カテゴリー： Market Monitor Global, 世界, 産業機械/建設

半導体ウェーハスクライビングマシンの世界市場見通し2023年-2029年

◆英語タイトル：Semiconductor Wafer Scribing Machine Market, Global Outlook and Forecast 2023-2029

Market Monitor Globalが発行した調査報告書（MMG23FB1983）

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◆発行日：2023年2月
◆ページ数：75
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◆調査対象地域：グローバル、北米、アメリカ、ヨーロッパ、アジア、日本、中国、東南アジア、インド、南米、中東・アフリカなど
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❖ レポートの概要 ❖

当調査レポートは次の情報を含め、世界の半導体ウェーハスクライビングマシン市場規模と予測を収録しています。・世界の半導体ウェーハスクライビングマシン市場：売上、2018年-2023年、2024年-2029年
・世界の半導体ウェーハスクライビングマシン市場：販売量、2018年-2023年、2024年-2029年
・世界のトップ5企業、2022年

世界の半導体ウェーハスクライビングマシン市場は2022年に000Mドルと評価され、予測期間中に000％のCAGRで2029年までに000Mドルに達すると予測されています。米国市場は2022年に000Mドルと推定されており、中国は2029年までに000Mドルに達すると予測されています。「レーザースクライブ盤」セグメントは今後6年間、000%のCAGRで2029年までに000Mドルに成長すると予測されています。

半導体ウェーハスクライビングマシンのグローバル主要企業は、DISCO、Tokyo Seimitsu (ACCRETECH)、ASM、Synova、Bojiexin、GL Tech Co、Shenyang Heyan Technology、Jiangsu Jing ChuangAdvanced Electronic Technology、Genesem、Advanced Dicing Technologiesなどです。2022年にトップ5企業がグローバル売上シェアの約000%を占めています。

MARKET MONITOR GLOBAL（MMG）は、半導体ウェーハスクライビングマシンのメーカー、サプライヤー、流通業者、および業界の専門家を調査しました。これには、販売量、売上、需要、価格変動、製品タイプ、最近の動向と計画、産業トレンド、成長要因、課題、阻害要因、潜在的なリスクなどが含まれます。

【セグメント別市場分析】

世界の半導体ウェーハスクライビングマシン市場：タイプ別、2018年-2023年、2024年-2029年
世界の半導体ウェーハスクライビングマシン市場：タイプ別市場シェア、2022年
・レーザースクライブ盤、砥石スクライブ盤

世界の半導体ウェーハスクライビングマシン市場：用途別、2018年-2023年、2024年-2029年
世界の半導体ウェーハスクライビングマシン市場：用途別市場シェア、2022年
・200mmウェーハ、300mmウェーハ、その他

世界の半導体ウェーハスクライビングマシン市場：地域・国別、2018年-2023年、2024年-2029年
世界の半導体ウェーハスクライビングマシン市場：地域別市場シェア、2022年
・北米：アメリカ、カナダ、メキシコ
・ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア
・アジア：中国、日本、韓国、東南アジア、インド
・南米：ブラジル、アルゼンチン
・中東・アフリカ：トルコ、イスラエル、サウジアラビア、UAE

【競合分析】

また、当レポートは主要な市場参加者の分析を提供します。
・主要企業における半導体ウェーハスクライビングマシンのグローバル売上、2018年-2023年
・主要企業における半導体ウェーハスクライビングマシンのグローバル売上シェア、2022年
・主要企業における半導体ウェーハスクライビングマシンのグローバル販売量、2018年-2023年
・主要企業における半導体ウェーハスクライビングマシンのグローバル販売量シェア、2022年

さらに、当レポートは主要企業のプロファイルを提示します。
DISCO、Tokyo Seimitsu (ACCRETECH)、ASM、Synova、Bojiexin、GL Tech Co、Shenyang Heyan Technology、Jiangsu Jing ChuangAdvanced Electronic Technology、Genesem、Advanced Dicing Technologies

*************************************************************

・調査・分析レポートの概要
半導体ウェーハスクライビングマシン市場の定義
市場セグメント
世界の半導体ウェーハスクライビングマシン市場概要
当レポートの特徴・ベネフィット
調査手法と情報源

・世界の半導体ウェーハスクライビングマシン市場規模
世界の半導体ウェーハスクライビングマシン市場規模：2022年 VS 2029年
世界の半導体ウェーハスクライビングマシン市場規模と予測 2018年-2029年

・競争状況
グローバルトップ企業
売上ベースでのグローバルトップ企業
企業別グローバルでの半導体ウェーハスクライビングマシンの売上
グローバルトップ3およびトップ5企業、2022年売上ベース
グローバル企業の半導体ウェーハスクライビングマシン製品タイプ
グローバルにおけるティア1、ティア2、ティア3企業

・タイプ別市場分析
タイプ区分：レーザースクライブ盤、砥石スクライブ盤
半導体ウェーハスクライビングマシンのタイプ別グローバル売上・予測

・用途別市場分析
用途区分：200mmウェーハ、300mmウェーハ、その他
半導体ウェーハスクライビングマシンの用途別グローバル売上・予測

・地域別市場分析
地域別半導体ウェーハスクライビングマシン市場規模 2022年と2029年
地域別半導体ウェーハスクライビングマシン売上・予測
北米市場：アメリカ、カナダ、メキシコ
ヨーロッパ市場：ドイツ、フランス、イギリス、イタリア、ロシア
アジア市場：中国、日本、韓国、東南アジア、インド
南米市場：ブラジル、アルゼンチン
中東・アフリカ市場：トルコ、イスラエル、サウジアラビア、UAE

・主要企業のプロファイル（企業概要、事業概要、主要製品、売上、ニュースなど）
DISCO、Tokyo Seimitsu (ACCRETECH)、ASM、Synova、Bojiexin、GL Tech Co、Shenyang Heyan Technology、Jiangsu Jing ChuangAdvanced Electronic Technology、Genesem、Advanced Dicing Technologies
...

This report aims to provide a comprehensive presentation of the global market for Semiconductor Wafer Scribing Machine, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Wafer Scribing Machine. This report contains market size and forecasts of Semiconductor Wafer Scribing Machine in global, including the following market information:
Global Semiconductor Wafer Scribing Machine Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Semiconductor Wafer Scribing Machine Market Sales, 2018-2023, 2024-2029, (Units)
Global top five Semiconductor Wafer Scribing Machine companies in 2022 (%)
The global Semiconductor Wafer Scribing Machine market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Laser Scribing Machine Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Semiconductor Wafer Scribing Machine include DISCO, Tokyo Seimitsu (ACCRETECH), ASM, Synova, Bojiexin, GL Tech Co, Shenyang Heyan Technology, Jiangsu Jing ChuangAdvanced Electronic Technology and Genesem, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Semiconductor Wafer Scribing Machine manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
[Total Market by Segment]
Global Semiconductor Wafer Scribing Machine Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Semiconductor Wafer Scribing Machine Market Segment Percentages, by Type, 2022 (%)
Laser Scribing Machine
Grinding Wheel Scribing Machine
Global Semiconductor Wafer Scribing Machine Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Semiconductor Wafer Scribing Machine Market Segment Percentages, by Application, 2022 (%)
200mm Wafer
300mm Wafer
Others
Global Semiconductor Wafer Scribing Machine Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Semiconductor Wafer Scribing Machine Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Semiconductor Wafer Scribing Machine revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Semiconductor Wafer Scribing Machine revenues share in global market, 2022 (%)
Key companies Semiconductor Wafer Scribing Machine sales in global market, 2018-2023 (Estimated), (Units)
Key companies Semiconductor Wafer Scribing Machine sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
DISCO
Tokyo Seimitsu (ACCRETECH)
ASM
Synova
Bojiexin
GL Tech Co
Shenyang Heyan Technology
Jiangsu Jing ChuangAdvanced Electronic Technology
Genesem
Advanced Dicing Technologies
Outline of Major Chapters:
Chapter 1: Introduces the definition of Semiconductor Wafer Scribing Machine, market overview.
Chapter 2: Global Semiconductor Wafer Scribing Machine market size in revenue and volume.
Chapter 3: Detailed analysis of Semiconductor Wafer Scribing Machine manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Semiconductor Wafer Scribing Machine in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Semiconductor Wafer Scribing Machine capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.

❖ レポートの目次 ❖

1 Introduction to Research & Analysis Reports
1.1 Semiconductor Wafer Scribing Machine Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Semiconductor Wafer Scribing Machine Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Semiconductor Wafer Scribing Machine Overall Market Size
2.1 Global Semiconductor Wafer Scribing Machine Market Size: 2022 VS 2029
2.2 Global Semiconductor Wafer Scribing Machine Revenue, Prospects & Forecasts: 2018-2029
2.3 Global Semiconductor Wafer Scribing Machine Sales: 2018-2029
3 Company Landscape
3.1 Top Semiconductor Wafer Scribing Machine Players in Global Market
3.2 Top Global Semiconductor Wafer Scribing Machine Companies Ranked by Revenue
3.3 Global Semiconductor Wafer Scribing Machine Revenue by Companies
3.4 Global Semiconductor Wafer Scribing Machine Sales by Companies
3.5 Global Semiconductor Wafer Scribing Machine Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 Semiconductor Wafer Scribing Machine Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers Semiconductor Wafer Scribing Machine Product Type
3.8 Tier 1, Tier 2 and Tier 3 Semiconductor Wafer Scribing Machine Players in Global Market
3.8.1 List of Global Tier 1 Semiconductor Wafer Scribing Machine Companies
3.8.2 List of Global Tier 2 and Tier 3 Semiconductor Wafer Scribing Machine Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type – Global Semiconductor Wafer Scribing Machine Market Size Markets, 2022 & 2029
4.1.2 Laser Scribing Machine
4.1.3 Grinding Wheel Scribing Machine
4.2 By Type – Global Semiconductor Wafer Scribing Machine Revenue & Forecasts
4.2.1 By Type – Global Semiconductor Wafer Scribing Machine Revenue, 2018-2023
4.2.2 By Type – Global Semiconductor Wafer Scribing Machine Revenue, 2024-2029
4.2.3 By Type – Global Semiconductor Wafer Scribing Machine Revenue Market Share, 2018-2029
4.3 By Type – Global Semiconductor Wafer Scribing Machine Sales & Forecasts
4.3.1 By Type – Global Semiconductor Wafer Scribing Machine Sales, 2018-2023
4.3.2 By Type – Global Semiconductor Wafer Scribing Machine Sales, 2024-2029
4.3.3 By Type – Global Semiconductor Wafer Scribing Machine Sales Market Share, 2018-2029
4.4 By Type – Global Semiconductor Wafer Scribing Machine Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global Semiconductor Wafer Scribing Machine Market Size, 2022 & 2029
5.1.2 200mm Wafer
5.1.3 300mm Wafer
5.1.4 Others
5.2 By Application – Global Semiconductor Wafer Scribing Machine Revenue & Forecasts
5.2.1 By Application – Global Semiconductor Wafer Scribing Machine Revenue, 2018-2023
5.2.2 By Application – Global Semiconductor Wafer Scribing Machine Revenue, 2024-2029
5.2.3 By Application – Global Semiconductor Wafer Scribing Machine Revenue Market Share, 2018-2029
5.3 By Application – Global Semiconductor Wafer Scribing Machine Sales & Forecasts
5.3.1 By Application – Global Semiconductor Wafer Scribing Machine Sales, 2018-2023
5.3.2 By Application – Global Semiconductor Wafer Scribing Machine Sales, 2024-2029
5.3.3 By Application – Global Semiconductor Wafer Scribing Machine Sales Market Share, 2018-2029
5.4 By Application – Global Semiconductor Wafer Scribing Machine Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region – Global Semiconductor Wafer Scribing Machine Market Size, 2022 & 2029
6.2 By Region – Global Semiconductor Wafer Scribing Machine Revenue & Forecasts
6.2.1 By Region – Global Semiconductor Wafer Scribing Machine Revenue, 2018-2023
6.2.2 By Region – Global Semiconductor Wafer Scribing Machine Revenue, 2024-2029
6.2.3 By Region – Global Semiconductor Wafer Scribing Machine Revenue Market Share, 2018-2029
6.3 By Region – Global Semiconductor Wafer Scribing Machine Sales & Forecasts
6.3.1 By Region – Global Semiconductor Wafer Scribing Machine Sales, 2018-2023
6.3.2 By Region – Global Semiconductor Wafer Scribing Machine Sales, 2024-2029
6.3.3 By Region – Global Semiconductor Wafer Scribing Machine Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country – North America Semiconductor Wafer Scribing Machine Revenue, 2018-2029
6.4.2 By Country – North America Semiconductor Wafer Scribing Machine Sales, 2018-2029
6.4.3 US Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.4.4 Canada Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.4.5 Mexico Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.5 Europe
6.5.1 By Country – Europe Semiconductor Wafer Scribing Machine Revenue, 2018-2029
6.5.2 By Country – Europe Semiconductor Wafer Scribing Machine Sales, 2018-2029
6.5.3 Germany Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.5.4 France Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.5.5 U.K. Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.5.6 Italy Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.5.7 Russia Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.5.8 Nordic Countries Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.5.9 Benelux Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.6 Asia
6.6.1 By Region – Asia Semiconductor Wafer Scribing Machine Revenue, 2018-2029
6.6.2 By Region – Asia Semiconductor Wafer Scribing Machine Sales, 2018-2029
6.6.3 China Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.6.4 Japan Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.6.5 South Korea Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.6.6 Southeast Asia Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.6.7 India Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.7 South America
6.7.1 By Country – South America Semiconductor Wafer Scribing Machine Revenue, 2018-2029
6.7.2 By Country – South America Semiconductor Wafer Scribing Machine Sales, 2018-2029
6.7.3 Brazil Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.7.4 Argentina Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country – Middle East & Africa Semiconductor Wafer Scribing Machine Revenue, 2018-2029
6.8.2 By Country – Middle East & Africa Semiconductor Wafer Scribing Machine Sales, 2018-2029
6.8.3 Turkey Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.8.4 Israel Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.8.5 Saudi Arabia Semiconductor Wafer Scribing Machine Market Size, 2018-2029
6.8.6 UAE Semiconductor Wafer Scribing Machine Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 DISCO
7.1.1 DISCO Company Summary
7.1.2 DISCO Business Overview
7.1.3 DISCO Semiconductor Wafer Scribing Machine Major Product Offerings
7.1.4 DISCO Semiconductor Wafer Scribing Machine Sales and Revenue in Global (2018-2023)
7.1.5 DISCO Key News & Latest Developments
7.2 Tokyo Seimitsu (ACCRETECH)
7.2.1 Tokyo Seimitsu (ACCRETECH) Company Summary
7.2.2 Tokyo Seimitsu (ACCRETECH) Business Overview
7.2.3 Tokyo Seimitsu (ACCRETECH) Semiconductor Wafer Scribing Machine Major Product Offerings
7.2.4 Tokyo Seimitsu (ACCRETECH) Semiconductor Wafer Scribing Machine Sales and Revenue in Global (2018-2023)
7.2.5 Tokyo Seimitsu (ACCRETECH) Key News & Latest Developments
7.3 ASM
7.3.1 ASM Company Summary
7.3.2 ASM Business Overview
7.3.3 ASM Semiconductor Wafer Scribing Machine Major Product Offerings
7.3.4 ASM Semiconductor Wafer Scribing Machine Sales and Revenue in Global (2018-2023)
7.3.5 ASM Key News & Latest Developments
7.4 Synova
7.4.1 Synova Company Summary
7.4.2 Synova Business Overview
7.4.3 Synova Semiconductor Wafer Scribing Machine Major Product Offerings
7.4.4 Synova Semiconductor Wafer Scribing Machine Sales and Revenue in Global (2018-2023)
7.4.5 Synova Key News & Latest Developments
7.5 Bojiexin
7.5.1 Bojiexin Company Summary
7.5.2 Bojiexin Business Overview
7.5.3 Bojiexin Semiconductor Wafer Scribing Machine Major Product Offerings
7.5.4 Bojiexin Semiconductor Wafer Scribing Machine Sales and Revenue in Global (2018-2023)
7.5.5 Bojiexin Key News & Latest Developments
7.6 GL Tech Co
7.6.1 GL Tech Co Company Summary
7.6.2 GL Tech Co Business Overview
7.6.3 GL Tech Co Semiconductor Wafer Scribing Machine Major Product Offerings
7.6.4 GL Tech Co Semiconductor Wafer Scribing Machine Sales and Revenue in Global (2018-2023)
7.6.5 GL Tech Co Key News & Latest Developments
7.7 Shenyang Heyan Technology
7.7.1 Shenyang Heyan Technology Company Summary
7.7.2 Shenyang Heyan Technology Business Overview
7.7.3 Shenyang Heyan Technology Semiconductor Wafer Scribing Machine Major Product Offerings
7.7.4 Shenyang Heyan Technology Semiconductor Wafer Scribing Machine Sales and Revenue in Global (2018-2023)
7.7.5 Shenyang Heyan Technology Key News & Latest Developments
7.8 Jiangsu Jing ChuangAdvanced Electronic Technology
7.8.1 Jiangsu Jing ChuangAdvanced Electronic Technology Company Summary
7.8.2 Jiangsu Jing ChuangAdvanced Electronic Technology Business Overview
7.8.3 Jiangsu Jing ChuangAdvanced Electronic Technology Semiconductor Wafer Scribing Machine Major Product Offerings
7.8.4 Jiangsu Jing ChuangAdvanced Electronic Technology Semiconductor Wafer Scribing Machine Sales and Revenue in Global (2018-2023)
7.8.5 Jiangsu Jing ChuangAdvanced Electronic Technology Key News & Latest Developments
7.9 Genesem
7.9.1 Genesem Company Summary
7.9.2 Genesem Business Overview
7.9.3 Genesem Semiconductor Wafer Scribing Machine Major Product Offerings
7.9.4 Genesem Semiconductor Wafer Scribing Machine Sales and Revenue in Global (2018-2023)
7.9.5 Genesem Key News & Latest Developments
7.10 Advanced Dicing Technologies
7.10.1 Advanced Dicing Technologies Company Summary
7.10.2 Advanced Dicing Technologies Business Overview
7.10.3 Advanced Dicing Technologies Semiconductor Wafer Scribing Machine Major Product Offerings
7.10.4 Advanced Dicing Technologies Semiconductor Wafer Scribing Machine Sales and Revenue in Global (2018-2023)
7.10.5 Advanced Dicing Technologies Key News & Latest Developments
8 Global Semiconductor Wafer Scribing Machine Production Capacity, Analysis
8.1 Global Semiconductor Wafer Scribing Machine Production Capacity, 2018-2029
8.2 Semiconductor Wafer Scribing Machine Production Capacity of Key Manufacturers in Global Market
8.3 Global Semiconductor Wafer Scribing Machine Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 Semiconductor Wafer Scribing Machine Supply Chain Analysis
10.1 Semiconductor Wafer Scribing Machine Industry Value Chain
10.2 Semiconductor Wafer Scribing Machine Upstream Market
10.3 Semiconductor Wafer Scribing Machine Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 Semiconductor Wafer Scribing Machine Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer

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