カテゴリー： IT/電子, QYResearch, 世界

世界のICパッケージ基板（SUB）市場インサイト及び予測（有機基板、無機基板、複合基板）

◆英語タイトル：Global IC Packaging Substrate (SUB) Market Insights, Forecast to 2028

QYResearchが発行した調査報告書（QY22JLX04492）◆商品コード：QY22JLX04492
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❖ レポートの概要 ❖

COVID-19のパンデミックにより、ICパッケージ基板（SUB）のグローバル市場規模は2022年にUS$xxxと推定され、調査期間中のCAGRはxxx％で、2028年までに再調整された規模はUS$xxxになると予測されています。この医療危機による経済変化を十分に考慮すると、2021年にICパッケージ基板（SUB）の世界市場のxxx％を占める「有機基板」タイプは、2028年までにUS$xxxの規模になり、パンデミック後の修正xxx％CAGRで成長すると予測されています。一方、「スマートフォン」セグメントは、この予測期間を通じてxxx％のCAGRに変更されます。
ICパッケージ基板（SUB）の中国市場規模は2021年にUS$xxxと分析されており、米国とヨーロッパの市場規模はそれぞれUS$xxxとUS$xxxです。米国の割合は2021年にxxx％であり、中国とヨーロッパはそれぞれxxx％とxxx％です。中国の割合は2028年にxxx％に達し、対象期間を通じてxxx％のCAGRを記録すると予測されています。日本、韓国、東南アジアはアジアで注目市場であり、今後6年間のCAGRはそれぞれxxx％、xxx％、xxx％になる見通しです。ヨーロッパのICパッケージ基板（SUB）市場については、ドイツは2028年までにUS$xxxに達すると予測されており、予測期間中のCAGRはxxx％になる見通しです。

ICパッケージ基板（SUB）のグローバル主要企業には、Samsung Electro-Mechanics、MST、NGK、KLA Corporation、Panasonic、Simmtech、Daeduck、ASE Material、Kyocera、Ibiden、Shinko Electric Industries、AT&S、LG InnoTek、Fastprint Circuit Tech、ACCESS、Danbond Technology、TTM Technologies、Unimicron、Nan Ya PCB、Kinsus、SCCなどがあります。2021年、世界のトップ5プレイヤーは売上ベースで約xxx％の市場シェアを占めています。

ICパッケージ基板（SUB）市場は、種類と用途によって区分されます。世界のICパッケージ基板（SUB）市場のプレーヤー、利害関係者、およびその他の参加者は、当レポートを有益なリソースとして使用することで優位に立つことができます。セグメント分析は、2017年～2028年期間のタイプ別および用途別の販売量、売上、予測に焦点を当てています。

【種類別セグメント】
有機基板、無機基板、複合基板

【用途別セグメント】
スマートフォン、PC（タブレット、ラップトップ）、ウェアラブルデバイス、その他

【掲載地域】
北米：アメリカ、カナダ
ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア
アジア太平洋：日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア
中南米：メキシコ、ブラジル、アルゼンチン
中東・アフリカ：トルコ、サウジアラビア、UAE

【目次（一部）】

・調査の範囲
- ICパッケージ基板（SUB）製品概要
- 種類別市場（有機基板、無機基板、複合基板）
- 用途別市場（スマートフォン、PC（タブレット、ラップトップ）、ウェアラブルデバイス、その他）
- 調査の目的
・エグゼクティブサマリー
- 世界のICパッケージ基板（SUB）販売量予測2017-2028
- 世界のICパッケージ基板（SUB）売上予測2017-2028
- ICパッケージ基板（SUB）の地域別販売量
- ICパッケージ基板（SUB）の地域別売上
- 北米市場
- ヨーロッパ市場
- アジア太平洋市場
- 中南米市場
- 中東・アフリカ市場
・メーカーの競争状況
- 主要メーカー別ICパッケージ基板（SUB）販売量
- 主要メーカー別ICパッケージ基板（SUB）売上
- 主要メーカー別ICパッケージ基板（SUB）価格
- 競争状況の分析
- 企業M&A動向
・種類別市場規模（有機基板、無機基板、複合基板）
- ICパッケージ基板（SUB）の種類別販売量
- ICパッケージ基板（SUB）の種類別売上
- ICパッケージ基板（SUB）の種類別価格
・用途別市場規模（スマートフォン、PC（タブレット、ラップトップ）、ウェアラブルデバイス、その他）
- ICパッケージ基板（SUB）の用途別販売量
- ICパッケージ基板（SUB）の用途別売上
- ICパッケージ基板（SUB）の用途別価格
・北米市場
- 北米のICパッケージ基板（SUB）市場規模（種類別、用途別）
- 主要国別のICパッケージ基板（SUB）市場規模（アメリカ、カナダ）
・ヨーロッパ市場
- ヨーロッパのICパッケージ基板（SUB）市場規模（種類別、用途別）
- 主要国別のICパッケージ基板（SUB）市場規模（ドイツ、フランス、イギリス、イタリア、ロシア）
・アジア太平洋市場
- アジア太平洋のICパッケージ基板（SUB）市場規模（種類別、用途別）
- 主要国別のICパッケージ基板（SUB）市場規模（日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア）
・中南米市場
- 中南米のICパッケージ基板（SUB）市場規模（種類別、用途別）
- 主要国別のICパッケージ基板（SUB）市場規模（メキシコ、ブラジル、アルゼンチン）
・中東・アフリカ市場
- 中東・アフリカのICパッケージ基板（SUB）市場規模（種類別、用途別）
- 主要国別のICパッケージ基板（SUB）市場規模（トルコ、サウジアラビア）
・企業情報
Samsung Electro-Mechanics、MST、NGK、KLA Corporation、Panasonic、Simmtech、Daeduck、ASE Material、Kyocera、Ibiden、Shinko Electric Industries、AT&S、LG InnoTek、Fastprint Circuit Tech、ACCESS、Danbond Technology、TTM Technologies、Unimicron、Nan Ya PCB、Kinsus、SCC
・産業チェーン及び販売チャネル分析
- ICパッケージ基板（SUB）の産業チェーン分析
- ICパッケージ基板（SUB）の原材料
- ICパッケージ基板（SUB）の生産プロセス
- ICパッケージ基板（SUB）の販売及びマーケティング
- ICパッケージ基板（SUB）の主要顧客
・マーケットドライバー、機会、課題、リスク要因分析
- ICパッケージ基板（SUB）の産業動向
- ICパッケージ基板（SUB）のマーケットドライバー
- ICパッケージ基板（SUB）の課題
- ICパッケージ基板（SUB）の阻害要因
・主な調査結果

Market Analysis and Insights: Global IC Packaging Substrate (SUB) Market
Due to the COVID-19 pandemic, the global IC Packaging Substrate (SUB) market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the forecast period 2022-2028. Fully considering the economic change by this health crisis, Organic Substrate accounting for % of the IC Packaging Substrate (SUB) global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While Smart Phones segment is altered to an % CAGR throughout this forecast period.
China IC Packaging Substrate (SUB) market size is valued at US$ million in 2021, while the US and Europe IC Packaging Substrate (SUB) are US$ million and US$ million, severally. The proportion of the US is % in 2021, while China and Europe are % and % respectively, and it is predicted that China proportion will reach % in 2028, trailing a CAGR of % through the analysis period 2022-2028. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR %, %, and % respectively for the next 6-year period. As for the Europe IC Packaging Substrate (SUB) landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period 2022-2028.
The global key manufacturers of IC Packaging Substrate (SUB) include Samsung Electro-Mechanics, MST, NGK, KLA Corporation, Panasonic, Simmtech, Daeduck, ASE Material and Kyocera, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
In terms of production side, this report researches the IC Packaging Substrate (SUB) capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of IC Packaging Substrate (SUB) by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global IC Packaging Substrate (SUB) Scope and Segment
IC Packaging Substrate (SUB) market is segmented by Type and by Application. Players, stakeholders, and other participants in the global IC Packaging Substrate (SUB) market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
Organic Substrate
Inorganic Substrate
Composite Substrate
Segment by Application
Smart Phones
PC (Tablet, Laptop)
Wearable Devices
Others
By Company
Samsung Electro-Mechanics
MST
NGK
KLA Corporation
Panasonic
Simmtech
Daeduck
ASE Material
Kyocera
Ibiden
Shinko Electric Industries
AT&S
LG InnoTek
Fastprint Circuit Tech
ACCESS
Danbond Technology
TTM Technologies
Unimicron
Nan Ya PCB
Kinsus
SCC
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE

❖ レポートの目次 ❖

1 Study Coverage
1.1 IC Packaging Substrate (SUB) Product Introduction
1.2 Market by Type
1.2.1 Global IC Packaging Substrate (SUB) Market Size by Type, 2017 VS 2021 VS 2028
1.2.2 Organic Substrate
1.2.3 Inorganic Substrate
1.2.4 Composite Substrate
1.3 Market by Application
1.3.1 Global IC Packaging Substrate (SUB) Market Size by Application, 2017 VS 2021 VS 2028
1.3.2 Smart Phones
1.3.3 PC (Tablet, Laptop)
1.3.4 Wearable Devices
1.3.5 Others
1.4 Study Objectives
1.5 Years Considered
2 Global IC Packaging Substrate (SUB) Production
2.1 Global IC Packaging Substrate (SUB) Production Capacity (2017-2028)
2.2 Global IC Packaging Substrate (SUB) Production by Region: 2017 VS 2021 VS 2028
2.3 Global IC Packaging Substrate (SUB) Production by Region
2.3.1 Global IC Packaging Substrate (SUB) Historic Production by Region (2017-2022)
2.3.2 Global IC Packaging Substrate (SUB) Forecasted Production by Region (2023-2028)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 South Korea
3 Global IC Packaging Substrate (SUB) Sales in Volume & Value Estimates and Forecasts
3.1 Global IC Packaging Substrate (SUB) Sales Estimates and Forecasts 2017-2028
3.2 Global IC Packaging Substrate (SUB) Revenue Estimates and Forecasts 2017-2028
3.3 Global IC Packaging Substrate (SUB) Revenue by Region: 2017 VS 2021 VS 2028
3.4 Global IC Packaging Substrate (SUB) Sales by Region
3.4.1 Global IC Packaging Substrate (SUB) Sales by Region (2017-2022)
3.4.2 Global Sales IC Packaging Substrate (SUB) by Region (2023-2028)
3.5 Global IC Packaging Substrate (SUB) Revenue by Region
3.5.1 Global IC Packaging Substrate (SUB) Revenue by Region (2017-2022)
3.5.2 Global IC Packaging Substrate (SUB) Revenue by Region (2023-2028)
3.6 North America
3.7 Europe
3.8 Asia-Pacific
3.9 Latin America
3.10 Middle East & Africa
4 Competition by Manufactures
4.1 Global IC Packaging Substrate (SUB) Production Capacity by Manufacturers
4.2 Global IC Packaging Substrate (SUB) Sales by Manufacturers
4.2.1 Global IC Packaging Substrate (SUB) Sales by Manufacturers (2017-2022)
4.2.2 Global IC Packaging Substrate (SUB) Sales Market Share by Manufacturers (2017-2022)
4.2.3 Global Top 10 and Top 5 Largest Manufacturers of IC Packaging Substrate (SUB) in 2021
4.3 Global IC Packaging Substrate (SUB) Revenue by Manufacturers
4.3.1 Global IC Packaging Substrate (SUB) Revenue by Manufacturers (2017-2022)
4.3.2 Global IC Packaging Substrate (SUB) Revenue Market Share by Manufacturers (2017-2022)
4.3.3 Global Top 10 and Top 5 Companies by IC Packaging Substrate (SUB) Revenue in 2021
4.4 Global IC Packaging Substrate (SUB) Sales Price by Manufacturers
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global IC Packaging Substrate (SUB) Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.5.3 Global IC Packaging Substrate (SUB) Manufacturers Geographical Distribution
4.6 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global IC Packaging Substrate (SUB) Sales by Type
5.1.1 Global IC Packaging Substrate (SUB) Historical Sales by Type (2017-2022)
5.1.2 Global IC Packaging Substrate (SUB) Forecasted Sales by Type (2023-2028)
5.1.3 Global IC Packaging Substrate (SUB) Sales Market Share by Type (2017-2028)
5.2 Global IC Packaging Substrate (SUB) Revenue by Type
5.2.1 Global IC Packaging Substrate (SUB) Historical Revenue by Type (2017-2022)
5.2.2 Global IC Packaging Substrate (SUB) Forecasted Revenue by Type (2023-2028)
5.2.3 Global IC Packaging Substrate (SUB) Revenue Market Share by Type (2017-2028)
5.3 Global IC Packaging Substrate (SUB) Price by Type
5.3.1 Global IC Packaging Substrate (SUB) Price by Type (2017-2022)
5.3.2 Global IC Packaging Substrate (SUB) Price Forecast by Type (2023-2028)
6 Market Size by Application
6.1 Global IC Packaging Substrate (SUB) Sales by Application
6.1.1 Global IC Packaging Substrate (SUB) Historical Sales by Application (2017-2022)
6.1.2 Global IC Packaging Substrate (SUB) Forecasted Sales by Application (2023-2028)
6.1.3 Global IC Packaging Substrate (SUB) Sales Market Share by Application (2017-2028)
6.2 Global IC Packaging Substrate (SUB) Revenue by Application
6.2.1 Global IC Packaging Substrate (SUB) Historical Revenue by Application (2017-2022)
6.2.2 Global IC Packaging Substrate (SUB) Forecasted Revenue by Application (2023-2028)
6.2.3 Global IC Packaging Substrate (SUB) Revenue Market Share by Application (2017-2028)
6.3 Global IC Packaging Substrate (SUB) Price by Application
6.3.1 Global IC Packaging Substrate (SUB) Price by Application (2017-2022)
6.3.2 Global IC Packaging Substrate (SUB) Price Forecast by Application (2023-2028)
7 North America
7.1 North America IC Packaging Substrate (SUB) Market Size by Type
7.1.1 North America IC Packaging Substrate (SUB) Sales by Type (2017-2028)
7.1.2 North America IC Packaging Substrate (SUB) Revenue by Type (2017-2028)
7.2 North America IC Packaging Substrate (SUB) Market Size by Application
7.2.1 North America IC Packaging Substrate (SUB) Sales by Application (2017-2028)
7.2.2 North America IC Packaging Substrate (SUB) Revenue by Application (2017-2028)
7.3 North America IC Packaging Substrate (SUB) Sales by Country
7.3.1 North America IC Packaging Substrate (SUB) Sales by Country (2017-2028)
7.3.2 North America IC Packaging Substrate (SUB) Revenue by Country (2017-2028)
7.3.3 United States
7.3.4 Canada
8 Europe
8.1 Europe IC Packaging Substrate (SUB) Market Size by Type
8.1.1 Europe IC Packaging Substrate (SUB) Sales by Type (2017-2028)
8.1.2 Europe IC Packaging Substrate (SUB) Revenue by Type (2017-2028)
8.2 Europe IC Packaging Substrate (SUB) Market Size by Application
8.2.1 Europe IC Packaging Substrate (SUB) Sales by Application (2017-2028)
8.2.2 Europe IC Packaging Substrate (SUB) Revenue by Application (2017-2028)
8.3 Europe IC Packaging Substrate (SUB) Sales by Country
8.3.1 Europe IC Packaging Substrate (SUB) Sales by Country (2017-2028)
8.3.2 Europe IC Packaging Substrate (SUB) Revenue by Country (2017-2028)
8.3.3 Germany
8.3.4 France
8.3.5 U.K.
8.3.6 Italy
8.3.7 Russia
9 Asia Pacific
9.1 Asia Pacific IC Packaging Substrate (SUB) Market Size by Type
9.1.1 Asia Pacific IC Packaging Substrate (SUB) Sales by Type (2017-2028)
9.1.2 Asia Pacific IC Packaging Substrate (SUB) Revenue by Type (2017-2028)
9.2 Asia Pacific IC Packaging Substrate (SUB) Market Size by Application
9.2.1 Asia Pacific IC Packaging Substrate (SUB) Sales by Application (2017-2028)
9.2.2 Asia Pacific IC Packaging Substrate (SUB) Revenue by Application (2017-2028)
9.3 Asia Pacific IC Packaging Substrate (SUB) Sales by Region
9.3.1 Asia Pacific IC Packaging Substrate (SUB) Sales by Region (2017-2028)
9.3.2 Asia Pacific IC Packaging Substrate (SUB) Revenue by Region (2017-2028)
9.3.3 China
9.3.4 Japan
9.3.5 South Korea
9.3.6 India
9.3.7 Australia
9.3.8 China Taiwan
9.3.9 Indonesia
9.3.10 Thailand
9.3.11 Malaysia
10 Latin America
10.1 Latin America IC Packaging Substrate (SUB) Market Size by Type
10.1.1 Latin America IC Packaging Substrate (SUB) Sales by Type (2017-2028)
10.1.2 Latin America IC Packaging Substrate (SUB) Revenue by Type (2017-2028)
10.2 Latin America IC Packaging Substrate (SUB) Market Size by Application
10.2.1 Latin America IC Packaging Substrate (SUB) Sales by Application (2017-2028)
10.2.2 Latin America IC Packaging Substrate (SUB) Revenue by Application (2017-2028)
10.3 Latin America IC Packaging Substrate (SUB) Sales by Country
10.3.1 Latin America IC Packaging Substrate (SUB) Sales by Country (2017-2028)
10.3.2 Latin America IC Packaging Substrate (SUB) Revenue by Country (2017-2028)
10.3.3 Mexico
10.3.4 Brazil
10.3.5 Argentina
11 Middle East and Africa
11.1 Middle East and Africa IC Packaging Substrate (SUB) Market Size by Type
11.1.1 Middle East and Africa IC Packaging Substrate (SUB) Sales by Type (2017-2028)
11.1.2 Middle East and Africa IC Packaging Substrate (SUB) Revenue by Type (2017-2028)
11.2 Middle East and Africa IC Packaging Substrate (SUB) Market Size by Application
11.2.1 Middle East and Africa IC Packaging Substrate (SUB) Sales by Application (2017-2028)
11.2.2 Middle East and Africa IC Packaging Substrate (SUB) Revenue by Application (2017-2028)
11.3 Middle East and Africa IC Packaging Substrate (SUB) Sales by Country
11.3.1 Middle East and Africa IC Packaging Substrate (SUB) Sales by Country (2017-2028)
11.3.2 Middle East and Africa IC Packaging Substrate (SUB) Revenue by Country (2017-2028)
11.3.3 Turkey
11.3.4 Saudi Arabia
11.3.5 UAE
12 Corporate Profiles
12.1 Samsung Electro-Mechanics
12.1.1 Samsung Electro-Mechanics Corporation Information
12.1.2 Samsung Electro-Mechanics Overview
12.1.3 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.1.4 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 Samsung Electro-Mechanics Recent Developments
12.2 MST
12.2.1 MST Corporation Information
12.2.2 MST Overview
12.2.3 MST IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.2.4 MST IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 MST Recent Developments
12.3 NGK
12.3.1 NGK Corporation Information
12.3.2 NGK Overview
12.3.3 NGK IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.3.4 NGK IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 NGK Recent Developments
12.4 KLA Corporation
12.4.1 KLA Corporation Corporation Information
12.4.2 KLA Corporation Overview
12.4.3 KLA Corporation IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.4.4 KLA Corporation IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 KLA Corporation Recent Developments
12.5 Panasonic
12.5.1 Panasonic Corporation Information
12.5.2 Panasonic Overview
12.5.3 Panasonic IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.5.4 Panasonic IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 Panasonic Recent Developments
12.6 Simmtech
12.6.1 Simmtech Corporation Information
12.6.2 Simmtech Overview
12.6.3 Simmtech IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.6.4 Simmtech IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 Simmtech Recent Developments
12.7 Daeduck
12.7.1 Daeduck Corporation Information
12.7.2 Daeduck Overview
12.7.3 Daeduck IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.7.4 Daeduck IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 Daeduck Recent Developments
12.8 ASE Material
12.8.1 ASE Material Corporation Information
12.8.2 ASE Material Overview
12.8.3 ASE Material IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.8.4 ASE Material IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 ASE Material Recent Developments
12.9 Kyocera
12.9.1 Kyocera Corporation Information
12.9.2 Kyocera Overview
12.9.3 Kyocera IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.9.4 Kyocera IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 Kyocera Recent Developments
12.10 Ibiden
12.10.1 Ibiden Corporation Information
12.10.2 Ibiden Overview
12.10.3 Ibiden IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.10.4 Ibiden IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 Ibiden Recent Developments
12.11 Shinko Electric Industries
12.11.1 Shinko Electric Industries Corporation Information
12.11.2 Shinko Electric Industries Overview
12.11.3 Shinko Electric Industries IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.11.4 Shinko Electric Industries IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.11.5 Shinko Electric Industries Recent Developments
12.12 AT&S
12.12.1 AT&S Corporation Information
12.12.2 AT&S Overview
12.12.3 AT&S IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.12.4 AT&S IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.12.5 AT&S Recent Developments
12.13 LG InnoTek
12.13.1 LG InnoTek Corporation Information
12.13.2 LG InnoTek Overview
12.13.3 LG InnoTek IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.13.4 LG InnoTek IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.13.5 LG InnoTek Recent Developments
12.14 Fastprint Circuit Tech
12.14.1 Fastprint Circuit Tech Corporation Information
12.14.2 Fastprint Circuit Tech Overview
12.14.3 Fastprint Circuit Tech IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.14.4 Fastprint Circuit Tech IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.14.5 Fastprint Circuit Tech Recent Developments
12.15 ACCESS
12.15.1 ACCESS Corporation Information
12.15.2 ACCESS Overview
12.15.3 ACCESS IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.15.4 ACCESS IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.15.5 ACCESS Recent Developments
12.16 Danbond Technology
12.16.1 Danbond Technology Corporation Information
12.16.2 Danbond Technology Overview
12.16.3 Danbond Technology IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.16.4 Danbond Technology IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.16.5 Danbond Technology Recent Developments
12.17 TTM Technologies
12.17.1 TTM Technologies Corporation Information
12.17.2 TTM Technologies Overview
12.17.3 TTM Technologies IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.17.4 TTM Technologies IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.17.5 TTM Technologies Recent Developments
12.18 Unimicron
12.18.1 Unimicron Corporation Information
12.18.2 Unimicron Overview
12.18.3 Unimicron IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.18.4 Unimicron IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.18.5 Unimicron Recent Developments
12.19 Nan Ya PCB
12.19.1 Nan Ya PCB Corporation Information
12.19.2 Nan Ya PCB Overview
12.19.3 Nan Ya PCB IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.19.4 Nan Ya PCB IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.19.5 Nan Ya PCB Recent Developments
12.20 Kinsus
12.20.1 Kinsus Corporation Information
12.20.2 Kinsus Overview
12.20.3 Kinsus IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.20.4 Kinsus IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.20.5 Kinsus Recent Developments
12.21 SCC
12.21.1 SCC Corporation Information
12.21.2 SCC Overview
12.21.3 SCC IC Packaging Substrate (SUB) Sales, Price, Revenue and Gross Margin (2017-2022)
12.21.4 SCC IC Packaging Substrate (SUB) Product Model Numbers, Pictures, Descriptions and Specifications
12.21.5 SCC Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 IC Packaging Substrate (SUB) Industry Chain Analysis
13.2 IC Packaging Substrate (SUB) Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 IC Packaging Substrate (SUB) Production Mode & Process
13.4 IC Packaging Substrate (SUB) Sales and Marketing
13.4.1 IC Packaging Substrate (SUB) Sales Channels
13.4.2 IC Packaging Substrate (SUB) Distributors
13.5 IC Packaging Substrate (SUB) Customers
14 Market Drivers, Opportunities, Challenges and Risks Factors Analysis
14.1 IC Packaging Substrate (SUB) Industry Trends
14.2 IC Packaging Substrate (SUB) Market Drivers
14.3 IC Packaging Substrate (SUB) Market Challenges
14.4 IC Packaging Substrate (SUB) Market Restraints
15 Key Finding in The Global IC Packaging Substrate (SUB) Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer



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