1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
4.1. Introduction
4.2. High-k & CVD ALD Metal Precursors Market, by Region
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Emerging applications for high-k materials in VLSI technology
5.1.1.2. Rising need for rapidly accessing and storing data
5.1.1.3. Increasing demand for metal precursors made of aluminum, cobalt, and titanium
5.1.2. Restraints
5.1.2.1. Selection of the right precursor
5.1.3. Opportunities
5.1.3.1. High demand for thin-film-materials for new industrial applications
5.1.3.2. Rising development of LED technology and high dielectric materials
5.1.4. Challenges
5.1.4.1. Associated complexities in the deposition process
5.2. Market Segmentation Analysis
5.2.1. Technology: Increasing demand for Capacitors for high-density memory devices and low-power processors
5.2.2. Metal: Rising adoption of Ruthenium metal for high-k & CVD ALD metal precursors for advanced photovoltaic technologies
5.2.3. Industry Vertical: Growing usage of high-k & CVD ALD metal precursors across consumer electronics
5.3. Market Trend Analysis
5.3.1. Rising investments in the electronics and military industries in the Americas vying for semiconductors based on advanced high-k & ALD CVD metal precursors
5.3.2. Strong player presence and increasing demand for advanced semiconductor components across Asia-Pacific
5.3.3. Improvements in semiconductor production supply chain and large scope for chip making in developing economies in the EMEA
5.4. Cumulative Impact of High Inflation
5.5. Porter’s Five Forces Analysis
5.5.1. Threat of New Entrants
5.5.2. Threat of Substitutes
5.5.3. Bargaining Power of Customers
5.5.4. Bargaining Power of Suppliers
5.5.5. Industry Rivalry
5.6. Value Chain & Critical Path Analysis
5.7. Regulatory Framework
6. High-k & CVD ALD Metal Precursors Market, by Technology
6.1. Introduction
6.2. Capacitors
6.3. Gates
6.4. Interconnect
7. High-k & CVD ALD Metal Precursors Market, by Metal
7.1. Introduction
7.2. Iridium
7.3. Molybdenum
7.4.1. MoCl5
7.4.2. MoO2Cl2
7.4.3. MoOcl4
7.4. Palladium
7.5. Platinum
7.6. Rhodium
7.7. Ruthenium
8. High-k & CVD ALD Metal Precursors Market, by Industry Vertical
8.1. Introduction
8.2. Aerospace & Defence
8.3. Automotive
8.4. Consumer Electronics
8.5. Healthcare
8.6. Industrial
8.7. IT & Telecommunication
9. Americas High-k & CVD ALD Metal Precursors Market
9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States
10. Asia-Pacific High-k & CVD ALD Metal Precursors Market
10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam
11. Europe, Middle East & Africa High-k & CVD ALD Metal Precursors Market
11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom
12. Competitive Landscape
12.1. FPNV Positioning Matrix
12.2. Market Share Analysis, By Key Player
12.3. Competitive Scenario Analysis, By Key Player
12.3.1. Merger & Acquisition
12.3.1.1. Soulbrain to Acquire Precursor Firm DNF
12.3.1.2. Ascensus Acquires Independent Distributor – Strem Chemicals UK
12.3.1.3. Applied Materials Broadens its Technology Portfolio for Specialty Chips with Acquisition of Picosun
12.3.2. Agreement, Collaboration, & Partnership
12.3.2.1. Meta Materials and Panasonic Industry Collaborate on Next Generation Transparent Conductive Materials
12.3.2.2. Lam Research, Entegris, Gelest Team Up to Advance EUV Dry Resist Technology Ecosystem
12.3.3. New Product Launch & Enhancement
12.3.3.1. Applied Materials Advances Heterogeneous Chip Integration with New Technologies for Hybrid Bonding and Through-Silicon Vias
12.3.3.2. SK hynix offering power-saving and high-speed mobile DRAM based on HKMG tech
12.3.3.3. ThermVac develops vapor deposition technologies for SiC, TaC, B4C and PYC
13. Competitive Portfolio
13.1. Key Company Profiles
13.1.1. Adeka Corporation
13.1.2. Air Liquide S.A.
13.1.3. Applied Materials, Inc.
13.1.4. City Chemical LLC
13.1.5. Colnatec LLC
13.1.6. DNF Co., Ltd. by Soulbrain Group
13.1.7. Dockweiler Chemicals GmbH
13.1.8. DuPont de Nemours, Inc.
13.1.9. Entegris, Inc.
13.1.10. EpiValence
13.1.11. Fujifilm Holdings Corporation
13.1.12. Gelest, Inc. by Mitsubishi Chemical Corporation
13.1.13. Hansol Chemical
13.1.14. JSR Corporation
13.1.15. Kojundo Chemical Laboratory Co.,Ltd.
13.1.16. Linde PLC
13.1.17. Mecaro Co., Ltd.
13.1.18. Merck KGaA
13.1.19. Nanmat Technology Co., Ltd.
13.1.20. Nanomate Technology Inc.
13.1.21. Optima Chemical
13.1.22. Pegasus Chemicals Private Limited
13.1.23. Samsung Electronics Co., Ltd.
13.1.24. Shanghai Aladdin Biochemical Technology Co., Ltd.
13.1.25. Strem Chemicals, Inc. by Ascensus Specialties LLC
13.1.26. Tanaka Holdings Co., Ltd.
13.1.27. The Dow Chemical Company
13.1.28. Tri Chemical Laboratories Inc.
13.1.29. TSI Incorporated
13.1.30. UP Chemical Co., Ltd.
13.2. Key Product Portfolio
14. Appendix
14.1. Discussion Guide
14.2. License & Pricing