試験装置市場は、2022年にXXX米ドル、2029年にはXXX米ドルに達すると予測され、予測期間中の年平均成長率はXXX％です。COVID-19とロシア・ウクライナ戦争による影響は、ウェーハパッケージング/試験装置市場規模を推定する際に考慮しました。

・ウェーハパッケージング/試験装置市場の概要
- 製品の定義
- ウェーハパッケージング/試験装置のタイプ別セグメント
- 世界のウェーハパッケージング/試験装置市場成長率のタイプ別分析（ウェーハエッジ研削、ウェーハダイシングマシン、ウェーハテスタ、ウェーハソータ、ウェーハプローバ）
- ウェーハパッケージング/試験装置の用途別セグメント
- 世界のウェーハパッケージング/試験装置市場成長率の用途別分析（自動車/運輸、家電、通信、その他）
- 世界市場の成長展望
- 世界のウェーハパッケージング/試験装置生産量の推定と予測（2018年-2029年）
- 世界のウェーハパッケージング/試験装置生産能力の推定と予測（2018年-2029年）
- ウェーハパッケージング/試験装置の平均価格の推定と予測（2018年-2029年）
- 前提条件と制限事項

・メーカー別競争状況
- メーカー別市場シェア
- 世界の主要メーカー、業界ランキング分析
- メーカー別平均価格
- ウェーハパッケージング/試験装置市場の競争状況およびトレンド

・ウェーハパッケージング/試験装置の地域別生産量
- ウェーハパッケージング/試験装置生産量の地域別推計と予測（2018年-2029年）
- 地域別ウェーハパッケージング/試験装置価格分析（2018年-2023年）
- 北米のウェーハパッケージング/試験装置生産規模（2018年-2029年）
- ヨーロッパのウェーハパッケージング/試験装置生産規模（2018年-2029年）
- 中国のウェーハパッケージング/試験装置生産規模（2018年-2029年）
- 日本のウェーハパッケージング/試験装置生産規模（2018年-2029年）
- 韓国のウェーハパッケージング/試験装置生産規模（2018年-2029年）
- インドのウェーハパッケージング/試験装置生産規模（2018年-2029年）

・ウェーハパッケージング/試験装置の地域別消費量
- ウェーハパッケージング/試験装置消費量の地域別推計と予測（2018年-2029年）
- 北米のウェーハパッケージング/試験装置消費量（2018年-2029年）
- アメリカのウェーハパッケージング/試験装置消費量（2018年-2029年）
- ヨーロッパのウェーハパッケージング/試験装置消費量（2018年-2029年）
- アジア太平洋のウェーハパッケージング/試験装置消費量（2018年-2029年）
- 中国のウェーハパッケージング/試験装置消費量（2018年-2029年）
- 日本のウェーハパッケージング/試験装置消費量（2018年-2029年）
- 韓国のウェーハパッケージング/試験装置消費量（2018年-2029年）
- 東南アジアのウェーハパッケージング/試験装置消費量（2018年-2029年）
- インドのウェーハパッケージング/試験装置消費量（2018年-2029年）
- 中南米・中東・アフリカのウェーハパッケージング/試験装置消費量（2018年-2029年）

・タイプ別セグメント：ウェーハエッジ研削、ウェーハダイシングマシン、ウェーハテスタ、ウェーハソータ、ウェーハプローバ
- 世界のウェーハパッケージング/試験装置のタイプ別生産量（2018年-2023年）
- 世界のウェーハパッケージング/試験装置のタイプ別生産量（2024年-2029年）
- 世界のウェーハパッケージング/試験装置のタイプ別価格

・用途別セグメント：自動車/運輸、家電、通信、その他
- 世界のウェーハパッケージング/試験装置の用途別生産量（2018年-2023年）
- 世界のウェーハパッケージング/試験装置の用途別生産量（2024年-2029年）
- 世界のウェーハパッケージング/試験装置の用途別価格

・主要企業のプロファイル：企業情報、製品ポートフォリオ、生産量、価格、動向
Tokyo Seimitsu、Besi、DISCO Corporation、TOWA Corporation、Toray Engineering、China Electronics Technology Group、Revasum、GL Tech Co、Dynatex International、Jiangsu Jing Chuang Advanced Electronic Technology、Cohu, Inc.、Hangzhou ChangChuan Technology Co.,Ltd.、Japan Electronic Materials、FormFactor, Inc、Teradyne、ASM Pacific Technology、Kulicke & Soffa Industries、KLA-Tencor、Camtek、Applied Materials、JHT Design、Advantest Corporation、Okamoto Semiconductor Equipment Division、WAIDA MFG、Hunan Yujing Machinery、Onto Innovation、SEMES、Optimation Technology, Inc.、Yamaha Motor Robotics Holdings

・産業チェーンと販売チャネルの分析
- ウェーハパッケージング/試験装置産業チェーン分析
- ウェーハパッケージング/試験装置の主要原材料
- ウェーハパッケージング/試験装置の販売チャネル
- ウェーハパッケージング/試験装置のディストリビューター
- ウェーハパッケージング/試験装置の主要顧客

・ウェーハパッケージング/試験装置市場ダイナミクス
- ウェーハパッケージング/試験装置の業界動向
- ウェーハパッケージング/試験装置市場の成長ドライバ、課題、阻害要因

・調査成果および結論

・調査方法とデータソース

The global Wafer Packaging and Testing Equipment market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Wafer Packaging and Testing Equipment is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Wafer Packaging and Testing Equipment is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Wafer Packaging and Testing Equipment include Tokyo Seimitsu, Besi, DISCO Corporation, TOWA Corporation, Toray Engineering, China Electronics Technology Group, Revasum, GL Tech Co and Dynatex International, etc. In 2022, the world’s top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Wafer Packaging and Testing Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Packaging and Testing Equipment.
The Wafer Packaging and Testing Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Wafer Packaging and Testing Equipment market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Packaging and Testing Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Tokyo Seimitsu
Besi
DISCO Corporation
TOWA Corporation
Toray Engineering
China Electronics Technology Group
Revasum
GL Tech Co
Dynatex International
Jiangsu Jing Chuang Advanced Electronic Technology
Cohu, Inc.
Hangzhou ChangChuan Technology Co.,Ltd.
Japan Electronic Materials
FormFactor, Inc
Teradyne
ASM Pacific Technology
Kulicke & Soffa Industries
KLA-Tencor
Camtek
Applied Materials
JHT Design
Advantest Corporation
Okamoto Semiconductor Equipment Division
WAIDA MFG
Hunan Yujing Machinery
Onto Innovation
SEMES
Optimation Technology, Inc.
Yamaha Motor Robotics Holdings
Segment by Type
Wafer Edge Grinding
Wafer Dicing Machine
Wafer Tester
Wafer Sorter
Wafer Prober
Segment by Application
Auto and Transportation
Consumer Electronics
Communications
Other
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Packaging and Testing Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Wafer Packaging and Testing Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Wafer Packaging and Testing Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

❖ レポートの目次 ❖

1 Wafer Packaging and Testing Equipment Market Overview
1.1 Product Definition
1.2 Wafer Packaging and Testing Equipment Segment by Type
1.2.1 Global Wafer Packaging and Testing Equipment Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Wafer Edge Grinding
1.2.3 Wafer Dicing Machine
1.2.4 Wafer Tester
1.2.5 Wafer Sorter
1.2.6 Wafer Prober
1.3 Wafer Packaging and Testing Equipment Segment by Application
1.3.1 Global Wafer Packaging and Testing Equipment Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Auto and Transportation
1.3.3 Consumer Electronics
1.3.4 Communications
1.3.5 Other
1.4 Global Market Growth Prospects
1.4.1 Global Wafer Packaging and Testing Equipment Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Wafer Packaging and Testing Equipment Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Wafer Packaging and Testing Equipment Production Estimates and Forecasts (2018-2029)
1.4.4 Global Wafer Packaging and Testing Equipment Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Wafer Packaging and Testing Equipment Production Market Share by Manufacturers (2018-2023)
2.2 Global Wafer Packaging and Testing Equipment Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Wafer Packaging and Testing Equipment, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Wafer Packaging and Testing Equipment Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Wafer Packaging and Testing Equipment Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Wafer Packaging and Testing Equipment, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Wafer Packaging and Testing Equipment, Product Offered and Application
2.8 Global Key Manufacturers of Wafer Packaging and Testing Equipment, Date of Enter into This Industry
2.9 Wafer Packaging and Testing Equipment Market Competitive Situation and Trends
2.9.1 Wafer Packaging and Testing Equipment Market Concentration Rate
2.9.2 Global 5 and 10 Largest Wafer Packaging and Testing Equipment Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Wafer Packaging and Testing Equipment Production by Region
3.1 Global Wafer Packaging and Testing Equipment Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Wafer Packaging and Testing Equipment Production Value by Region (2018-2029)
3.2.1 Global Wafer Packaging and Testing Equipment Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Wafer Packaging and Testing Equipment by Region (2024-2029)
3.3 Global Wafer Packaging and Testing Equipment Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Wafer Packaging and Testing Equipment Production by Region (2018-2029)
3.4.1 Global Wafer Packaging and Testing Equipment Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Wafer Packaging and Testing Equipment by Region (2024-2029)
3.5 Global Wafer Packaging and Testing Equipment Market Price Analysis by Region (2018-2023)
3.6 Global Wafer Packaging and Testing Equipment Production and Value, Year-over-Year Growth
3.6.1 North America Wafer Packaging and Testing Equipment Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Wafer Packaging and Testing Equipment Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Wafer Packaging and Testing Equipment Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Wafer Packaging and Testing Equipment Production Value Estimates and Forecasts (2018-2029)
4 Wafer Packaging and Testing Equipment Consumption by Region
4.1 Global Wafer Packaging and Testing Equipment Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Wafer Packaging and Testing Equipment Consumption by Region (2018-2029)
4.2.1 Global Wafer Packaging and Testing Equipment Consumption by Region (2018-2023)
4.2.2 Global Wafer Packaging and Testing Equipment Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Wafer Packaging and Testing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Wafer Packaging and Testing Equipment Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Wafer Packaging and Testing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Wafer Packaging and Testing Equipment Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Wafer Packaging and Testing Equipment Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Wafer Packaging and Testing Equipment Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Wafer Packaging and Testing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Wafer Packaging and Testing Equipment Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Wafer Packaging and Testing Equipment Production by Type (2018-2029)
5.1.1 Global Wafer Packaging and Testing Equipment Production by Type (2018-2023)
5.1.2 Global Wafer Packaging and Testing Equipment Production by Type (2024-2029)
5.1.3 Global Wafer Packaging and Testing Equipment Production Market Share by Type (2018-2029)
5.2 Global Wafer Packaging and Testing Equipment Production Value by Type (2018-2029)
5.2.1 Global Wafer Packaging and Testing Equipment Production Value by Type (2018-2023)
5.2.2 Global Wafer Packaging and Testing Equipment Production Value by Type (2024-2029)
5.2.3 Global Wafer Packaging and Testing Equipment Production Value Market Share by Type (2018-2029)
5.3 Global Wafer Packaging and Testing Equipment Price by Type (2018-2029)
6 Segment by Application
6.1 Global Wafer Packaging and Testing Equipment Production by Application (2018-2029)
6.1.1 Global Wafer Packaging and Testing Equipment Production by Application (2018-2023)
6.1.2 Global Wafer Packaging and Testing Equipment Production by Application (2024-2029)
6.1.3 Global Wafer Packaging and Testing Equipment Production Market Share by Application (2018-2029)
6.2 Global Wafer Packaging and Testing Equipment Production Value by Application (2018-2029)
6.2.1 Global Wafer Packaging and Testing Equipment Production Value by Application (2018-2023)
6.2.2 Global Wafer Packaging and Testing Equipment Production Value by Application (2024-2029)
6.2.3 Global Wafer Packaging and Testing Equipment Production Value Market Share by Application (2018-2029)
6.3 Global Wafer Packaging and Testing Equipment Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Tokyo Seimitsu
7.1.1 Tokyo Seimitsu Wafer Packaging and Testing Equipment Corporation Information
7.1.2 Tokyo Seimitsu Wafer Packaging and Testing Equipment Product Portfolio
7.1.3 Tokyo Seimitsu Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Tokyo Seimitsu Main Business and Markets Served
7.1.5 Tokyo Seimitsu Recent Developments/Updates
7.2 Besi
7.2.1 Besi Wafer Packaging and Testing Equipment Corporation Information
7.2.2 Besi Wafer Packaging and Testing Equipment Product Portfolio
7.2.3 Besi Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Besi Main Business and Markets Served
7.2.5 Besi Recent Developments/Updates
7.3 DISCO Corporation
7.3.1 DISCO Corporation Wafer Packaging and Testing Equipment Corporation Information
7.3.2 DISCO Corporation Wafer Packaging and Testing Equipment Product Portfolio
7.3.3 DISCO Corporation Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.3.4 DISCO Corporation Main Business and Markets Served
7.3.5 DISCO Corporation Recent Developments/Updates
7.4 TOWA Corporation
7.4.1 TOWA Corporation Wafer Packaging and Testing Equipment Corporation Information
7.4.2 TOWA Corporation Wafer Packaging and Testing Equipment Product Portfolio
7.4.3 TOWA Corporation Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.4.4 TOWA Corporation Main Business and Markets Served
7.4.5 TOWA Corporation Recent Developments/Updates
7.5 Toray Engineering
7.5.1 Toray Engineering Wafer Packaging and Testing Equipment Corporation Information
7.5.2 Toray Engineering Wafer Packaging and Testing Equipment Product Portfolio
7.5.3 Toray Engineering Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Toray Engineering Main Business and Markets Served
7.5.5 Toray Engineering Recent Developments/Updates
7.6 China Electronics Technology Group
7.6.1 China Electronics Technology Group Wafer Packaging and Testing Equipment Corporation Information
7.6.2 China Electronics Technology Group Wafer Packaging and Testing Equipment Product Portfolio
7.6.3 China Electronics Technology Group Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.6.4 China Electronics Technology Group Main Business and Markets Served
7.6.5 China Electronics Technology Group Recent Developments/Updates
7.7 Revasum
7.7.1 Revasum Wafer Packaging and Testing Equipment Corporation Information
7.7.2 Revasum Wafer Packaging and Testing Equipment Product Portfolio
7.7.3 Revasum Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Revasum Main Business and Markets Served
7.7.5 Revasum Recent Developments/Updates
7.8 GL Tech Co
7.8.1 GL Tech Co Wafer Packaging and Testing Equipment Corporation Information
7.8.2 GL Tech Co Wafer Packaging and Testing Equipment Product Portfolio
7.8.3 GL Tech Co Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.8.4 GL Tech Co Main Business and Markets Served
7.7.5 GL Tech Co Recent Developments/Updates
7.9 Dynatex International
7.9.1 Dynatex International Wafer Packaging and Testing Equipment Corporation Information
7.9.2 Dynatex International Wafer Packaging and Testing Equipment Product Portfolio
7.9.3 Dynatex International Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Dynatex International Main Business and Markets Served
7.9.5 Dynatex International Recent Developments/Updates
7.10 Jiangsu Jing Chuang Advanced Electronic Technology
7.10.1 Jiangsu Jing Chuang Advanced Electronic Technology Wafer Packaging and Testing Equipment Corporation Information
7.10.2 Jiangsu Jing Chuang Advanced Electronic Technology Wafer Packaging and Testing Equipment Product Portfolio
7.10.3 Jiangsu Jing Chuang Advanced Electronic Technology Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Jiangsu Jing Chuang Advanced Electronic Technology Main Business and Markets Served
7.10.5 Jiangsu Jing Chuang Advanced Electronic Technology Recent Developments/Updates
7.11 Cohu, Inc.
7.11.1 Cohu, Inc. Wafer Packaging and Testing Equipment Corporation Information
7.11.2 Cohu, Inc. Wafer Packaging and Testing Equipment Product Portfolio
7.11.3 Cohu, Inc. Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Cohu, Inc. Main Business and Markets Served
7.11.5 Cohu, Inc. Recent Developments/Updates
7.12 Hangzhou ChangChuan Technology Co.,Ltd.
7.12.1 Hangzhou ChangChuan Technology Co.,Ltd. Wafer Packaging and Testing Equipment Corporation Information
7.12.2 Hangzhou ChangChuan Technology Co.,Ltd. Wafer Packaging and Testing Equipment Product Portfolio
7.12.3 Hangzhou ChangChuan Technology Co.,Ltd. Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Hangzhou ChangChuan Technology Co.,Ltd. Main Business and Markets Served
7.12.5 Hangzhou ChangChuan Technology Co.,Ltd. Recent Developments/Updates
7.13 Japan Electronic Materials
7.13.1 Japan Electronic Materials Wafer Packaging and Testing Equipment Corporation Information
7.13.2 Japan Electronic Materials Wafer Packaging and Testing Equipment Product Portfolio
7.13.3 Japan Electronic Materials Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Japan Electronic Materials Main Business and Markets Served
7.13.5 Japan Electronic Materials Recent Developments/Updates
7.14 FormFactor, Inc
7.14.1 FormFactor, Inc Wafer Packaging and Testing Equipment Corporation Information
7.14.2 FormFactor, Inc Wafer Packaging and Testing Equipment Product Portfolio
7.14.3 FormFactor, Inc Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.14.4 FormFactor, Inc Main Business and Markets Served
7.14.5 FormFactor, Inc Recent Developments/Updates
7.15 Teradyne
7.15.1 Teradyne Wafer Packaging and Testing Equipment Corporation Information
7.15.2 Teradyne Wafer Packaging and Testing Equipment Product Portfolio
7.15.3 Teradyne Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Teradyne Main Business and Markets Served
7.15.5 Teradyne Recent Developments/Updates
7.16 ASM Pacific Technology
7.16.1 ASM Pacific Technology Wafer Packaging and Testing Equipment Corporation Information
7.16.2 ASM Pacific Technology Wafer Packaging and Testing Equipment Product Portfolio
7.16.3 ASM Pacific Technology Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.16.4 ASM Pacific Technology Main Business and Markets Served
7.16.5 ASM Pacific Technology Recent Developments/Updates
7.17 Kulicke & Soffa Industries
7.17.1 Kulicke & Soffa Industries Wafer Packaging and Testing Equipment Corporation Information
7.17.2 Kulicke & Soffa Industries Wafer Packaging and Testing Equipment Product Portfolio
7.17.3 Kulicke & Soffa Industries Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.17.4 Kulicke & Soffa Industries Main Business and Markets Served
7.17.5 Kulicke & Soffa Industries Recent Developments/Updates
7.18 KLA-Tencor
7.18.1 KLA-Tencor Wafer Packaging and Testing Equipment Corporation Information
7.18.2 KLA-Tencor Wafer Packaging and Testing Equipment Product Portfolio
7.18.3 KLA-Tencor Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.18.4 KLA-Tencor Main Business and Markets Served
7.18.5 KLA-Tencor Recent Developments/Updates
7.19 Camtek
7.19.1 Camtek Wafer Packaging and Testing Equipment Corporation Information
7.19.2 Camtek Wafer Packaging and Testing Equipment Product Portfolio
7.19.3 Camtek Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.19.4 Camtek Main Business and Markets Served
7.19.5 Camtek Recent Developments/Updates
7.20 Applied Materials
7.20.1 Applied Materials Wafer Packaging and Testing Equipment Corporation Information
7.20.2 Applied Materials Wafer Packaging and Testing Equipment Product Portfolio
7.20.3 Applied Materials Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.20.4 Applied Materials Main Business and Markets Served
7.20.5 Applied Materials Recent Developments/Updates
7.21 JHT Design
7.21.1 JHT Design Wafer Packaging and Testing Equipment Corporation Information
7.21.2 JHT Design Wafer Packaging and Testing Equipment Product Portfolio
7.21.3 JHT Design Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.21.4 JHT Design Main Business and Markets Served
7.21.5 JHT Design Recent Developments/Updates
7.22 Advantest Corporation
7.22.1 Advantest Corporation Wafer Packaging and Testing Equipment Corporation Information
7.22.2 Advantest Corporation Wafer Packaging and Testing Equipment Product Portfolio
7.22.3 Advantest Corporation Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.22.4 Advantest Corporation Main Business and Markets Served
7.22.5 Advantest Corporation Recent Developments/Updates
7.23 Okamoto Semiconductor Equipment Division
7.23.1 Okamoto Semiconductor Equipment Division Wafer Packaging and Testing Equipment Corporation Information
7.23.2 Okamoto Semiconductor Equipment Division Wafer Packaging and Testing Equipment Product Portfolio
7.23.3 Okamoto Semiconductor Equipment Division Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.23.4 Okamoto Semiconductor Equipment Division Main Business and Markets Served
7.23.5 Okamoto Semiconductor Equipment Division Recent Developments/Updates
7.24 WAIDA MFG
7.24.1 WAIDA MFG Wafer Packaging and Testing Equipment Corporation Information
7.24.2 WAIDA MFG Wafer Packaging and Testing Equipment Product Portfolio
7.24.3 WAIDA MFG Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.24.4 WAIDA MFG Main Business and Markets Served
7.24.5 WAIDA MFG Recent Developments/Updates
7.25 Hunan Yujing Machinery
7.25.1 Hunan Yujing Machinery Wafer Packaging and Testing Equipment Corporation Information
7.25.2 Hunan Yujing Machinery Wafer Packaging and Testing Equipment Product Portfolio
7.25.3 Hunan Yujing Machinery Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.25.4 Hunan Yujing Machinery Main Business and Markets Served
7.25.5 Hunan Yujing Machinery Recent Developments/Updates
7.26 Onto Innovation
7.26.1 Onto Innovation Wafer Packaging and Testing Equipment Corporation Information
7.26.2 Onto Innovation Wafer Packaging and Testing Equipment Product Portfolio
7.26.3 Onto Innovation Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.26.4 Onto Innovation Main Business and Markets Served
7.26.5 Onto Innovation Recent Developments/Updates
7.27 SEMES
7.27.1 SEMES Wafer Packaging and Testing Equipment Corporation Information
7.27.2 SEMES Wafer Packaging and Testing Equipment Product Portfolio
7.27.3 SEMES Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.27.4 SEMES Main Business and Markets Served
7.27.5 SEMES Recent Developments/Updates
7.28 Optimation Technology, Inc.
7.28.1 Optimation Technology, Inc. Wafer Packaging and Testing Equipment Corporation Information
7.28.2 Optimation Technology, Inc. Wafer Packaging and Testing Equipment Product Portfolio
7.28.3 Optimation Technology, Inc. Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.28.4 Optimation Technology, Inc. Main Business and Markets Served
7.28.5 Optimation Technology, Inc. Recent Developments/Updates
7.29 Yamaha Motor Robotics Holdings
7.29.1 Yamaha Motor Robotics Holdings Wafer Packaging and Testing Equipment Corporation Information
7.29.2 Yamaha Motor Robotics Holdings Wafer Packaging and Testing Equipment Product Portfolio
7.29.3 Yamaha Motor Robotics Holdings Wafer Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.29.4 Yamaha Motor Robotics Holdings Main Business and Markets Served
7.29.5 Yamaha Motor Robotics Holdings Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Wafer Packaging and Testing Equipment Industry Chain Analysis
8.2 Wafer Packaging and Testing Equipment Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Wafer Packaging and Testing Equipment Production Mode & Process
8.4 Wafer Packaging and Testing Equipment Sales and Marketing
8.4.1 Wafer Packaging and Testing Equipment Sales Channels
8.4.2 Wafer Packaging and Testing Equipment Distributors
8.5 Wafer Packaging and Testing Equipment Customers
9 Wafer Packaging and Testing Equipment Market Dynamics
9.1 Wafer Packaging and Testing Equipment Industry Trends
9.2 Wafer Packaging and Testing Equipment Market Drivers
9.3 Wafer Packaging and Testing Equipment Market Challenges
9.4 Wafer Packaging and Testing Equipment Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer



❖ 免責事項 ❖
http://www.globalresearch.jp/disclaimer
★リサーチレポート[ ウェーハパッケージング/試験装置のグローバル市場2023年：ウェーハエッジ研削、ウェーハダイシングマシン、ウェーハテスタ、ウェーハソータ、ウェーハプローバ(Global Wafer Packaging and Testing Equipment Market Research Report 2023)]についてメールでお問い合わせはこちらでお願いします。
◆関連リサーチレポート◆
  • 実験室土壌試験装置のグローバル市場2023年：手動型、半自動型、自動型
  • ウェーハグラインダー（ウェーハ薄化装置）のグローバル市場2023年：全自動、半自動
  • 全自動ウェハーレーザーマーキングマシンのグローバル市場2023年：2ビームマーカ、4ビームマーカ
  • 世界のソーラーウェハー検査装置市場インサイト及び予測（ソーラーウェハーライフタイム測定装置、ソーラーウェハー材料特性分析装置、ソーラーウェハー抵抗率検査装置、ソーラーウェハー視覚検査装置）
  • 世界の包装試験機市場インサイト及び予測（引張強さ試験装置、圧縮試験装置、落下試験装置、その他）