カテゴリー： IT/電子, QYResearch, 世界

世界のICパッケージ基板市場インサイト及び予測（WB CSP、FC BGA、FC CSP、PBGA、SiP、BOC、その他）

◆英語タイトル：Global IC Packaging Substrate Market Insights, Forecast to 2028

QYResearchが発行した調査報告書（QY22JLX04491）◆商品コード：QY22JLX04491
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❖ レポートの概要 ❖

COVID-19のパンデミックにより、ICパッケージ基板のグローバル市場規模は2022年にUS$xxxと推定され、調査期間中のCAGRはxxx％で、2028年までに再調整された規模はUS$xxxになると予測されています。この医療危機による経済変化を十分に考慮すると、2021年にICパッケージ基板の世界市場のxxx％を占める「WB CSP」タイプは、2028年までにUS$xxxの規模になり、パンデミック後の修正xxx％CAGRで成長すると予測されています。一方、「スマートフォン」セグメントは、この予測期間を通じてxxx％のCAGRに変更されます。
ICパッケージ基板の中国市場規模は2021年にUS$xxxと分析されており、米国とヨーロッパの市場規模はそれぞれUS$xxxとUS$xxxです。米国の割合は2021年にxxx％であり、中国とヨーロッパはそれぞれxxx％とxxx％です。中国の割合は2028年にxxx％に達し、対象期間を通じてxxx％のCAGRを記録すると予測されています。日本、韓国、東南アジアはアジアで注目市場であり、今後6年間のCAGRはそれぞれxxx％、xxx％、xxx％になる見通しです。ヨーロッパのICパッケージ基板市場については、ドイツは2028年までにUS$xxxに達すると予測されており、予測期間中のCAGRはxxx％になる見通しです。

ICパッケージ基板のグローバル主要企業には、Ibiden、Kinsus Interconnect Technology、Unimicron、Shinko Electric Industries、Semco、Simmtech、Nanya、Kyocera、LG Innotek、AT&S、ASE、Daeduck、Shennan Circuit、Zhen Ding Technology、KCC (Korea Circuit Company)、ACCESS、Shenzhen Fastprint Circuit Tech、AKM Meadville、Toppan Printingなどがあります。2021年、世界のトップ5プレイヤーは売上ベースで約xxx％の市場シェアを占めています。

ICパッケージ基板市場は、種類と用途によって区分されます。世界のICパッケージ基板市場のプレーヤー、利害関係者、およびその他の参加者は、当レポートを有益なリソースとして使用することで優位に立つことができます。セグメント分析は、2017年～2028年期間のタイプ別および用途別の販売量、売上、予測に焦点を当てています。

【種類別セグメント】
WB CSP、FC BGA、FC CSP、PBGA、SiP、BOC、その他

【用途別セグメント】
スマートフォン、PC（タブレット、ラップトップ）、ウェアラブルデバイス、その他

【掲載地域】
北米：アメリカ、カナダ
ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア
アジア太平洋：日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア
中南米：メキシコ、ブラジル、アルゼンチン
中東・アフリカ：トルコ、サウジアラビア、UAE

【目次（一部）】

・調査の範囲
- ICパッケージ基板製品概要
- 種類別市場（WB CSP、FC BGA、FC CSP、PBGA、SiP、BOC、その他）
- 用途別市場（スマートフォン、PC（タブレット、ラップトップ）、ウェアラブルデバイス、その他）
- 調査の目的
・エグゼクティブサマリー
- 世界のICパッケージ基板販売量予測2017-2028
- 世界のICパッケージ基板売上予測2017-2028
- ICパッケージ基板の地域別販売量
- ICパッケージ基板の地域別売上
- 北米市場
- ヨーロッパ市場
- アジア太平洋市場
- 中南米市場
- 中東・アフリカ市場
・メーカーの競争状況
- 主要メーカー別ICパッケージ基板販売量
- 主要メーカー別ICパッケージ基板売上
- 主要メーカー別ICパッケージ基板価格
- 競争状況の分析
- 企業M&A動向
・種類別市場規模（WB CSP、FC BGA、FC CSP、PBGA、SiP、BOC、その他）
- ICパッケージ基板の種類別販売量
- ICパッケージ基板の種類別売上
- ICパッケージ基板の種類別価格
・用途別市場規模（スマートフォン、PC（タブレット、ラップトップ）、ウェアラブルデバイス、その他）
- ICパッケージ基板の用途別販売量
- ICパッケージ基板の用途別売上
- ICパッケージ基板の用途別価格
・北米市場
- 北米のICパッケージ基板市場規模（種類別、用途別）
- 主要国別のICパッケージ基板市場規模（アメリカ、カナダ）
・ヨーロッパ市場
- ヨーロッパのICパッケージ基板市場規模（種類別、用途別）
- 主要国別のICパッケージ基板市場規模（ドイツ、フランス、イギリス、イタリア、ロシア）
・アジア太平洋市場
- アジア太平洋のICパッケージ基板市場規模（種類別、用途別）
- 主要国別のICパッケージ基板市場規模（日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア）
・中南米市場
- 中南米のICパッケージ基板市場規模（種類別、用途別）
- 主要国別のICパッケージ基板市場規模（メキシコ、ブラジル、アルゼンチン）
・中東・アフリカ市場
- 中東・アフリカのICパッケージ基板市場規模（種類別、用途別）
- 主要国別のICパッケージ基板市場規模（トルコ、サウジアラビア）
・企業情報
Ibiden、Kinsus Interconnect Technology、Unimicron、Shinko Electric Industries、Semco、Simmtech、Nanya、Kyocera、LG Innotek、AT&S、ASE、Daeduck、Shennan Circuit、Zhen Ding Technology、KCC (Korea Circuit Company)、ACCESS、Shenzhen Fastprint Circuit Tech、AKM Meadville、Toppan Printing
・産業チェーン及び販売チャネル分析
- ICパッケージ基板の産業チェーン分析
- ICパッケージ基板の原材料
- ICパッケージ基板の生産プロセス
- ICパッケージ基板の販売及びマーケティング
- ICパッケージ基板の主要顧客
・マーケットドライバー、機会、課題、リスク要因分析
- ICパッケージ基板の産業動向
- ICパッケージ基板のマーケットドライバー
- ICパッケージ基板の課題
- ICパッケージ基板の阻害要因
・主な調査結果

IC packaging substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging.
Market Analysis and Insights: Global IC Packaging Substrate Market
Due to the COVID-19 pandemic, the global IC Packaging Substrate market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the forecast period 2022-2028. Fully considering the economic change by this health crisis, WB CSP accounting for % of the IC Packaging Substrate global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While Smart Phones segment is altered to an % CAGR throughout this forecast period.
China IC Packaging Substrate market size is valued at US$ million in 2021, while the US and Europe IC Packaging Substrate are US$ million and US$ million, severally. The proportion of the US is % in 2021, while China and Europe are % and % respectively, and it is predicted that China proportion will reach % in 2028, trailing a CAGR of % through the analysis period 2022-2028. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR %, %, and % respectively for the next 6-year period. As for the Europe IC Packaging Substrate landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period 2022-2028.
The global key manufacturers of IC Packaging Substrate include Ibiden, Kinsus Interconnect Technology, Unimicron, Shinko Electric Industries, Semco, Simmtech, Nanya, Kyocera and LG Innotek, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
In terms of production side, this report researches the IC Packaging Substrate capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of IC Packaging Substrate by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global IC Packaging Substrate Scope and Segment
IC Packaging Substrate market is segmented by Type and by Application. Players, stakeholders, and other participants in the global IC Packaging Substrate market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
WB CSP
FC BGA
FC CSP
PBGA
SiP
BOC
Other
Segment by Application
Smart Phones
PC (Tablet, Laptop)
Wearable Devices
Others
By Company
Ibiden
Kinsus Interconnect Technology
Unimicron
Shinko Electric Industries
Semco
Simmtech
Nanya
Kyocera
LG Innotek
AT&S
ASE
Daeduck
Shennan Circuit
Zhen Ding Technology
KCC (Korea Circuit Company)
ACCESS
Shenzhen Fastprint Circuit Tech
AKM Meadville
Toppan Printing
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Colombia
Middle East & Africa
Turkey
Saudi Arabia
UAE

❖ レポートの目次 ❖

1 Study Coverage
1.1 IC Packaging Substrate Product Introduction
1.2 Market by Type
1.2.1 Global IC Packaging Substrate Market Size by Type, 2017 VS 2021 VS 2028
1.2.2 WB CSP
1.2.3 FC BGA
1.2.4 FC CSP
1.2.5 PBGA
1.2.6 SiP
1.2.7 BOC
1.2.8 Other
1.3 Market by Application
1.3.1 Global IC Packaging Substrate Market Size by Application, 2017 VS 2021 VS 2028
1.3.2 Smart Phones
1.3.3 PC (Tablet, Laptop)
1.3.4 Wearable Devices
1.3.5 Others
1.4 Study Objectives
1.5 Years Considered
2 Global IC Packaging Substrate Production
2.1 Global IC Packaging Substrate Production Capacity (2017-2028)
2.2 Global IC Packaging Substrate Production by Region: 2017 VS 2021 VS 2028
2.3 Global IC Packaging Substrate Production by Region
2.3.1 Global IC Packaging Substrate Historic Production by Region (2017-2022)
2.3.2 Global IC Packaging Substrate Forecasted Production by Region (2023-2028)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 South Korea
3 Global IC Packaging Substrate Sales in Volume & Value Estimates and Forecasts
3.1 Global IC Packaging Substrate Sales Estimates and Forecasts 2017-2028
3.2 Global IC Packaging Substrate Revenue Estimates and Forecasts 2017-2028
3.3 Global IC Packaging Substrate Revenue by Region: 2017 VS 2021 VS 2028
3.4 Global IC Packaging Substrate Sales by Region
3.4.1 Global IC Packaging Substrate Sales by Region (2017-2022)
3.4.2 Global Sales IC Packaging Substrate by Region (2023-2028)
3.5 Global IC Packaging Substrate Revenue by Region
3.5.1 Global IC Packaging Substrate Revenue by Region (2017-2022)
3.5.2 Global IC Packaging Substrate Revenue by Region (2023-2028)
3.6 North America
3.7 Europe
3.8 Asia-Pacific
3.9 Latin America
3.10 Middle East & Africa
4 Competition by Manufactures
4.1 Global IC Packaging Substrate Production Capacity by Manufacturers
4.2 Global IC Packaging Substrate Sales by Manufacturers
4.2.1 Global IC Packaging Substrate Sales by Manufacturers (2017-2022)
4.2.2 Global IC Packaging Substrate Sales Market Share by Manufacturers (2017-2022)
4.2.3 Global Top 10 and Top 5 Largest Manufacturers of IC Packaging Substrate in 2021
4.3 Global IC Packaging Substrate Revenue by Manufacturers
4.3.1 Global IC Packaging Substrate Revenue by Manufacturers (2017-2022)
4.3.2 Global IC Packaging Substrate Revenue Market Share by Manufacturers (2017-2022)
4.3.3 Global Top 10 and Top 5 Companies by IC Packaging Substrate Revenue in 2021
4.4 Global IC Packaging Substrate Sales Price by Manufacturers
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global IC Packaging Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.5.3 Global IC Packaging Substrate Manufacturers Geographical Distribution
4.6 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global IC Packaging Substrate Sales by Type
5.1.1 Global IC Packaging Substrate Historical Sales by Type (2017-2022)
5.1.2 Global IC Packaging Substrate Forecasted Sales by Type (2023-2028)
5.1.3 Global IC Packaging Substrate Sales Market Share by Type (2017-2028)
5.2 Global IC Packaging Substrate Revenue by Type
5.2.1 Global IC Packaging Substrate Historical Revenue by Type (2017-2022)
5.2.2 Global IC Packaging Substrate Forecasted Revenue by Type (2023-2028)
5.2.3 Global IC Packaging Substrate Revenue Market Share by Type (2017-2028)
5.3 Global IC Packaging Substrate Price by Type
5.3.1 Global IC Packaging Substrate Price by Type (2017-2022)
5.3.2 Global IC Packaging Substrate Price Forecast by Type (2023-2028)
6 Market Size by Application
6.1 Global IC Packaging Substrate Sales by Application
6.1.1 Global IC Packaging Substrate Historical Sales by Application (2017-2022)
6.1.2 Global IC Packaging Substrate Forecasted Sales by Application (2023-2028)
6.1.3 Global IC Packaging Substrate Sales Market Share by Application (2017-2028)
6.2 Global IC Packaging Substrate Revenue by Application
6.2.1 Global IC Packaging Substrate Historical Revenue by Application (2017-2022)
6.2.2 Global IC Packaging Substrate Forecasted Revenue by Application (2023-2028)
6.2.3 Global IC Packaging Substrate Revenue Market Share by Application (2017-2028)
6.3 Global IC Packaging Substrate Price by Application
6.3.1 Global IC Packaging Substrate Price by Application (2017-2022)
6.3.2 Global IC Packaging Substrate Price Forecast by Application (2023-2028)
7 North America
7.1 North America IC Packaging Substrate Market Size by Type
7.1.1 North America IC Packaging Substrate Sales by Type (2017-2028)
7.1.2 North America IC Packaging Substrate Revenue by Type (2017-2028)
7.2 North America IC Packaging Substrate Market Size by Application
7.2.1 North America IC Packaging Substrate Sales by Application (2017-2028)
7.2.2 North America IC Packaging Substrate Revenue by Application (2017-2028)
7.3 North America IC Packaging Substrate Sales by Country
7.3.1 North America IC Packaging Substrate Sales by Country (2017-2028)
7.3.2 North America IC Packaging Substrate Revenue by Country (2017-2028)
7.3.3 United States
7.3.4 Canada
8 Europe
8.1 Europe IC Packaging Substrate Market Size by Type
8.1.1 Europe IC Packaging Substrate Sales by Type (2017-2028)
8.1.2 Europe IC Packaging Substrate Revenue by Type (2017-2028)
8.2 Europe IC Packaging Substrate Market Size by Application
8.2.1 Europe IC Packaging Substrate Sales by Application (2017-2028)
8.2.2 Europe IC Packaging Substrate Revenue by Application (2017-2028)
8.3 Europe IC Packaging Substrate Sales by Country
8.3.1 Europe IC Packaging Substrate Sales by Country (2017-2028)
8.3.2 Europe IC Packaging Substrate Revenue by Country (2017-2028)
8.3.3 Germany
8.3.4 France
8.3.5 U.K.
8.3.6 Italy
8.3.7 Russia
9 Asia Pacific
9.1 Asia Pacific IC Packaging Substrate Market Size by Type
9.1.1 Asia Pacific IC Packaging Substrate Sales by Type (2017-2028)
9.1.2 Asia Pacific IC Packaging Substrate Revenue by Type (2017-2028)
9.2 Asia Pacific IC Packaging Substrate Market Size by Application
9.2.1 Asia Pacific IC Packaging Substrate Sales by Application (2017-2028)
9.2.2 Asia Pacific IC Packaging Substrate Revenue by Application (2017-2028)
9.3 Asia Pacific IC Packaging Substrate Sales by Region
9.3.1 Asia Pacific IC Packaging Substrate Sales by Region (2017-2028)
9.3.2 Asia Pacific IC Packaging Substrate Revenue by Region (2017-2028)
9.3.3 China
9.3.4 Japan
9.3.5 South Korea
9.3.6 India
9.3.7 Australia
9.3.8 China Taiwan
9.3.9 Indonesia
9.3.10 Thailand
9.3.11 Malaysia
10 Latin America
10.1 Latin America IC Packaging Substrate Market Size by Type
10.1.1 Latin America IC Packaging Substrate Sales by Type (2017-2028)
10.1.2 Latin America IC Packaging Substrate Revenue by Type (2017-2028)
10.2 Latin America IC Packaging Substrate Market Size by Application
10.2.1 Latin America IC Packaging Substrate Sales by Application (2017-2028)
10.2.2 Latin America IC Packaging Substrate Revenue by Application (2017-2028)
10.3 Latin America IC Packaging Substrate Sales by Country
10.3.1 Latin America IC Packaging Substrate Sales by Country (2017-2028)
10.3.2 Latin America IC Packaging Substrate Revenue by Country (2017-2028)
10.3.3 Mexico
10.3.4 Brazil
10.3.5 Argentina
10.3.6 Colombia
11 Middle East and Africa
11.1 Middle East and Africa IC Packaging Substrate Market Size by Type
11.1.1 Middle East and Africa IC Packaging Substrate Sales by Type (2017-2028)
11.1.2 Middle East and Africa IC Packaging Substrate Revenue by Type (2017-2028)
11.2 Middle East and Africa IC Packaging Substrate Market Size by Application
11.2.1 Middle East and Africa IC Packaging Substrate Sales by Application (2017-2028)
11.2.2 Middle East and Africa IC Packaging Substrate Revenue by Application (2017-2028)
11.3 Middle East and Africa IC Packaging Substrate Sales by Country
11.3.1 Middle East and Africa IC Packaging Substrate Sales by Country (2017-2028)
11.3.2 Middle East and Africa IC Packaging Substrate Revenue by Country (2017-2028)
11.3.3 Turkey
11.3.4 Saudi Arabia
11.3.5 UAE
12 Corporate Profiles
12.1 Ibiden
12.1.1 Ibiden Corporation Information
12.1.2 Ibiden Overview
12.1.3 Ibiden IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.1.4 Ibiden IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 Ibiden Recent Developments
12.2 Kinsus Interconnect Technology
12.2.1 Kinsus Interconnect Technology Corporation Information
12.2.2 Kinsus Interconnect Technology Overview
12.2.3 Kinsus Interconnect Technology IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.2.4 Kinsus Interconnect Technology IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Kinsus Interconnect Technology Recent Developments
12.3 Unimicron
12.3.1 Unimicron Corporation Information
12.3.2 Unimicron Overview
12.3.3 Unimicron IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.3.4 Unimicron IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 Unimicron Recent Developments
12.4 Shinko Electric Industries
12.4.1 Shinko Electric Industries Corporation Information
12.4.2 Shinko Electric Industries Overview
12.4.3 Shinko Electric Industries IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.4.4 Shinko Electric Industries IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 Shinko Electric Industries Recent Developments
12.5 Semco
12.5.1 Semco Corporation Information
12.5.2 Semco Overview
12.5.3 Semco IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.5.4 Semco IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 Semco Recent Developments
12.6 Simmtech
12.6.1 Simmtech Corporation Information
12.6.2 Simmtech Overview
12.6.3 Simmtech IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.6.4 Simmtech IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 Simmtech Recent Developments
12.7 Nanya
12.7.1 Nanya Corporation Information
12.7.2 Nanya Overview
12.7.3 Nanya IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.7.4 Nanya IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 Nanya Recent Developments
12.8 Kyocera
12.8.1 Kyocera Corporation Information
12.8.2 Kyocera Overview
12.8.3 Kyocera IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.8.4 Kyocera IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 Kyocera Recent Developments
12.9 LG Innotek
12.9.1 LG Innotek Corporation Information
12.9.2 LG Innotek Overview
12.9.3 LG Innotek IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.9.4 LG Innotek IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 LG Innotek Recent Developments
12.10 AT&S
12.10.1 AT&S Corporation Information
12.10.2 AT&S Overview
12.10.3 AT&S IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.10.4 AT&S IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 AT&S Recent Developments
12.11 ASE
12.11.1 ASE Corporation Information
12.11.2 ASE Overview
12.11.3 ASE IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.11.4 ASE IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.11.5 ASE Recent Developments
12.12 Daeduck
12.12.1 Daeduck Corporation Information
12.12.2 Daeduck Overview
12.12.3 Daeduck IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.12.4 Daeduck IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.12.5 Daeduck Recent Developments
12.13 Shennan Circuit
12.13.1 Shennan Circuit Corporation Information
12.13.2 Shennan Circuit Overview
12.13.3 Shennan Circuit IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.13.4 Shennan Circuit IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.13.5 Shennan Circuit Recent Developments
12.14 Zhen Ding Technology
12.14.1 Zhen Ding Technology Corporation Information
12.14.2 Zhen Ding Technology Overview
12.14.3 Zhen Ding Technology IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.14.4 Zhen Ding Technology IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.14.5 Zhen Ding Technology Recent Developments
12.15 KCC (Korea Circuit Company)
12.15.1 KCC (Korea Circuit Company) Corporation Information
12.15.2 KCC (Korea Circuit Company) Overview
12.15.3 KCC (Korea Circuit Company) IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.15.4 KCC (Korea Circuit Company) IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.15.5 KCC (Korea Circuit Company) Recent Developments
12.16 ACCESS
12.16.1 ACCESS Corporation Information
12.16.2 ACCESS Overview
12.16.3 ACCESS IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.16.4 ACCESS IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.16.5 ACCESS Recent Developments
12.17 Shenzhen Fastprint Circuit Tech
12.17.1 Shenzhen Fastprint Circuit Tech Corporation Information
12.17.2 Shenzhen Fastprint Circuit Tech Overview
12.17.3 Shenzhen Fastprint Circuit Tech IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.17.4 Shenzhen Fastprint Circuit Tech IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.17.5 Shenzhen Fastprint Circuit Tech Recent Developments
12.18 AKM Meadville
12.18.1 AKM Meadville Corporation Information
12.18.2 AKM Meadville Overview
12.18.3 AKM Meadville IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.18.4 AKM Meadville IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.18.5 AKM Meadville Recent Developments
12.19 Toppan Printing
12.19.1 Toppan Printing Corporation Information
12.19.2 Toppan Printing Overview
12.19.3 Toppan Printing IC Packaging Substrate Sales, Price, Revenue and Gross Margin (2017-2022)
12.19.4 Toppan Printing IC Packaging Substrate Product Model Numbers, Pictures, Descriptions and Specifications
12.19.5 Toppan Printing Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 IC Packaging Substrate Industry Chain Analysis
13.2 IC Packaging Substrate Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 IC Packaging Substrate Production Mode & Process
13.4 IC Packaging Substrate Sales and Marketing
13.4.1 IC Packaging Substrate Sales Channels
13.4.2 IC Packaging Substrate Distributors
13.5 IC Packaging Substrate Customers
14 Market Drivers, Opportunities, Challenges and Risks Factors Analysis
14.1 IC Packaging Substrate Industry Trends
14.2 IC Packaging Substrate Market Drivers
14.3 IC Packaging Substrate Market Challenges
14.4 IC Packaging Substrate Market Restraints
15 Key Finding in The Global IC Packaging Substrate Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer



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