カテゴリー： QYResearch, IT/電子, 世界

ICパッケージ基板のグローバル市場2023年：FC-BGA、FC-CSP、WB BGA、WB CSP、RFモジュール、その他

◆英語タイトル：Global IC Package Substrates Market Research Report 2023
	◆商品コード：QYR23MA3689 ◆発行会社（リサーチ会社）：QYResearch ◆発行日：2023年3月 ◆ページ数：119 ◆レポート形式：英語 / PDF ◆納品方法：Eメール（受注後2-3営業日） ◆調査対象地域：グローバル ◆産業分野：電子＆半導体

◆販売価格オプション（消費税別）

Single User（1名様閲覧用）	USD2,900 ⇒換算￥440,800	見積依頼/購入/質問フォーム
Multi User（5名様閲覧用）	USD4,350 ⇒換算￥661,200	見積依頼/購入/質問フォーム
Enterprise License（同一法人内共有可）	USD5,800 ⇒換算￥881,600	見積依頼/購入/質問フォーム

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❖ レポートの概要 ❖

本調査レポートは世界のICパッケージ基板市場について調査・分析し、世界のICパッケージ基板市場概要、メーカー別競争状況、地域別生産量、地域別消費量、タイプ別セグメント分析（FC-BGA、FC-CSP、WB BGA、WB CSP、RFモジュール、その他）、用途別セグメント分析（スマートフォン、PC（タブレット＆ノートパソコン）、ウェアラブル機器、その他）、主要企業のプロファイル、市場動向などに関する情報を掲載しています。主要企業としては、Unimicron、Ibiden、Nan Ya PCB、Shinko Electric Industries、Kinsus Interconnect Technology、AT&S、Semco、Kyocera、TOPPAN、Zhen Ding Technology、Daeduck Electronics、ASE Material、LG InnoTek、Simmtech、Shennan Circuit、Shenzhen Fastprint Circuit Tech、ACCESS、Suntak Technology、National Center for Advanced Packaging (NCAP China)、Huizhou China Eagle Electronic Technology、DSBJ、Shenzhen Kinwong Electronic、AKM Meadville、Victory Giant Technologyなどが含まれています。世界のICパッケージ基板市場は、2022年にXXX米ドル、2029年にはXXX米ドルに達すると予測され、予測期間中の年平均成長率はXXX％です。COVID-19とロシア・ウクライナ戦争による影響は、ICパッケージ基板市場規模を推定する際に考慮しました。

・ICパッケージ基板市場の概要
- 製品の定義
- ICパッケージ基板のタイプ別セグメント
- 世界のICパッケージ基板市場成長率のタイプ別分析（FC-BGA、FC-CSP、WB BGA、WB CSP、RFモジュール、その他）
- ICパッケージ基板の用途別セグメント
- 世界のICパッケージ基板市場成長率の用途別分析（スマートフォン、PC（タブレット＆ノートパソコン）、ウェアラブル機器、その他）
- 世界市場の成長展望
- 世界のICパッケージ基板生産量の推定と予測（2018年-2029年）
- 世界のICパッケージ基板生産能力の推定と予測（2018年-2029年）
- ICパッケージ基板の平均価格の推定と予測（2018年-2029年）
- 前提条件と制限事項

・メーカー別競争状況
- メーカー別市場シェア
- 世界の主要メーカー、業界ランキング分析
- メーカー別平均価格
- ICパッケージ基板市場の競争状況およびトレンド

・ICパッケージ基板の地域別生産量
- ICパッケージ基板生産量の地域別推計と予測（2018年-2029年）
- 地域別ICパッケージ基板価格分析（2018年-2023年）
- 北米のICパッケージ基板生産規模（2018年-2029年）
- ヨーロッパのICパッケージ基板生産規模（2018年-2029年）
- 中国のICパッケージ基板生産規模（2018年-2029年）
- 日本のICパッケージ基板生産規模（2018年-2029年）
- 韓国のICパッケージ基板生産規模（2018年-2029年）
- インドのICパッケージ基板生産規模（2018年-2029年）

・ICパッケージ基板の地域別消費量
- ICパッケージ基板消費量の地域別推計と予測（2018年-2029年）
- 北米のICパッケージ基板消費量（2018年-2029年）
- アメリカのICパッケージ基板消費量（2018年-2029年）
- ヨーロッパのICパッケージ基板消費量（2018年-2029年）
- アジア太平洋のICパッケージ基板消費量（2018年-2029年）
- 中国のICパッケージ基板消費量（2018年-2029年）
- 日本のICパッケージ基板消費量（2018年-2029年）
- 韓国のICパッケージ基板消費量（2018年-2029年）
- 東南アジアのICパッケージ基板消費量（2018年-2029年）
- インドのICパッケージ基板消費量（2018年-2029年）
- 中南米・中東・アフリカのICパッケージ基板消費量（2018年-2029年）

・タイプ別セグメント：FC-BGA、FC-CSP、WB BGA、WB CSP、RFモジュール、その他
- 世界のICパッケージ基板のタイプ別生産量（2018年-2023年）
- 世界のICパッケージ基板のタイプ別生産量（2024年-2029年）
- 世界のICパッケージ基板のタイプ別価格

・用途別セグメント：スマートフォン、PC（タブレット＆ノートパソコン）、ウェアラブル機器、その他
- 世界のICパッケージ基板の用途別生産量（2018年-2023年）
- 世界のICパッケージ基板の用途別生産量（2024年-2029年）
- 世界のICパッケージ基板の用途別価格

・主要企業のプロファイル：企業情報、製品ポートフォリオ、生産量、価格、動向
Unimicron、Ibiden、Nan Ya PCB、Shinko Electric Industries、Kinsus Interconnect Technology、AT&S、Semco、Kyocera、TOPPAN、Zhen Ding Technology、Daeduck Electronics、ASE Material、LG InnoTek、Simmtech、Shennan Circuit、Shenzhen Fastprint Circuit Tech、ACCESS、Suntak Technology、National Center for Advanced Packaging (NCAP China)、Huizhou China Eagle Electronic Technology、DSBJ、Shenzhen Kinwong Electronic、AKM Meadville、Victory Giant Technology

・産業チェーンと販売チャネルの分析
- ICパッケージ基板産業チェーン分析
- ICパッケージ基板の主要原材料
- ICパッケージ基板の販売チャネル
- ICパッケージ基板のディストリビューター
- ICパッケージ基板の主要顧客

・ICパッケージ基板市場ダイナミクス
- ICパッケージ基板の業界動向
- ICパッケージ基板市場の成長ドライバ、課題、阻害要因

・調査成果および結論

・調査方法とデータソース

IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%.
Highlights
The global IC Package Substrates market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The major manufacturers that provide IC Package Substrates in China include SCC, Nanya and Access Substrates, etc. The top three manufacturers account for more than 50% of the market share. Among them, WB BGA and FC-CSP accounted for 39% and 38%, respectively. Smartphones and PCs (tablets and laptops) are the most widely used, accounting for 64% and 23%, respectively.
Report Scope
This report aims to provide a comprehensive presentation of the global market for IC Package Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Package Substrates.
The IC Package Substrates market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global IC Package Substrates market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Package Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect Technology
AT&S
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
ASE Material
LG InnoTek
Simmtech
Shennan Circuit
Shenzhen Fastprint Circuit Tech
ACCESS
Suntak Technology
National Center for Advanced Packaging (NCAP China)
Huizhou China Eagle Electronic Technology
DSBJ
Shenzhen Kinwong Electronic
AKM Meadville
Victory Giant Technology
Segment by Type
FC-BGA
FC-CSP
WB BGA
WB CSP
RF Module
Others
Segment by Application
Smart Phone
PC (tablet and Laptop)
Wearable Device
Others
Production by Region
Japan
South Korea
China Taiwan
China
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of IC Package Substrates manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of IC Package Substrates by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of IC Package Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

❖ レポートの目次 ❖

1 IC Package Substrates Market Overview
1.1 Product Definition
1.2 IC Package Substrates Segment by Type
1.2.1 Global IC Package Substrates Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 FC-BGA
1.2.3 FC-CSP
1.2.4 WB BGA
1.2.5 WB CSP
1.2.6 RF Module
1.2.7 Others
1.3 IC Package Substrates Segment by Application
1.3.1 Global IC Package Substrates Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Smart Phone
1.3.3 PC (tablet and Laptop)
1.3.4 Wearable Device
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global IC Package Substrates Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global IC Package Substrates Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global IC Package Substrates Production Estimates and Forecasts (2018-2029)
1.4.4 Global IC Package Substrates Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global IC Package Substrates Production Market Share by Manufacturers (2018-2023)
2.2 Global IC Package Substrates Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of IC Package Substrates, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global IC Package Substrates Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global IC Package Substrates Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of IC Package Substrates, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of IC Package Substrates, Product Offered and Application
2.8 Global Key Manufacturers of IC Package Substrates, Date of Enter into This Industry
2.9 IC Package Substrates Market Competitive Situation and Trends
2.9.1 IC Package Substrates Market Concentration Rate
2.9.2 Global 5 and 10 Largest IC Package Substrates Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 IC Package Substrates Production by Region
3.1 Global IC Package Substrates Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global IC Package Substrates Production Value by Region (2018-2029)
3.2.1 Global IC Package Substrates Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of IC Package Substrates by Region (2024-2029)
3.3 Global IC Package Substrates Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global IC Package Substrates Production by Region (2018-2029)
3.4.1 Global IC Package Substrates Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of IC Package Substrates by Region (2024-2029)
3.5 Global IC Package Substrates Market Price Analysis by Region (2018-2023)
3.6 Global IC Package Substrates Production and Value, Year-over-Year Growth
3.6.1 Japan IC Package Substrates Production Value Estimates and Forecasts (2018-2029)
3.6.2 South Korea IC Package Substrates Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Taiwan IC Package Substrates Production Value Estimates and Forecasts (2018-2029)
3.6.4 China IC Package Substrates Production Value Estimates and Forecasts (2018-2029)
4 IC Package Substrates Consumption by Region
4.1 Global IC Package Substrates Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global IC Package Substrates Consumption by Region (2018-2029)
4.2.1 Global IC Package Substrates Consumption by Region (2018-2023)
4.2.2 Global IC Package Substrates Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America IC Package Substrates Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe IC Package Substrates Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific IC Package Substrates Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific IC Package Substrates Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa IC Package Substrates Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa IC Package Substrates Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global IC Package Substrates Production by Type (2018-2029)
5.1.1 Global IC Package Substrates Production by Type (2018-2023)
5.1.2 Global IC Package Substrates Production by Type (2024-2029)
5.1.3 Global IC Package Substrates Production Market Share by Type (2018-2029)
5.2 Global IC Package Substrates Production Value by Type (2018-2029)
5.2.1 Global IC Package Substrates Production Value by Type (2018-2023)
5.2.2 Global IC Package Substrates Production Value by Type (2024-2029)
5.2.3 Global IC Package Substrates Production Value Market Share by Type (2018-2029)
5.3 Global IC Package Substrates Price by Type (2018-2029)
6 Segment by Application
6.1 Global IC Package Substrates Production by Application (2018-2029)
6.1.1 Global IC Package Substrates Production by Application (2018-2023)
6.1.2 Global IC Package Substrates Production by Application (2024-2029)
6.1.3 Global IC Package Substrates Production Market Share by Application (2018-2029)
6.2 Global IC Package Substrates Production Value by Application (2018-2029)
6.2.1 Global IC Package Substrates Production Value by Application (2018-2023)
6.2.2 Global IC Package Substrates Production Value by Application (2024-2029)
6.2.3 Global IC Package Substrates Production Value Market Share by Application (2018-2029)
6.3 Global IC Package Substrates Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Unimicron
7.1.1 Unimicron IC Package Substrates Corporation Information
7.1.2 Unimicron IC Package Substrates Product Portfolio
7.1.3 Unimicron IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Unimicron Main Business and Markets Served
7.1.5 Unimicron Recent Developments/Updates
7.2 Ibiden
7.2.1 Ibiden IC Package Substrates Corporation Information
7.2.2 Ibiden IC Package Substrates Product Portfolio
7.2.3 Ibiden IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Ibiden Main Business and Markets Served
7.2.5 Ibiden Recent Developments/Updates
7.3 Nan Ya PCB
7.3.1 Nan Ya PCB IC Package Substrates Corporation Information
7.3.2 Nan Ya PCB IC Package Substrates Product Portfolio
7.3.3 Nan Ya PCB IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Nan Ya PCB Main Business and Markets Served
7.3.5 Nan Ya PCB Recent Developments/Updates
7.4 Shinko Electric Industries
7.4.1 Shinko Electric Industries IC Package Substrates Corporation Information
7.4.2 Shinko Electric Industries IC Package Substrates Product Portfolio
7.4.3 Shinko Electric Industries IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Shinko Electric Industries Main Business and Markets Served
7.4.5 Shinko Electric Industries Recent Developments/Updates
7.5 Kinsus Interconnect Technology
7.5.1 Kinsus Interconnect Technology IC Package Substrates Corporation Information
7.5.2 Kinsus Interconnect Technology IC Package Substrates Product Portfolio
7.5.3 Kinsus Interconnect Technology IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Kinsus Interconnect Technology Main Business and Markets Served
7.5.5 Kinsus Interconnect Technology Recent Developments/Updates
7.6 AT&S
7.6.1 AT&S IC Package Substrates Corporation Information
7.6.2 AT&S IC Package Substrates Product Portfolio
7.6.3 AT&S IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.6.4 AT&S Main Business and Markets Served
7.6.5 AT&S Recent Developments/Updates
7.7 Semco
7.7.1 Semco IC Package Substrates Corporation Information
7.7.2 Semco IC Package Substrates Product Portfolio
7.7.3 Semco IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Semco Main Business and Markets Served
7.7.5 Semco Recent Developments/Updates
7.8 Kyocera
7.8.1 Kyocera IC Package Substrates Corporation Information
7.8.2 Kyocera IC Package Substrates Product Portfolio
7.8.3 Kyocera IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Kyocera Main Business and Markets Served
7.7.5 Kyocera Recent Developments/Updates
7.9 TOPPAN
7.9.1 TOPPAN IC Package Substrates Corporation Information
7.9.2 TOPPAN IC Package Substrates Product Portfolio
7.9.3 TOPPAN IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.9.4 TOPPAN Main Business and Markets Served
7.9.5 TOPPAN Recent Developments/Updates
7.10 Zhen Ding Technology
7.10.1 Zhen Ding Technology IC Package Substrates Corporation Information
7.10.2 Zhen Ding Technology IC Package Substrates Product Portfolio
7.10.3 Zhen Ding Technology IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Zhen Ding Technology Main Business and Markets Served
7.10.5 Zhen Ding Technology Recent Developments/Updates
7.11 Daeduck Electronics
7.11.1 Daeduck Electronics IC Package Substrates Corporation Information
7.11.2 Daeduck Electronics IC Package Substrates Product Portfolio
7.11.3 Daeduck Electronics IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Daeduck Electronics Main Business and Markets Served
7.11.5 Daeduck Electronics Recent Developments/Updates
7.12 ASE Material
7.12.1 ASE Material IC Package Substrates Corporation Information
7.12.2 ASE Material IC Package Substrates Product Portfolio
7.12.3 ASE Material IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.12.4 ASE Material Main Business and Markets Served
7.12.5 ASE Material Recent Developments/Updates
7.13 LG InnoTek
7.13.1 LG InnoTek IC Package Substrates Corporation Information
7.13.2 LG InnoTek IC Package Substrates Product Portfolio
7.13.3 LG InnoTek IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.13.4 LG InnoTek Main Business and Markets Served
7.13.5 LG InnoTek Recent Developments/Updates
7.14 Simmtech
7.14.1 Simmtech IC Package Substrates Corporation Information
7.14.2 Simmtech IC Package Substrates Product Portfolio
7.14.3 Simmtech IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Simmtech Main Business and Markets Served
7.14.5 Simmtech Recent Developments/Updates
7.15 Shennan Circuit
7.15.1 Shennan Circuit IC Package Substrates Corporation Information
7.15.2 Shennan Circuit IC Package Substrates Product Portfolio
7.15.3 Shennan Circuit IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Shennan Circuit Main Business and Markets Served
7.15.5 Shennan Circuit Recent Developments/Updates
7.16 Shenzhen Fastprint Circuit Tech
7.16.1 Shenzhen Fastprint Circuit Tech IC Package Substrates Corporation Information
7.16.2 Shenzhen Fastprint Circuit Tech IC Package Substrates Product Portfolio
7.16.3 Shenzhen Fastprint Circuit Tech IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.16.4 Shenzhen Fastprint Circuit Tech Main Business and Markets Served
7.16.5 Shenzhen Fastprint Circuit Tech Recent Developments/Updates
7.17 ACCESS
7.17.1 ACCESS IC Package Substrates Corporation Information
7.17.2 ACCESS IC Package Substrates Product Portfolio
7.17.3 ACCESS IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.17.4 ACCESS Main Business and Markets Served
7.17.5 ACCESS Recent Developments/Updates
7.18 Suntak Technology
7.18.1 Suntak Technology IC Package Substrates Corporation Information
7.18.2 Suntak Technology IC Package Substrates Product Portfolio
7.18.3 Suntak Technology IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.18.4 Suntak Technology Main Business and Markets Served
7.18.5 Suntak Technology Recent Developments/Updates
7.19 National Center for Advanced Packaging (NCAP China)
7.19.1 National Center for Advanced Packaging (NCAP China) IC Package Substrates Corporation Information
7.19.2 National Center for Advanced Packaging (NCAP China) IC Package Substrates Product Portfolio
7.19.3 National Center for Advanced Packaging (NCAP China) IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.19.4 National Center for Advanced Packaging (NCAP China) Main Business and Markets Served
7.19.5 National Center for Advanced Packaging (NCAP China) Recent Developments/Updates
7.20 Huizhou China Eagle Electronic Technology
7.20.1 Huizhou China Eagle Electronic Technology IC Package Substrates Corporation Information
7.20.2 Huizhou China Eagle Electronic Technology IC Package Substrates Product Portfolio
7.20.3 Huizhou China Eagle Electronic Technology IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.20.4 Huizhou China Eagle Electronic Technology Main Business and Markets Served
7.20.5 Huizhou China Eagle Electronic Technology Recent Developments/Updates
7.21 DSBJ
7.21.1 DSBJ IC Package Substrates Corporation Information
7.21.2 DSBJ IC Package Substrates Product Portfolio
7.21.3 DSBJ IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.21.4 DSBJ Main Business and Markets Served
7.21.5 DSBJ Recent Developments/Updates
7.22 Shenzhen Kinwong Electronic
7.22.1 Shenzhen Kinwong Electronic IC Package Substrates Corporation Information
7.22.2 Shenzhen Kinwong Electronic IC Package Substrates Product Portfolio
7.22.3 Shenzhen Kinwong Electronic IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.22.4 Shenzhen Kinwong Electronic Main Business and Markets Served
7.22.5 Shenzhen Kinwong Electronic Recent Developments/Updates
7.23 AKM Meadville
7.23.1 AKM Meadville IC Package Substrates Corporation Information
7.23.2 AKM Meadville IC Package Substrates Product Portfolio
7.23.3 AKM Meadville IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.23.4 AKM Meadville Main Business and Markets Served
7.23.5 AKM Meadville Recent Developments/Updates
7.24 Victory Giant Technology
7.24.1 Victory Giant Technology IC Package Substrates Corporation Information
7.24.2 Victory Giant Technology IC Package Substrates Product Portfolio
7.24.3 Victory Giant Technology IC Package Substrates Production, Value, Price and Gross Margin (2018-2023)
7.24.4 Victory Giant Technology Main Business and Markets Served
7.24.5 Victory Giant Technology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 IC Package Substrates Industry Chain Analysis
8.2 IC Package Substrates Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 IC Package Substrates Production Mode & Process
8.4 IC Package Substrates Sales and Marketing
8.4.1 IC Package Substrates Sales Channels
8.4.2 IC Package Substrates Distributors
8.5 IC Package Substrates Customers
9 IC Package Substrates Market Dynamics
9.1 IC Package Substrates Industry Trends
9.2 IC Package Substrates Market Drivers
9.3 IC Package Substrates Market Challenges
9.4 IC Package Substrates Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

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ICパッケージ基板のグローバル市場2023年：FC-BGA、FC-CSP、WB BGA、WB CSP、RFモジュール、その他

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