カテゴリー： Market Monitor Global, 世界, 部品/材料

ICパッケージ基板材料の世界市場見通し2023年-2029年

◆英語タイトル：IC Package Substrate Material Market, Global Outlook and Forecast 2023-2029

Market Monitor Globalが発行した調査報告書（MMG23FB0334）◆商品コード：MMG23FB0334
◆発行会社（リサーチ会社）：Market Monitor Global
◆発行日：2023年2月
◆ページ数：79
◆レポート形式：英語 / PDF
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◆調査対象地域：グローバル、北米、アメリカ、ヨーロッパ、アジア、日本、中国、東南アジア、インド、南米、中東・アフリカなど
◆産業分野：化学＆材料
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❖ レポートの概要 ❖

当調査レポートは次の情報を含め、世界のICパッケージ基板材料市場規模と予測を収録しています。・世界のICパッケージ基板材料市場：売上、2018年-2023年、2024年-2029年
・世界のICパッケージ基板材料市場：販売量、2018年-2023年、2024年-2029年
・世界のトップ5企業、2022年

世界のICパッケージ基板材料市場は2022年に000Mドルと評価され、予測期間中に000％のCAGRで2029年までに000Mドルに達すると予測されています。米国市場は2022年に000Mドルと推定されており、中国は2029年までに000Mドルに達すると予測されています。「銅箔」セグメントは今後6年間、000%のCAGRで2029年までに000Mドルに成長すると予測されています。

ICパッケージ基板材料のグローバル主要企業は、Ajinomoto、Mitsubishi Gas Chemical、Mitsui Mining & Smelting、Panasonic、TTM Technologies、ASE Metarial、Ibiden、Unimicron、Kinsus、Shennan Circuit、Nanya、Showa Denkoなどです。2022年にトップ5企業がグローバル売上シェアの約000%を占めています。

MARKET MONITOR GLOBAL（MMG）は、ICパッケージ基板材料のメーカー、サプライヤー、流通業者、および業界の専門家を調査しました。これには、販売量、売上、需要、価格変動、製品タイプ、最近の動向と計画、産業トレンド、成長要因、課題、阻害要因、潜在的なリスクなどが含まれます。

【セグメント別市場分析】

世界のICパッケージ基板材料市場：タイプ別、2018年-2023年、2024年-2029年
世界のICパッケージ基板材料市場：タイプ別市場シェア、2022年
・銅箔、樹脂基板、ドライフィルム（固体フォトレジスト）、ウェットフィルム（液体フォトレジスト）、金属（銅、ニッケル、金塩）、その他

世界のICパッケージ基板材料市場：用途別、2018年-2023年、2024年-2029年
世界のICパッケージ基板材料市場：用途別市場シェア、2022年
・メモリーチップ実装基板、Mems実装システム、Rfモジュール実装基板、その他

世界のICパッケージ基板材料市場：地域・国別、2018年-2023年、2024年-2029年
世界のICパッケージ基板材料市場：地域別市場シェア、2022年
・北米：アメリカ、カナダ、メキシコ
・ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア
・アジア：中国、日本、韓国、東南アジア、インド
・南米：ブラジル、アルゼンチン
・中東・アフリカ：トルコ、イスラエル、サウジアラビア、UAE

【競合分析】

また、当レポートは主要な市場参加者の分析を提供します。
・主要企業におけるICパッケージ基板材料のグローバル売上、2018年-2023年
・主要企業におけるICパッケージ基板材料のグローバル売上シェア、2022年
・主要企業におけるICパッケージ基板材料のグローバル販売量、2018年-2023年
・主要企業におけるICパッケージ基板材料のグローバル販売量シェア、2022年

さらに、当レポートは主要企業のプロファイルを提示します。
Ajinomoto、Mitsubishi Gas Chemical、Mitsui Mining & Smelting、Panasonic、TTM Technologies、ASE Metarial、Ibiden、Unimicron、Kinsus、Shennan Circuit、Nanya、Showa Denko

*************************************************************

・調査・分析レポートの概要
ICパッケージ基板材料市場の定義
市場セグメント
世界のICパッケージ基板材料市場概要
当レポートの特徴・ベネフィット
調査手法と情報源

・世界のICパッケージ基板材料市場規模
世界のICパッケージ基板材料市場規模：2022年 VS 2029年
世界のICパッケージ基板材料市場規模と予測 2018年-2029年

・競争状況
グローバルトップ企業
売上ベースでのグローバルトップ企業
企業別グローバルでのICパッケージ基板材料の売上
グローバルトップ3およびトップ5企業、2022年売上ベース
グローバル企業のICパッケージ基板材料製品タイプ
グローバルにおけるティア1、ティア2、ティア3企業

・タイプ別市場分析
タイプ区分：銅箔、樹脂基板、ドライフィルム（固体フォトレジスト）、ウェットフィルム（液体フォトレジスト）、金属（銅、ニッケル、金塩）、その他
ICパッケージ基板材料のタイプ別グローバル売上・予測

・用途別市場分析
用途区分：メモリーチップ実装基板、Mems実装システム、Rfモジュール実装基板、その他
ICパッケージ基板材料の用途別グローバル売上・予測

・地域別市場分析
地域別ICパッケージ基板材料市場規模 2022年と2029年
地域別ICパッケージ基板材料売上・予測
北米市場：アメリカ、カナダ、メキシコ
ヨーロッパ市場：ドイツ、フランス、イギリス、イタリア、ロシア
アジア市場：中国、日本、韓国、東南アジア、インド
南米市場：ブラジル、アルゼンチン
中東・アフリカ市場：トルコ、イスラエル、サウジアラビア、UAE

・主要企業のプロファイル（企業概要、事業概要、主要製品、売上、ニュースなど）
Ajinomoto、Mitsubishi Gas Chemical、Mitsui Mining & Smelting、Panasonic、TTM Technologies、ASE Metarial、Ibiden、Unimicron、Kinsus、Shennan Circuit、Nanya、Showa Denko
...

This report aims to provide a comprehensive presentation of the global market for IC Package Substrate Material, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Package Substrate Material. This report contains market size and forecasts of IC Package Substrate Material in global, including the following market information:
Global IC Package Substrate Material Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global IC Package Substrate Material Market Sales, 2018-2023, 2024-2029, (Tons)
Global top five IC Package Substrate Material companies in 2022 (%)
The global IC Package Substrate Material market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Copper Foil Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of IC Package Substrate Material include Ajinomoto, Mitsubishi Gas Chemical, Mitsui Mining & Smelting, Panasonic, TTM Technologies, ASE Metarial, Ibiden, Unimicron and Kinsus, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the IC Package Substrate Material manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
[Total Market by Segment]
Global IC Package Substrate Material Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Tons)
Global IC Package Substrate Material Market Segment Percentages, by Type, 2022 (%)
Copper Foil
Resin Substrate
Dry Film (Solid Photoresist)
Wet Film (Liquid Photoresist)
Metal (Copper, Nickel, Gold Salt)
Others
Global IC Package Substrate Material Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Tons)
Global IC Package Substrate Material Market Segment Percentages, by Application, 2022 (%)
Memory Chip Packaging Substrate
Mems Packaging System
Rf Module Packaging Substrate
Others
Global IC Package Substrate Material Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Tons)
Global IC Package Substrate Material Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies IC Package Substrate Material revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies IC Package Substrate Material revenues share in global market, 2022 (%)
Key companies IC Package Substrate Material sales in global market, 2018-2023 (Estimated), (Tons)
Key companies IC Package Substrate Material sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Ajinomoto
Mitsubishi Gas Chemical
Mitsui Mining & Smelting
Panasonic
TTM Technologies
ASE Metarial
Ibiden
Unimicron
Kinsus
Shennan Circuit
Nanya
Showa Denko
Outline of Major Chapters:
Chapter 1: Introduces the definition of IC Package Substrate Material, market overview.
Chapter 2: Global IC Package Substrate Material market size in revenue and volume.
Chapter 3: Detailed analysis of IC Package Substrate Material manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of IC Package Substrate Material in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global IC Package Substrate Material capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.

❖ レポートの目次 ❖

1 Introduction to Research & Analysis Reports
1.1 IC Package Substrate Material Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global IC Package Substrate Material Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global IC Package Substrate Material Overall Market Size
2.1 Global IC Package Substrate Material Market Size: 2022 VS 2029
2.2 Global IC Package Substrate Material Revenue, Prospects & Forecasts: 2018-2029
2.3 Global IC Package Substrate Material Sales: 2018-2029
3 Company Landscape
3.1 Top IC Package Substrate Material Players in Global Market
3.2 Top Global IC Package Substrate Material Companies Ranked by Revenue
3.3 Global IC Package Substrate Material Revenue by Companies
3.4 Global IC Package Substrate Material Sales by Companies
3.5 Global IC Package Substrate Material Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 IC Package Substrate Material Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers IC Package Substrate Material Product Type
3.8 Tier 1, Tier 2 and Tier 3 IC Package Substrate Material Players in Global Market
3.8.1 List of Global Tier 1 IC Package Substrate Material Companies
3.8.2 List of Global Tier 2 and Tier 3 IC Package Substrate Material Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type – Global IC Package Substrate Material Market Size Markets, 2022 & 2029
4.1.2 Copper Foil
4.1.3 Resin Substrate
4.1.4 Dry Film (Solid Photoresist)
4.1.5 Wet Film (Liquid Photoresist)
4.1.6 Metal (Copper, Nickel, Gold Salt)
4.1.7 Others
4.2 By Type – Global IC Package Substrate Material Revenue & Forecasts
4.2.1 By Type – Global IC Package Substrate Material Revenue, 2018-2023
4.2.2 By Type – Global IC Package Substrate Material Revenue, 2024-2029
4.2.3 By Type – Global IC Package Substrate Material Revenue Market Share, 2018-2029
4.3 By Type – Global IC Package Substrate Material Sales & Forecasts
4.3.1 By Type – Global IC Package Substrate Material Sales, 2018-2023
4.3.2 By Type – Global IC Package Substrate Material Sales, 2024-2029
4.3.3 By Type – Global IC Package Substrate Material Sales Market Share, 2018-2029
4.4 By Type – Global IC Package Substrate Material Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global IC Package Substrate Material Market Size, 2022 & 2029
5.1.2 Memory Chip Packaging Substrate
5.1.3 Mems Packaging System
5.1.4 Rf Module Packaging Substrate
5.1.5 Others
5.2 By Application – Global IC Package Substrate Material Revenue & Forecasts
5.2.1 By Application – Global IC Package Substrate Material Revenue, 2018-2023
5.2.2 By Application – Global IC Package Substrate Material Revenue, 2024-2029
5.2.3 By Application – Global IC Package Substrate Material Revenue Market Share, 2018-2029
5.3 By Application – Global IC Package Substrate Material Sales & Forecasts
5.3.1 By Application – Global IC Package Substrate Material Sales, 2018-2023
5.3.2 By Application – Global IC Package Substrate Material Sales, 2024-2029
5.3.3 By Application – Global IC Package Substrate Material Sales Market Share, 2018-2029
5.4 By Application – Global IC Package Substrate Material Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region – Global IC Package Substrate Material Market Size, 2022 & 2029
6.2 By Region – Global IC Package Substrate Material Revenue & Forecasts
6.2.1 By Region – Global IC Package Substrate Material Revenue, 2018-2023
6.2.2 By Region – Global IC Package Substrate Material Revenue, 2024-2029
6.2.3 By Region – Global IC Package Substrate Material Revenue Market Share, 2018-2029
6.3 By Region – Global IC Package Substrate Material Sales & Forecasts
6.3.1 By Region – Global IC Package Substrate Material Sales, 2018-2023
6.3.2 By Region – Global IC Package Substrate Material Sales, 2024-2029
6.3.3 By Region – Global IC Package Substrate Material Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country – North America IC Package Substrate Material Revenue, 2018-2029
6.4.2 By Country – North America IC Package Substrate Material Sales, 2018-2029
6.4.3 US IC Package Substrate Material Market Size, 2018-2029
6.4.4 Canada IC Package Substrate Material Market Size, 2018-2029
6.4.5 Mexico IC Package Substrate Material Market Size, 2018-2029
6.5 Europe
6.5.1 By Country – Europe IC Package Substrate Material Revenue, 2018-2029
6.5.2 By Country – Europe IC Package Substrate Material Sales, 2018-2029
6.5.3 Germany IC Package Substrate Material Market Size, 2018-2029
6.5.4 France IC Package Substrate Material Market Size, 2018-2029
6.5.5 U.K. IC Package Substrate Material Market Size, 2018-2029
6.5.6 Italy IC Package Substrate Material Market Size, 2018-2029
6.5.7 Russia IC Package Substrate Material Market Size, 2018-2029
6.5.8 Nordic Countries IC Package Substrate Material Market Size, 2018-2029
6.5.9 Benelux IC Package Substrate Material Market Size, 2018-2029
6.6 Asia
6.6.1 By Region – Asia IC Package Substrate Material Revenue, 2018-2029
6.6.2 By Region – Asia IC Package Substrate Material Sales, 2018-2029
6.6.3 China IC Package Substrate Material Market Size, 2018-2029
6.6.4 Japan IC Package Substrate Material Market Size, 2018-2029
6.6.5 South Korea IC Package Substrate Material Market Size, 2018-2029
6.6.6 Southeast Asia IC Package Substrate Material Market Size, 2018-2029
6.6.7 India IC Package Substrate Material Market Size, 2018-2029
6.7 South America
6.7.1 By Country – South America IC Package Substrate Material Revenue, 2018-2029
6.7.2 By Country – South America IC Package Substrate Material Sales, 2018-2029
6.7.3 Brazil IC Package Substrate Material Market Size, 2018-2029
6.7.4 Argentina IC Package Substrate Material Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country – Middle East & Africa IC Package Substrate Material Revenue, 2018-2029
6.8.2 By Country – Middle East & Africa IC Package Substrate Material Sales, 2018-2029
6.8.3 Turkey IC Package Substrate Material Market Size, 2018-2029
6.8.4 Israel IC Package Substrate Material Market Size, 2018-2029
6.8.5 Saudi Arabia IC Package Substrate Material Market Size, 2018-2029
6.8.6 UAE IC Package Substrate Material Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 Ajinomoto
7.1.1 Ajinomoto Company Summary
7.1.2 Ajinomoto Business Overview
7.1.3 Ajinomoto IC Package Substrate Material Major Product Offerings
7.1.4 Ajinomoto IC Package Substrate Material Sales and Revenue in Global (2018-2023)
7.1.5 Ajinomoto Key News & Latest Developments
7.2 Mitsubishi Gas Chemical
7.2.1 Mitsubishi Gas Chemical Company Summary
7.2.2 Mitsubishi Gas Chemical Business Overview
7.2.3 Mitsubishi Gas Chemical IC Package Substrate Material Major Product Offerings
7.2.4 Mitsubishi Gas Chemical IC Package Substrate Material Sales and Revenue in Global (2018-2023)
7.2.5 Mitsubishi Gas Chemical Key News & Latest Developments
7.3 Mitsui Mining & Smelting
7.3.1 Mitsui Mining & Smelting Company Summary
7.3.2 Mitsui Mining & Smelting Business Overview
7.3.3 Mitsui Mining & Smelting IC Package Substrate Material Major Product Offerings
7.3.4 Mitsui Mining & Smelting IC Package Substrate Material Sales and Revenue in Global (2018-2023)
7.3.5 Mitsui Mining & Smelting Key News & Latest Developments
7.4 Panasonic
7.4.1 Panasonic Company Summary
7.4.2 Panasonic Business Overview
7.4.3 Panasonic IC Package Substrate Material Major Product Offerings
7.4.4 Panasonic IC Package Substrate Material Sales and Revenue in Global (2018-2023)
7.4.5 Panasonic Key News & Latest Developments
7.5 TTM Technologies
7.5.1 TTM Technologies Company Summary
7.5.2 TTM Technologies Business Overview
7.5.3 TTM Technologies IC Package Substrate Material Major Product Offerings
7.5.4 TTM Technologies IC Package Substrate Material Sales and Revenue in Global (2018-2023)
7.5.5 TTM Technologies Key News & Latest Developments
7.6 ASE Metarial
7.6.1 ASE Metarial Company Summary
7.6.2 ASE Metarial Business Overview
7.6.3 ASE Metarial IC Package Substrate Material Major Product Offerings
7.6.4 ASE Metarial IC Package Substrate Material Sales and Revenue in Global (2018-2023)
7.6.5 ASE Metarial Key News & Latest Developments
7.7 Ibiden
7.7.1 Ibiden Company Summary
7.7.2 Ibiden Business Overview
7.7.3 Ibiden IC Package Substrate Material Major Product Offerings
7.7.4 Ibiden IC Package Substrate Material Sales and Revenue in Global (2018-2023)
7.7.5 Ibiden Key News & Latest Developments
7.8 Unimicron
7.8.1 Unimicron Company Summary
7.8.2 Unimicron Business Overview
7.8.3 Unimicron IC Package Substrate Material Major Product Offerings
7.8.4 Unimicron IC Package Substrate Material Sales and Revenue in Global (2018-2023)
7.8.5 Unimicron Key News & Latest Developments
7.9 Kinsus
7.9.1 Kinsus Company Summary
7.9.2 Kinsus Business Overview
7.9.3 Kinsus IC Package Substrate Material Major Product Offerings
7.9.4 Kinsus IC Package Substrate Material Sales and Revenue in Global (2018-2023)
7.9.5 Kinsus Key News & Latest Developments
7.10 Shennan Circuit
7.10.1 Shennan Circuit Company Summary
7.10.2 Shennan Circuit Business Overview
7.10.3 Shennan Circuit IC Package Substrate Material Major Product Offerings
7.10.4 Shennan Circuit IC Package Substrate Material Sales and Revenue in Global (2018-2023)
7.10.5 Shennan Circuit Key News & Latest Developments
7.11 Nanya
7.11.1 Nanya Company Summary
7.11.2 Nanya IC Package Substrate Material Business Overview
7.11.3 Nanya IC Package Substrate Material Major Product Offerings
7.11.4 Nanya IC Package Substrate Material Sales and Revenue in Global (2018-2023)
7.11.5 Nanya Key News & Latest Developments
7.12 Showa Denko
7.12.1 Showa Denko Company Summary
7.12.2 Showa Denko IC Package Substrate Material Business Overview
7.12.3 Showa Denko IC Package Substrate Material Major Product Offerings
7.12.4 Showa Denko IC Package Substrate Material Sales and Revenue in Global (2018-2023)
7.12.5 Showa Denko Key News & Latest Developments
8 Global IC Package Substrate Material Production Capacity, Analysis
8.1 Global IC Package Substrate Material Production Capacity, 2018-2029
8.2 IC Package Substrate Material Production Capacity of Key Manufacturers in Global Market
8.3 Global IC Package Substrate Material Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 IC Package Substrate Material Supply Chain Analysis
10.1 IC Package Substrate Material Industry Value Chain
10.2 IC Package Substrate Material Upstream Market
10.3 IC Package Substrate Material Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 IC Package Substrate Material Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer



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