カテゴリー： IT/電子, QYResearch, 世界

半導体用ICパッケージ基板のグローバル市場2023年：リジッドパッケージ基板、フレキシブルパッケージ基板、セラミックパッケージ基板

◆英語タイトル：Global Semiconductor IC Package Substrate Market Research Report 2023

QYResearchが発行した調査報告書（QYR23MA3954）◆商品コード：QYR23MA3954
◆発行会社（リサーチ会社）：QYResearch
◆発行日：2023年3月
◆ページ数：105
◆レポート形式：英語 / PDF
◆納品方法：Eメール（受注後2-3営業日）
◆調査対象地域：グローバル
◆産業分野：電子＆半導体
◆販売価格オプション（消費税別）
Single User（1名様閲覧用）USD2,900 ⇒換算￥440,800見積依頼/購入/質問フォーム
Multi User（5名様閲覧用）USD4,350 ⇒換算￥661,200見積依頼/購入/質問フォーム
Enterprise License（同一法人内共有可）USD5,800 ⇒換算￥881,600見積依頼/購入/質問フォーム
※販売価格オプションの説明はこちらで、ご利用ガイドはこちらでご確認いただけます。
※お支払金額は「換算金額（日本円）＋消費税＋配送料（Eメール納品は無料）」です。
※Eメールによる納品の場合、通常ご注文当日～2日以内に納品致します。
※レポート納品後、納品日＋5日以内に請求書を発行・送付致します。（請求書発行日より2ヶ月以内の銀行振込条件、カード払いに変更可）
※上記の日本語題名はH&Iグローバルリサーチが翻訳したものです。英語版原本には日本語表記はありません。
※為替レートは適宜修正・更新しております。リアルタイム更新ではありません。

❖ レポートの概要 ❖

本調査レポートは世界の半導体用ICパッケージ基板市場について調査・分析し、世界の半導体用ICパッケージ基板市場概要、メーカー別競争状況、地域別生産量、地域別消費量、タイプ別セグメント分析（リジッドパッケージ基板、フレキシブルパッケージ基板、セラミックパッケージ基板）、用途別セグメント分析（3Cエレクトロニクス、自動車/運輸、IT/通信、その他）、主要企業のプロファイル、市場動向などに関する情報を掲載しています。主要企業としては、ASE Metarial、SEM、Unimicron、Ibiden、Shinko Electric Industries、Kinsus、Nanya、AT&S、Kyocera、Daeduck Electronics、Shennan Circuit、Shenzhen Fastprint Circuit Technology、TTM Technologies、Simmtech、LG InnoTekなどが含まれています。世界の半導体用ICパッケージ基板市場は、2022年にXXX米ドル、2029年にはXXX米ドルに達すると予測され、予測期間中の年平均成長率はXXX％です。COVID-19とロシア・ウクライナ戦争による影響は、半導体用ICパッケージ基板市場規模を推定する際に考慮しました。

・半導体用ICパッケージ基板市場の概要
- 製品の定義
- 半導体用ICパッケージ基板のタイプ別セグメント
- 世界の半導体用ICパッケージ基板市場成長率のタイプ別分析（リジッドパッケージ基板、フレキシブルパッケージ基板、セラミックパッケージ基板）
- 半導体用ICパッケージ基板の用途別セグメント
- 世界の半導体用ICパッケージ基板市場成長率の用途別分析（3Cエレクトロニクス、自動車/運輸、IT/通信、その他）
- 世界市場の成長展望
- 世界の半導体用ICパッケージ基板生産量の推定と予測（2018年-2029年）
- 世界の半導体用ICパッケージ基板生産能力の推定と予測（2018年-2029年）
- 半導体用ICパッケージ基板の平均価格の推定と予測（2018年-2029年）
- 前提条件と制限事項

・メーカー別競争状況
- メーカー別市場シェア
- 世界の主要メーカー、業界ランキング分析
- メーカー別平均価格
- 半導体用ICパッケージ基板市場の競争状況およびトレンド

・半導体用ICパッケージ基板の地域別生産量
- 半導体用ICパッケージ基板生産量の地域別推計と予測（2018年-2029年）
- 地域別半導体用ICパッケージ基板価格分析（2018年-2023年）
- 北米の半導体用ICパッケージ基板生産規模（2018年-2029年）
- ヨーロッパの半導体用ICパッケージ基板生産規模（2018年-2029年）
- 中国の半導体用ICパッケージ基板生産規模（2018年-2029年）
- 日本の半導体用ICパッケージ基板生産規模（2018年-2029年）
- 韓国の半導体用ICパッケージ基板生産規模（2018年-2029年）
- インドの半導体用ICパッケージ基板生産規模（2018年-2029年）

・半導体用ICパッケージ基板の地域別消費量
- 半導体用ICパッケージ基板消費量の地域別推計と予測（2018年-2029年）
- 北米の半導体用ICパッケージ基板消費量（2018年-2029年）
- アメリカの半導体用ICパッケージ基板消費量（2018年-2029年）
- ヨーロッパの半導体用ICパッケージ基板消費量（2018年-2029年）
- アジア太平洋の半導体用ICパッケージ基板消費量（2018年-2029年）
- 中国の半導体用ICパッケージ基板消費量（2018年-2029年）
- 日本の半導体用ICパッケージ基板消費量（2018年-2029年）
- 韓国の半導体用ICパッケージ基板消費量（2018年-2029年）
- 東南アジアの半導体用ICパッケージ基板消費量（2018年-2029年）
- インドの半導体用ICパッケージ基板消費量（2018年-2029年）
- 中南米・中東・アフリカの半導体用ICパッケージ基板消費量（2018年-2029年）

・タイプ別セグメント：リジッドパッケージ基板、フレキシブルパッケージ基板、セラミックパッケージ基板
- 世界の半導体用ICパッケージ基板のタイプ別生産量（2018年-2023年）
- 世界の半導体用ICパッケージ基板のタイプ別生産量（2024年-2029年）
- 世界の半導体用ICパッケージ基板のタイプ別価格

・用途別セグメント：3Cエレクトロニクス、自動車/運輸、IT/通信、その他
- 世界の半導体用ICパッケージ基板の用途別生産量（2018年-2023年）
- 世界の半導体用ICパッケージ基板の用途別生産量（2024年-2029年）
- 世界の半導体用ICパッケージ基板の用途別価格

・主要企業のプロファイル：企業情報、製品ポートフォリオ、生産量、価格、動向
ASE Metarial、SEM、Unimicron、Ibiden、Shinko Electric Industries、Kinsus、Nanya、AT&S、Kyocera、Daeduck Electronics、Shennan Circuit、Shenzhen Fastprint Circuit Technology、TTM Technologies、Simmtech、LG InnoTek

・産業チェーンと販売チャネルの分析
- 半導体用ICパッケージ基板産業チェーン分析
- 半導体用ICパッケージ基板の主要原材料
- 半導体用ICパッケージ基板の販売チャネル
- 半導体用ICパッケージ基板のディストリビューター
- 半導体用ICパッケージ基板の主要顧客

・半導体用ICパッケージ基板市場ダイナミクス
- 半導体用ICパッケージ基板の業界動向
- 半導体用ICパッケージ基板市場の成長ドライバ、課題、阻害要因

・調査成果および結論

・調査方法とデータソース

The global Semiconductor IC Package Substrate market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Semiconductor IC Package Substrate is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Semiconductor IC Package Substrate is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Semiconductor IC Package Substrate include ASE Metarial, SEM, Unimicron, Ibiden, Shinko Electric Industries, Kinsus, Nanya, AT&S and Kyocera, etc. In 2022, the world’s top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Semiconductor IC Package Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor IC Package Substrate.
The Semiconductor IC Package Substrate market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Semiconductor IC Package Substrate market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor IC Package Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
ASE Metarial
SEM
Unimicron
Ibiden
Shinko Electric Industries
Kinsus
Nanya
AT&S
Kyocera
Daeduck Electronics
Shennan Circuit
Shenzhen Fastprint Circuit Technology
TTM Technologies
Simmtech
LG InnoTek
Segment by Type
Rigid Package Substrate
Flexible Packaging Substrate
Ceramic Package Substrate
Segment by Application
3C Electronics
Automotive and Transportation
IT and Telecom
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor IC Package Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor IC Package Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor IC Package Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

❖ レポートの目次 ❖

1 Semiconductor IC Package Substrate Market Overview
1.1 Product Definition
1.2 Semiconductor IC Package Substrate Segment by Type
1.2.1 Global Semiconductor IC Package Substrate Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Rigid Package Substrate
1.2.3 Flexible Packaging Substrate
1.2.4 Ceramic Package Substrate
1.3 Semiconductor IC Package Substrate Segment by Application
1.3.1 Global Semiconductor IC Package Substrate Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 3C Electronics
1.3.3 Automotive and Transportation
1.3.4 IT and Telecom
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor IC Package Substrate Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Semiconductor IC Package Substrate Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Semiconductor IC Package Substrate Production Estimates and Forecasts (2018-2029)
1.4.4 Global Semiconductor IC Package Substrate Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor IC Package Substrate Production Market Share by Manufacturers (2018-2023)
2.2 Global Semiconductor IC Package Substrate Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Semiconductor IC Package Substrate, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Semiconductor IC Package Substrate Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Semiconductor IC Package Substrate Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Semiconductor IC Package Substrate, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor IC Package Substrate, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor IC Package Substrate, Date of Enter into This Industry
2.9 Semiconductor IC Package Substrate Market Competitive Situation and Trends
2.9.1 Semiconductor IC Package Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor IC Package Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor IC Package Substrate Production by Region
3.1 Global Semiconductor IC Package Substrate Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Semiconductor IC Package Substrate Production Value by Region (2018-2029)
3.2.1 Global Semiconductor IC Package Substrate Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Semiconductor IC Package Substrate by Region (2024-2029)
3.3 Global Semiconductor IC Package Substrate Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Semiconductor IC Package Substrate Production by Region (2018-2029)
3.4.1 Global Semiconductor IC Package Substrate Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Semiconductor IC Package Substrate by Region (2024-2029)
3.5 Global Semiconductor IC Package Substrate Market Price Analysis by Region (2018-2023)
3.6 Global Semiconductor IC Package Substrate Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor IC Package Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Semiconductor IC Package Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Semiconductor IC Package Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Semiconductor IC Package Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Semiconductor IC Package Substrate Production Value Estimates and Forecasts (2018-2029)
4 Semiconductor IC Package Substrate Consumption by Region
4.1 Global Semiconductor IC Package Substrate Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Semiconductor IC Package Substrate Consumption by Region (2018-2029)
4.2.1 Global Semiconductor IC Package Substrate Consumption by Region (2018-2023)
4.2.2 Global Semiconductor IC Package Substrate Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Semiconductor IC Package Substrate Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Semiconductor IC Package Substrate Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor IC Package Substrate Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Semiconductor IC Package Substrate Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor IC Package Substrate Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Semiconductor IC Package Substrate Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor IC Package Substrate Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Semiconductor IC Package Substrate Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Semiconductor IC Package Substrate Production by Type (2018-2029)
5.1.1 Global Semiconductor IC Package Substrate Production by Type (2018-2023)
5.1.2 Global Semiconductor IC Package Substrate Production by Type (2024-2029)
5.1.3 Global Semiconductor IC Package Substrate Production Market Share by Type (2018-2029)
5.2 Global Semiconductor IC Package Substrate Production Value by Type (2018-2029)
5.2.1 Global Semiconductor IC Package Substrate Production Value by Type (2018-2023)
5.2.2 Global Semiconductor IC Package Substrate Production Value by Type (2024-2029)
5.2.3 Global Semiconductor IC Package Substrate Production Value Market Share by Type (2018-2029)
5.3 Global Semiconductor IC Package Substrate Price by Type (2018-2029)
6 Segment by Application
6.1 Global Semiconductor IC Package Substrate Production by Application (2018-2029)
6.1.1 Global Semiconductor IC Package Substrate Production by Application (2018-2023)
6.1.2 Global Semiconductor IC Package Substrate Production by Application (2024-2029)
6.1.3 Global Semiconductor IC Package Substrate Production Market Share by Application (2018-2029)
6.2 Global Semiconductor IC Package Substrate Production Value by Application (2018-2029)
6.2.1 Global Semiconductor IC Package Substrate Production Value by Application (2018-2023)
6.2.2 Global Semiconductor IC Package Substrate Production Value by Application (2024-2029)
6.2.3 Global Semiconductor IC Package Substrate Production Value Market Share by Application (2018-2029)
6.3 Global Semiconductor IC Package Substrate Price by Application (2018-2029)
7 Key Companies Profiled
7.1 ASE Metarial
7.1.1 ASE Metarial Semiconductor IC Package Substrate Corporation Information
7.1.2 ASE Metarial Semiconductor IC Package Substrate Product Portfolio
7.1.3 ASE Metarial Semiconductor IC Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.1.4 ASE Metarial Main Business and Markets Served
7.1.5 ASE Metarial Recent Developments/Updates
7.2 SEM
7.2.1 SEM Semiconductor IC Package Substrate Corporation Information
7.2.2 SEM Semiconductor IC Package Substrate Product Portfolio
7.2.3 SEM Semiconductor IC Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.2.4 SEM Main Business and Markets Served
7.2.5 SEM Recent Developments/Updates
7.3 Unimicron
7.3.1 Unimicron Semiconductor IC Package Substrate Corporation Information
7.3.2 Unimicron Semiconductor IC Package Substrate Product Portfolio
7.3.3 Unimicron Semiconductor IC Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Unimicron Main Business and Markets Served
7.3.5 Unimicron Recent Developments/Updates
7.4 Ibiden
7.4.1 Ibiden Semiconductor IC Package Substrate Corporation Information
7.4.2 Ibiden Semiconductor IC Package Substrate Product Portfolio
7.4.3 Ibiden Semiconductor IC Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Ibiden Main Business and Markets Served
7.4.5 Ibiden Recent Developments/Updates
7.5 Shinko Electric Industries
7.5.1 Shinko Electric Industries Semiconductor IC Package Substrate Corporation Information
7.5.2 Shinko Electric Industries Semiconductor IC Package Substrate Product Portfolio
7.5.3 Shinko Electric Industries Semiconductor IC Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Shinko Electric Industries Main Business and Markets Served
7.5.5 Shinko Electric Industries Recent Developments/Updates
7.6 Kinsus
7.6.1 Kinsus Semiconductor IC Package Substrate Corporation Information
7.6.2 Kinsus Semiconductor IC Package Substrate Product Portfolio
7.6.3 Kinsus Semiconductor IC Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Kinsus Main Business and Markets Served
7.6.5 Kinsus Recent Developments/Updates
7.7 Nanya
7.7.1 Nanya Semiconductor IC Package Substrate Corporation Information
7.7.2 Nanya Semiconductor IC Package Substrate Product Portfolio
7.7.3 Nanya Semiconductor IC Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Nanya Main Business and Markets Served
7.7.5 Nanya Recent Developments/Updates
7.8 AT&S
7.8.1 AT&S Semiconductor IC Package Substrate Corporation Information
7.8.2 AT&S Semiconductor IC Package Substrate Product Portfolio
7.8.3 AT&S Semiconductor IC Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.8.4 AT&S Main Business and Markets Served
7.7.5 AT&S Recent Developments/Updates
7.9 Kyocera
7.9.1 Kyocera Semiconductor IC Package Substrate Corporation Information
7.9.2 Kyocera Semiconductor IC Package Substrate Product Portfolio
7.9.3 Kyocera Semiconductor IC Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Kyocera Main Business and Markets Served
7.9.5 Kyocera Recent Developments/Updates
7.10 Daeduck Electronics
7.10.1 Daeduck Electronics Semiconductor IC Package Substrate Corporation Information
7.10.2 Daeduck Electronics Semiconductor IC Package Substrate Product Portfolio
7.10.3 Daeduck Electronics Semiconductor IC Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Daeduck Electronics Main Business and Markets Served
7.10.5 Daeduck Electronics Recent Developments/Updates
7.11 Shennan Circuit
7.11.1 Shennan Circuit Semiconductor IC Package Substrate Corporation Information
7.11.2 Shennan Circuit Semiconductor IC Package Substrate Product Portfolio
7.11.3 Shennan Circuit Semiconductor IC Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Shennan Circuit Main Business and Markets Served
7.11.5 Shennan Circuit Recent Developments/Updates
7.12 Shenzhen Fastprint Circuit Technology
7.12.1 Shenzhen Fastprint Circuit Technology Semiconductor IC Package Substrate Corporation Information
7.12.2 Shenzhen Fastprint Circuit Technology Semiconductor IC Package Substrate Product Portfolio
7.12.3 Shenzhen Fastprint Circuit Technology Semiconductor IC Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Shenzhen Fastprint Circuit Technology Main Business and Markets Served
7.12.5 Shenzhen Fastprint Circuit Technology Recent Developments/Updates
7.13 TTM Technologies
7.13.1 TTM Technologies Semiconductor IC Package Substrate Corporation Information
7.13.2 TTM Technologies Semiconductor IC Package Substrate Product Portfolio
7.13.3 TTM Technologies Semiconductor IC Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.13.4 TTM Technologies Main Business and Markets Served
7.13.5 TTM Technologies Recent Developments/Updates
7.14 Simmtech
7.14.1 Simmtech Semiconductor IC Package Substrate Corporation Information
7.14.2 Simmtech Semiconductor IC Package Substrate Product Portfolio
7.14.3 Simmtech Semiconductor IC Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Simmtech Main Business and Markets Served
7.14.5 Simmtech Recent Developments/Updates
7.15 LG InnoTek
7.15.1 LG InnoTek Semiconductor IC Package Substrate Corporation Information
7.15.2 LG InnoTek Semiconductor IC Package Substrate Product Portfolio
7.15.3 LG InnoTek Semiconductor IC Package Substrate Production, Value, Price and Gross Margin (2018-2023)
7.15.4 LG InnoTek Main Business and Markets Served
7.15.5 LG InnoTek Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor IC Package Substrate Industry Chain Analysis
8.2 Semiconductor IC Package Substrate Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor IC Package Substrate Production Mode & Process
8.4 Semiconductor IC Package Substrate Sales and Marketing
8.4.1 Semiconductor IC Package Substrate Sales Channels
8.4.2 Semiconductor IC Package Substrate Distributors
8.5 Semiconductor IC Package Substrate Customers
9 Semiconductor IC Package Substrate Market Dynamics
9.1 Semiconductor IC Package Substrate Industry Trends
9.2 Semiconductor IC Package Substrate Market Drivers
9.3 Semiconductor IC Package Substrate Market Challenges
9.4 Semiconductor IC Package Substrate Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer



❖ 免責事項 ❖
http://www.globalresearch.jp/disclaimer
★リサーチレポート[ 半導体用ICパッケージ基板のグローバル市場2023年：リジッドパッケージ基板、フレキシブルパッケージ基板、セラミックパッケージ基板(Global Semiconductor IC Package Substrate Market Research Report 2023)]についてメールでお問い合わせはこちらでお願いします。
◆関連リサーチレポート◆
  • 世界のPC用半導体包装基板市場インサイト及び予測（FC-BGA、FC-CSP、WB BGA、WB CSP）
  • 世界のモバイル装置用半導体包装基板市場インサイト及び予測（MCP / UTCSP、FC-CSP、SiP、PBGA / CSP、その他）
  • 世界の半導体包装用ガラス基板市場インサイト及び予測（直径300mm、直径200mm、その他）
  • 世界のPC用半導体包装基板市場2022年：FC-BGA、FC-CSP、WB BGA、WB CSP
  • 世界の移動式装置向け半導体包装基板市場2022年：MCP / UTCSP、FC-CSP、SiP、PBGA / CSP、その他