フリップチップパッケージ基板の世界市場見通し2023年-2029年

◆英語タイトル：Flip-Chip Package Substrate Market, Global Outlook and Forecast 2023-2029

Market Monitor Globalが発行した調査報告書（MMG23JU2303）

◆商品コード：MMG23JU2303
◆発行会社（リサーチ会社）：Market Monitor Global
◆発行日：2023年6月
◆ページ数：72
◆レポート形式：英語 / PDF
◆納品方法：Eメール（受注後2-3営業日）
◆調査対象地域：グローバル、北米、アメリカ、ヨーロッパ、アジア、日本、中国、東南アジア、インド、南米、中東・アフリカなど
◆産業分野：電子＆半導体

◆販売価格オプション（消費税別）

Single User（1名様閲覧用）	USD3,250 ⇒換算￥494,000	見積依頼/購入/質問フォーム
Multi User（20名様閲覧用）	USD4,225 ⇒換算￥642,200	見積依頼/購入/質問フォーム
Enterprise User（閲覧人数制限なし）	USD4,875 ⇒換算￥741,000	見積依頼/購入/質問フォーム

★Market Monitor Globalに受託調査の見積を依頼する

※販売価格オプションの説明はこちらで、ご利用ガイドはこちらでご確認いただけます。
※お支払金額は「換算金額（日本円）＋消費税＋配送料（Eメール納品は無料）」です。
※Eメールによる納品の場合、通常ご注文当日～2日以内に納品致します。
※レポート納品後、納品日＋5日以内に請求書を発行・送付致します。（請求書発行日より2ヶ月以内の銀行振込条件、カード払いに変更可）
※上記の日本語題名はH&Iグローバルリサーチが翻訳したものです。英語版原本には日本語表記はありません。
※為替レートは適宜修正・更新しております。リアルタイム更新ではありません。

❖ レポートの概要 ❖

Global Flip-Chip Package Substrate Market 調査レポートは次の情報を含め、グローバルにおけるのフリップチップパッケージ基板市場規模と予測を収録しています。・世界のフリップチップパッケージ基板市場：売上、2018年-2023年、2024年-2029年
・世界のフリップチップパッケージ基板市場：販売量、2018年-2023年、2024年-2029年
・世界のトップ5企業、2022年

世界のフリップチップパッケージ基板市場は2022年に000Mドルと評価され、予測期間中に000％のCAGRで2029年までに000Mドルに達すると予測されています。アメリカ市場は2022年に000Mドルと推定されており、中国は2029年までに000Mドルに達すると予測されています。「FCBGA」セグメントは今後6年間、000%の年平均成長率で2029年までに000Mドルに成長すると予測されています。

フリップチップパッケージ基板のグローバル主要企業は、Unimicron、 Ibiden、 Nan Ya PCB、 Shiko Electric Industries、 AT&S、 Kinsus Interconnect Technology、 Semco、 Kyocera、 TOPPAN、 Zhen Ding Technology、 Daeduck Electronics、 ASE Material、 ACCESSなどです。2022年にトップ5企業がグローバル売上シェアの約000%を占めています。

マーケットモニターグローバル社は、フリップチップパッケージ基板のメーカー、サプライヤー、流通業者、および業界の専門家を調査しました。これには、販売量、売上、需要、価格変動、製品タイプ、最近の動向と計画、産業トレンド、成長要因、課題、阻害要因、潜在的なリスクなどが含まれます。

【セグメント別マーケット分析】

世界のフリップチップパッケージ基板市場：タイプ別、2018年-2023年、2024年-2029年
世界のフリップチップパッケージ基板市場：タイプ別市場シェア、2022年
・FCBGA、FCCSP

世界のフリップチップパッケージ基板市場：用途別、2018年-2023年、2024年-2029年
世界のフリップチップパッケージ基板市場：用途別市場シェア、2022年
・ハイエンドサーバー、GPU、CPU＆MPU、ASIC、FPGA

世界のフリップチップパッケージ基板市場：地域・国別、2018年-2023年、2024年-2029年
世界のフリップチップパッケージ基板市場：地域別市場シェア、2022年
・北米：アメリカ、カナダ、メキシコ
・ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア
・アジア：中国、日本、韓国、東南アジア、インド
・南米：ブラジル、アルゼンチン
・中東・アフリカ：トルコ、イスラエル、サウジアラビア、UAE

【競争分析】

また、当レポートは主要な参入企業の分析を提供します。
・主要企業におけるフリップチップパッケージ基板のグローバル売上、2018年-2023年
・主要企業におけるフリップチップパッケージ基板のグローバル売上シェア、2022年
・主要企業におけるフリップチップパッケージ基板のグローバル販売量、2018年-2023年
・主要企業におけるフリップチップパッケージ基板のグローバル販売量シェア、2022年

さらに、当レポートは主要企業の情報を提示します。
Unimicron、 Ibiden、 Nan Ya PCB、 Shiko Electric Industries、 AT&S、 Kinsus Interconnect Technology、 Semco、 Kyocera、 TOPPAN、 Zhen Ding Technology、 Daeduck Electronics、 ASE Material、 ACCESS

*************************************************************

・調査・分析レポートの概要
フリップチップパッケージ基板市場の定義
市場セグメント
世界のフリップチップパッケージ基板市場概要
当レポートの特徴・ベネフィット
調査手法と情報源

・世界のフリップチップパッケージ基板市場規模
世界のフリップチップパッケージ基板市場規模：2022年 VS 2029年
世界のフリップチップパッケージ基板市場規模と予測 2018年-2029年

・競争状況
グローバルトップ企業
売上ベースでのグローバルトップ企業
企業別グローバルでのフリップチップパッケージ基板の売上
グローバルトップ3およびトップ5企業、2022年売上ベース
グローバル企業のフリップチップパッケージ基板製品タイプ
グローバルにおけるティア1、ティア2、ティア3企業

・タイプ別市場分析
タイプ区分：FCBGA、FCCSP
フリップチップパッケージ基板のタイプ別グローバル売上・予測

・用途別市場分析
用途区分：ハイエンドサーバー、GPU、CPU＆MPU、ASIC、FPGA
フリップチップパッケージ基板の用途別グローバル売上・予測

・地域別市場分析
地域別フリップチップパッケージ基板市場規模 2022年と2029年
地域別フリップチップパッケージ基板売上・予測
北米市場：アメリカ、カナダ、メキシコ
ヨーロッパ市場：ドイツ、フランス、イギリス、イタリア、ロシア
アジア市場：中国、日本、韓国、東南アジア、インド
南米市場：ブラジル、アルゼンチン
中東・アフリカ市場：トルコ、イスラエル、サウジアラビア、UAE

・主要企業の情報（企業概要、事業概要、主要製品、売上、ニュースなど）
Unimicron、 Ibiden、 Nan Ya PCB、 Shiko Electric Industries、 AT&S、 Kinsus Interconnect Technology、 Semco、 Kyocera、 TOPPAN、 Zhen Ding Technology、 Daeduck Electronics、 ASE Material、 ACCESS
...

This report aims to provide a comprehensive presentation of the global market for Flip-Chip Package Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Flip-Chip Package Substrate. This report contains market size and forecasts of Flip-Chip Package Substrate in global, including the following market information:
Global Flip-Chip Package Substrate Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Flip-Chip Package Substrate Market Sales, 2018-2023, 2024-2029, (Sqm)
Global top five Flip-Chip Package Substrate companies in 2022 (%)
The global Flip-Chip Package Substrate market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
FCBGA Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Flip-Chip Package Substrate include Unimicron, Ibiden, Nan Ya PCB, Shiko Electric Industries, AT&S, Kinsus Interconnect Technology, Semco, Kyocera and TOPPAN, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Flip-Chip Package Substrate manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Flip-Chip Package Substrate Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Sqm)
Global Flip-Chip Package Substrate Market Segment Percentages, by Type, 2022 (%)
FCBGA
FCCSP
Global Flip-Chip Package Substrate Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Sqm)
Global Flip-Chip Package Substrate Market Segment Percentages, by Application, 2022 (%)
High-end servers
GPU
CPU and MPU
ASIC
FPGA
Global Flip-Chip Package Substrate Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Sqm)
Global Flip-Chip Package Substrate Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Flip-Chip Package Substrate revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Flip-Chip Package Substrate revenues share in global market, 2022 (%)
Key companies Flip-Chip Package Substrate sales in global market, 2018-2023 (Estimated), (Sqm)
Key companies Flip-Chip Package Substrate sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Unimicron
Ibiden
Nan Ya PCB
Shiko Electric Industries
AT&S
Kinsus Interconnect Technology
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
ASE Material
ACCESS
Outline of Major Chapters:
Chapter 1: Introduces the definition of Flip-Chip Package Substrate, market overview.
Chapter 2: Global Flip-Chip Package Substrate market size in revenue and volume.
Chapter 3: Detailed analysis of Flip-Chip Package Substrate manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Flip-Chip Package Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Flip-Chip Package Substrate capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.

❖ レポートの目次 ❖

1 Introduction to Research & Analysis Reports
1.1 Flip-Chip Package Substrate Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Flip-Chip Package Substrate Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Flip-Chip Package Substrate Overall Market Size
2.1 Global Flip-Chip Package Substrate Market Size: 2022 VS 2029
2.2 Global Flip-Chip Package Substrate Revenue, Prospects & Forecasts: 2018-2029
2.3 Global Flip-Chip Package Substrate Sales: 2018-2029
3 Company Landscape
3.1 Top Flip-Chip Package Substrate Players in Global Market
3.2 Top Global Flip-Chip Package Substrate Companies Ranked by Revenue
3.3 Global Flip-Chip Package Substrate Revenue by Companies
3.4 Global Flip-Chip Package Substrate Sales by Companies
3.5 Global Flip-Chip Package Substrate Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 Flip-Chip Package Substrate Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers Flip-Chip Package Substrate Product Type
3.8 Tier 1, Tier 2 and Tier 3 Flip-Chip Package Substrate Players in Global Market
3.8.1 List of Global Tier 1 Flip-Chip Package Substrate Companies
3.8.2 List of Global Tier 2 and Tier 3 Flip-Chip Package Substrate Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type – Global Flip-Chip Package Substrate Market Size Markets, 2022 & 2029
4.1.2 FCBGA
4.1.3 FCCSP
4.2 By Type – Global Flip-Chip Package Substrate Revenue & Forecasts
4.2.1 By Type – Global Flip-Chip Package Substrate Revenue, 2018-2023
4.2.2 By Type – Global Flip-Chip Package Substrate Revenue, 2024-2029
4.2.3 By Type – Global Flip-Chip Package Substrate Revenue Market Share, 2018-2029
4.3 By Type – Global Flip-Chip Package Substrate Sales & Forecasts
4.3.1 By Type – Global Flip-Chip Package Substrate Sales, 2018-2023
4.3.2 By Type – Global Flip-Chip Package Substrate Sales, 2024-2029
4.3.3 By Type – Global Flip-Chip Package Substrate Sales Market Share, 2018-2029
4.4 By Type – Global Flip-Chip Package Substrate Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global Flip-Chip Package Substrate Market Size, 2022 & 2029
5.1.2 High-end servers
5.1.3 GPU
5.1.4 CPU and MPU
5.1.5 ASIC
5.1.6 FPGA
5.2 By Application – Global Flip-Chip Package Substrate Revenue & Forecasts
5.2.1 By Application – Global Flip-Chip Package Substrate Revenue, 2018-2023
5.2.2 By Application – Global Flip-Chip Package Substrate Revenue, 2024-2029
5.2.3 By Application – Global Flip-Chip Package Substrate Revenue Market Share, 2018-2029
5.3 By Application – Global Flip-Chip Package Substrate Sales & Forecasts
5.3.1 By Application – Global Flip-Chip Package Substrate Sales, 2018-2023
5.3.2 By Application – Global Flip-Chip Package Substrate Sales, 2024-2029
5.3.3 By Application – Global Flip-Chip Package Substrate Sales Market Share, 2018-2029
5.4 By Application – Global Flip-Chip Package Substrate Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region – Global Flip-Chip Package Substrate Market Size, 2022 & 2029
6.2 By Region – Global Flip-Chip Package Substrate Revenue & Forecasts
6.2.1 By Region – Global Flip-Chip Package Substrate Revenue, 2018-2023
6.2.2 By Region – Global Flip-Chip Package Substrate Revenue, 2024-2029
6.2.3 By Region – Global Flip-Chip Package Substrate Revenue Market Share, 2018-2029
6.3 By Region – Global Flip-Chip Package Substrate Sales & Forecasts
6.3.1 By Region – Global Flip-Chip Package Substrate Sales, 2018-2023
6.3.2 By Region – Global Flip-Chip Package Substrate Sales, 2024-2029
6.3.3 By Region – Global Flip-Chip Package Substrate Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country – North America Flip-Chip Package Substrate Revenue, 2018-2029
6.4.2 By Country – North America Flip-Chip Package Substrate Sales, 2018-2029
6.4.3 US Flip-Chip Package Substrate Market Size, 2018-2029
6.4.4 Canada Flip-Chip Package Substrate Market Size, 2018-2029
6.4.5 Mexico Flip-Chip Package Substrate Market Size, 2018-2029
6.5 Europe
6.5.1 By Country – Europe Flip-Chip Package Substrate Revenue, 2018-2029
6.5.2 By Country – Europe Flip-Chip Package Substrate Sales, 2018-2029
6.5.3 Germany Flip-Chip Package Substrate Market Size, 2018-2029
6.5.4 France Flip-Chip Package Substrate Market Size, 2018-2029
6.5.5 U.K. Flip-Chip Package Substrate Market Size, 2018-2029
6.5.6 Italy Flip-Chip Package Substrate Market Size, 2018-2029
6.5.7 Russia Flip-Chip Package Substrate Market Size, 2018-2029
6.5.8 Nordic Countries Flip-Chip Package Substrate Market Size, 2018-2029
6.5.9 Benelux Flip-Chip Package Substrate Market Size, 2018-2029
6.6 Asia
6.6.1 By Region – Asia Flip-Chip Package Substrate Revenue, 2018-2029
6.6.2 By Region – Asia Flip-Chip Package Substrate Sales, 2018-2029
6.6.3 China Flip-Chip Package Substrate Market Size, 2018-2029
6.6.4 Japan Flip-Chip Package Substrate Market Size, 2018-2029
6.6.5 South Korea Flip-Chip Package Substrate Market Size, 2018-2029
6.6.6 Southeast Asia Flip-Chip Package Substrate Market Size, 2018-2029
6.6.7 India Flip-Chip Package Substrate Market Size, 2018-2029
6.7 South America
6.7.1 By Country – South America Flip-Chip Package Substrate Revenue, 2018-2029
6.7.2 By Country – South America Flip-Chip Package Substrate Sales, 2018-2029
6.7.3 Brazil Flip-Chip Package Substrate Market Size, 2018-2029
6.7.4 Argentina Flip-Chip Package Substrate Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country – Middle East & Africa Flip-Chip Package Substrate Revenue, 2018-2029
6.8.2 By Country – Middle East & Africa Flip-Chip Package Substrate Sales, 2018-2029
6.8.3 Turkey Flip-Chip Package Substrate Market Size, 2018-2029
6.8.4 Israel Flip-Chip Package Substrate Market Size, 2018-2029
6.8.5 Saudi Arabia Flip-Chip Package Substrate Market Size, 2018-2029
6.8.6 UAE Flip-Chip Package Substrate Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 Unimicron
7.1.1 Unimicron Company Summary
7.1.2 Unimicron Business Overview
7.1.3 Unimicron Flip-Chip Package Substrate Major Product Offerings
7.1.4 Unimicron Flip-Chip Package Substrate Sales and Revenue in Global (2018-2023)
7.1.5 Unimicron Key News & Latest Developments
7.2 Ibiden
7.2.1 Ibiden Company Summary
7.2.2 Ibiden Business Overview
7.2.3 Ibiden Flip-Chip Package Substrate Major Product Offerings
7.2.4 Ibiden Flip-Chip Package Substrate Sales and Revenue in Global (2018-2023)
7.2.5 Ibiden Key News & Latest Developments
7.3 Nan Ya PCB
7.3.1 Nan Ya PCB Company Summary
7.3.2 Nan Ya PCB Business Overview
7.3.3 Nan Ya PCB Flip-Chip Package Substrate Major Product Offerings
7.3.4 Nan Ya PCB Flip-Chip Package Substrate Sales and Revenue in Global (2018-2023)
7.3.5 Nan Ya PCB Key News & Latest Developments
7.4 Shiko Electric Industries
7.4.1 Shiko Electric Industries Company Summary
7.4.2 Shiko Electric Industries Business Overview
7.4.3 Shiko Electric Industries Flip-Chip Package Substrate Major Product Offerings
7.4.4 Shiko Electric Industries Flip-Chip Package Substrate Sales and Revenue in Global (2018-2023)
7.4.5 Shiko Electric Industries Key News & Latest Developments
7.5 AT&S
7.5.1 AT&S Company Summary
7.5.2 AT&S Business Overview
7.5.3 AT&S Flip-Chip Package Substrate Major Product Offerings
7.5.4 AT&S Flip-Chip Package Substrate Sales and Revenue in Global (2018-2023)
7.5.5 AT&S Key News & Latest Developments
7.6 Kinsus Interconnect Technology
7.6.1 Kinsus Interconnect Technology Company Summary
7.6.2 Kinsus Interconnect Technology Business Overview
7.6.3 Kinsus Interconnect Technology Flip-Chip Package Substrate Major Product Offerings
7.6.4 Kinsus Interconnect Technology Flip-Chip Package Substrate Sales and Revenue in Global (2018-2023)
7.6.5 Kinsus Interconnect Technology Key News & Latest Developments
7.7 Semco
7.7.1 Semco Company Summary
7.7.2 Semco Business Overview
7.7.3 Semco Flip-Chip Package Substrate Major Product Offerings
7.7.4 Semco Flip-Chip Package Substrate Sales and Revenue in Global (2018-2023)
7.7.5 Semco Key News & Latest Developments
7.8 Kyocera
7.8.1 Kyocera Company Summary
7.8.2 Kyocera Business Overview
7.8.3 Kyocera Flip-Chip Package Substrate Major Product Offerings
7.8.4 Kyocera Flip-Chip Package Substrate Sales and Revenue in Global (2018-2023)
7.8.5 Kyocera Key News & Latest Developments
7.9 TOPPAN
7.9.1 TOPPAN Company Summary
7.9.2 TOPPAN Business Overview
7.9.3 TOPPAN Flip-Chip Package Substrate Major Product Offerings
7.9.4 TOPPAN Flip-Chip Package Substrate Sales and Revenue in Global (2018-2023)
7.9.5 TOPPAN Key News & Latest Developments
7.10 Zhen Ding Technology
7.10.1 Zhen Ding Technology Company Summary
7.10.2 Zhen Ding Technology Business Overview
7.10.3 Zhen Ding Technology Flip-Chip Package Substrate Major Product Offerings
7.10.4 Zhen Ding Technology Flip-Chip Package Substrate Sales and Revenue in Global (2018-2023)
7.10.5 Zhen Ding Technology Key News & Latest Developments
7.11 Daeduck Electronics
7.11.1 Daeduck Electronics Company Summary
7.11.2 Daeduck Electronics Flip-Chip Package Substrate Business Overview
7.11.3 Daeduck Electronics Flip-Chip Package Substrate Major Product Offerings
7.11.4 Daeduck Electronics Flip-Chip Package Substrate Sales and Revenue in Global (2018-2023)
7.11.5 Daeduck Electronics Key News & Latest Developments
7.12 ASE Material
7.12.1 ASE Material Company Summary
7.12.2 ASE Material Flip-Chip Package Substrate Business Overview
7.12.3 ASE Material Flip-Chip Package Substrate Major Product Offerings
7.12.4 ASE Material Flip-Chip Package Substrate Sales and Revenue in Global (2018-2023)
7.12.5 ASE Material Key News & Latest Developments
7.13 ACCESS
7.13.1 ACCESS Company Summary
7.13.2 ACCESS Flip-Chip Package Substrate Business Overview
7.13.3 ACCESS Flip-Chip Package Substrate Major Product Offerings
7.13.4 ACCESS Flip-Chip Package Substrate Sales and Revenue in Global (2018-2023)
7.13.5 ACCESS Key News & Latest Developments
8 Global Flip-Chip Package Substrate Production Capacity, Analysis
8.1 Global Flip-Chip Package Substrate Production Capacity, 2018-2029
8.2 Flip-Chip Package Substrate Production Capacity of Key Manufacturers in Global Market
8.3 Global Flip-Chip Package Substrate Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 Flip-Chip Package Substrate Supply Chain Analysis
10.1 Flip-Chip Package Substrate Industry Value Chain
10.2 Flip-Chip Package Substrate Upstream Market
10.3 Flip-Chip Package Substrate Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 Flip-Chip Package Substrate Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer

List of Tables
Table 1. Key Players of Flip-Chip Package Substrate in Global Market
Table 2. Top Flip-Chip Package Substrate Players in Global Market, Ranking by Revenue (2022)
Table 3. Global Flip-Chip Package Substrate Revenue by Companies, (US$, Mn), 2018-2023
Table 4. Global Flip-Chip Package Substrate Revenue Share by Companies, 2018-2023
Table 5. Global Flip-Chip Package Substrate Sales by Companies, (Sqm), 2018-2023
Table 6. Global Flip-Chip Package Substrate Sales Share by Companies, 2018-2023
Table 7. Key Manufacturers Flip-Chip Package Substrate Price (2018-2023) & (US$/Sqm)
Table 8. Global Manufacturers Flip-Chip Package Substrate Product Type
Table 9. List of Global Tier 1 Flip-Chip Package Substrate Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 10. List of Global Tier 2 and Tier 3 Flip-Chip Package Substrate Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 11. By Type – Global Flip-Chip Package Substrate Revenue, (US$, Mn), 2022 & 2029
Table 12. By Type - Global Flip-Chip Package Substrate Revenue (US$, Mn), 2018-2023
Table 13. By Type - Global Flip-Chip Package Substrate Revenue (US$, Mn), 2024-2029
Table 14. By Type - Global Flip-Chip Package Substrate Sales (Sqm), 2018-2023
Table 15. By Type - Global Flip-Chip Package Substrate Sales (Sqm), 2024-2029
Table 16. By Application – Global Flip-Chip Package Substrate Revenue, (US$, Mn), 2022 & 2029
Table 17. By Application - Global Flip-Chip Package Substrate Revenue (US$, Mn), 2018-2023
Table 18. By Application - Global Flip-Chip Package Substrate Revenue (US$, Mn), 2024-2029
Table 19. By Application - Global Flip-Chip Package Substrate Sales (Sqm), 2018-2023
Table 20. By Application - Global Flip-Chip Package Substrate Sales (Sqm), 2024-2029
Table 21. By Region – Global Flip-Chip Package Substrate Revenue, (US$, Mn), 2022 VS 2029
Table 22. By Region - Global Flip-Chip Package Substrate Revenue (US$, Mn), 2018-2023
Table 23. By Region - Global Flip-Chip Package Substrate Revenue (US$, Mn), 2024-2029
Table 24. By Region - Global Flip-Chip Package Substrate Sales (Sqm), 2018-2023
Table 25. By Region - Global Flip-Chip Package Substrate Sales (Sqm), 2024-2029
Table 26. By Country - North America Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2023
Table 27. By Country - North America Flip-Chip Package Substrate Revenue, (US$, Mn), 2024-2029
Table 28. By Country - North America Flip-Chip Package Substrate Sales, (Sqm), 2018-2023
Table 29. By Country - North America Flip-Chip Package Substrate Sales, (Sqm), 2024-2029
Table 30. By Country - Europe Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2023
Table 31. By Country - Europe Flip-Chip Package Substrate Revenue, (US$, Mn), 2024-2029
Table 32. By Country - Europe Flip-Chip Package Substrate Sales, (Sqm), 2018-2023
Table 33. By Country - Europe Flip-Chip Package Substrate Sales, (Sqm), 2024-2029
Table 34. By Region - Asia Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2023
Table 35. By Region - Asia Flip-Chip Package Substrate Revenue, (US$, Mn), 2024-2029
Table 36. By Region - Asia Flip-Chip Package Substrate Sales, (Sqm), 2018-2023
Table 37. By Region - Asia Flip-Chip Package Substrate Sales, (Sqm), 2024-2029
Table 38. By Country - South America Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2023
Table 39. By Country - South America Flip-Chip Package Substrate Revenue, (US$, Mn), 2024-2029
Table 40. By Country - South America Flip-Chip Package Substrate Sales, (Sqm), 2018-2023
Table 41. By Country - South America Flip-Chip Package Substrate Sales, (Sqm), 2024-2029
Table 42. By Country - Middle East & Africa Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2023
Table 43. By Country - Middle East & Africa Flip-Chip Package Substrate Revenue, (US$, Mn), 2024-2029
Table 44. By Country - Middle East & Africa Flip-Chip Package Substrate Sales, (Sqm), 2018-2023
Table 45. By Country - Middle East & Africa Flip-Chip Package Substrate Sales, (Sqm), 2024-2029
Table 46. Unimicron Company Summary
Table 47. Unimicron Flip-Chip Package Substrate Product Offerings
Table 48. Unimicron Flip-Chip Package Substrate Sales (Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 49. Unimicron Key News & Latest Developments
Table 50. Ibiden Company Summary
Table 51. Ibiden Flip-Chip Package Substrate Product Offerings
Table 52. Ibiden Flip-Chip Package Substrate Sales (Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 53. Ibiden Key News & Latest Developments
Table 54. Nan Ya PCB Company Summary
Table 55. Nan Ya PCB Flip-Chip Package Substrate Product Offerings
Table 56. Nan Ya PCB Flip-Chip Package Substrate Sales (Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 57. Nan Ya PCB Key News & Latest Developments
Table 58. Shiko Electric Industries Company Summary
Table 59. Shiko Electric Industries Flip-Chip Package Substrate Product Offerings
Table 60. Shiko Electric Industries Flip-Chip Package Substrate Sales (Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 61. Shiko Electric Industries Key News & Latest Developments
Table 62. AT&S Company Summary
Table 63. AT&S Flip-Chip Package Substrate Product Offerings
Table 64. AT&S Flip-Chip Package Substrate Sales (Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 65. AT&S Key News & Latest Developments
Table 66. Kinsus Interconnect Technology Company Summary
Table 67. Kinsus Interconnect Technology Flip-Chip Package Substrate Product Offerings
Table 68. Kinsus Interconnect Technology Flip-Chip Package Substrate Sales (Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 69. Kinsus Interconnect Technology Key News & Latest Developments
Table 70. Semco Company Summary
Table 71. Semco Flip-Chip Package Substrate Product Offerings
Table 72. Semco Flip-Chip Package Substrate Sales (Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 73. Semco Key News & Latest Developments
Table 74. Kyocera Company Summary
Table 75. Kyocera Flip-Chip Package Substrate Product Offerings
Table 76. Kyocera Flip-Chip Package Substrate Sales (Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 77. Kyocera Key News & Latest Developments
Table 78. TOPPAN Company Summary
Table 79. TOPPAN Flip-Chip Package Substrate Product Offerings
Table 80. TOPPAN Flip-Chip Package Substrate Sales (Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 81. TOPPAN Key News & Latest Developments
Table 82. Zhen Ding Technology Company Summary
Table 83. Zhen Ding Technology Flip-Chip Package Substrate Product Offerings
Table 84. Zhen Ding Technology Flip-Chip Package Substrate Sales (Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 85. Zhen Ding Technology Key News & Latest Developments
Table 86. Daeduck Electronics Company Summary
Table 87. Daeduck Electronics Flip-Chip Package Substrate Product Offerings
Table 88. Daeduck Electronics Flip-Chip Package Substrate Sales (Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 89. Daeduck Electronics Key News & Latest Developments
Table 90. ASE Material Company Summary
Table 91. ASE Material Flip-Chip Package Substrate Product Offerings
Table 92. ASE Material Flip-Chip Package Substrate Sales (Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 93. ASE Material Key News & Latest Developments
Table 94. ACCESS Company Summary
Table 95. ACCESS Flip-Chip Package Substrate Product Offerings
Table 96. ACCESS Flip-Chip Package Substrate Sales (Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) (2018-2023)
Table 97. ACCESS Key News & Latest Developments
Table 98. Flip-Chip Package Substrate Production Capacity (Sqm) of Key Manufacturers in Global Market, 2021-2023 (Sqm)
Table 99. Global Flip-Chip Package Substrate Capacity Market Share of Key Manufacturers, 2021-2023
Table 100. Global Flip-Chip Package Substrate Production by Region, 2018-2023 (Sqm)
Table 101. Global Flip-Chip Package Substrate Production by Region, 2024-2029 (Sqm)
Table 102. Flip-Chip Package Substrate Market Opportunities & Trends in Global Market
Table 103. Flip-Chip Package Substrate Market Drivers in Global Market
Table 104. Flip-Chip Package Substrate Market Restraints in Global Market
Table 105. Flip-Chip Package Substrate Raw Materials
Table 106. Flip-Chip Package Substrate Raw Materials Suppliers in Global Market
Table 107. Typical Flip-Chip Package Substrate Downstream
Table 108. Flip-Chip Package Substrate Downstream Clients in Global Market
Table 109. Flip-Chip Package Substrate Distributors and Sales Agents in Global Market
List of Figures
Figure 1. Flip-Chip Package Substrate Segment by Type in 2022
Figure 2. Flip-Chip Package Substrate Segment by Application in 2022
Figure 3. Global Flip-Chip Package Substrate Market Overview: 2022
Figure 4. Key Caveats
Figure 5. Global Flip-Chip Package Substrate Market Size: 2022 VS 2029 (US$, Mn)
Figure 6. Global Flip-Chip Package Substrate Revenue, 2018-2029 (US$, Mn)
Figure 7. Flip-Chip Package Substrate Sales in Global Market: 2018-2029 (Sqm)
Figure 8. The Top 3 and 5 Players Market Share by Flip-Chip Package Substrate Revenue in 2022
Figure 9. By Type - Global Flip-Chip Package Substrate Revenue, (US$, Mn), 2022 & 2029
Figure 10. By Type - Global Flip-Chip Package Substrate Revenue Market Share, 2018-2029
Figure 11. By Type - Global Flip-Chip Package Substrate Sales Market Share, 2018-2029
Figure 12. By Type - Global Flip-Chip Package Substrate Price (US$/Sqm), 2018-2029
Figure 13. By Application - Global Flip-Chip Package Substrate Revenue, (US$, Mn), 2022 & 2029
Figure 14. By Application - Global Flip-Chip Package Substrate Revenue Market Share, 2018-2029
Figure 15. By Application - Global Flip-Chip Package Substrate Sales Market Share, 2018-2029
Figure 16. By Application - Global Flip-Chip Package Substrate Price (US$/Sqm), 2018-2029
Figure 17. By Region - Global Flip-Chip Package Substrate Revenue, (US$, Mn), 2022 & 2029
Figure 18. By Region - Global Flip-Chip Package Substrate Revenue Market Share, 2018 VS 2022 VS 2029
Figure 19. By Region - Global Flip-Chip Package Substrate Revenue Market Share, 2018-2029
Figure 20. By Region - Global Flip-Chip Package Substrate Sales Market Share, 2018-2029
Figure 21. By Country - North America Flip-Chip Package Substrate Revenue Market Share, 2018-2029
Figure 22. By Country - North America Flip-Chip Package Substrate Sales Market Share, 2018-2029
Figure 23. US Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 24. Canada Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 25. Mexico Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 26. By Country - Europe Flip-Chip Package Substrate Revenue Market Share, 2018-2029
Figure 27. By Country - Europe Flip-Chip Package Substrate Sales Market Share, 2018-2029
Figure 28. Germany Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 29. France Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 30. U.K. Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 31. Italy Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 32. Russia Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 33. Nordic Countries Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 34. Benelux Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 35. By Region - Asia Flip-Chip Package Substrate Revenue Market Share, 2018-2029
Figure 36. By Region - Asia Flip-Chip Package Substrate Sales Market Share, 2018-2029
Figure 37. China Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 38. Japan Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 39. South Korea Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 40. Southeast Asia Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 41. India Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 42. By Country - South America Flip-Chip Package Substrate Revenue Market Share, 2018-2029
Figure 43. By Country - South America Flip-Chip Package Substrate Sales Market Share, 2018-2029
Figure 44. Brazil Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 45. Argentina Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 46. By Country - Middle East & Africa Flip-Chip Package Substrate Revenue Market Share, 2018-2029
Figure 47. By Country - Middle East & Africa Flip-Chip Package Substrate Sales Market Share, 2018-2029
Figure 48. Turkey Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 49. Israel Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 50. Saudi Arabia Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 51. UAE Flip-Chip Package Substrate Revenue, (US$, Mn), 2018-2029
Figure 52. Global Flip-Chip Package Substrate Production Capacity (Sqm), 2018-2029
Figure 53. The Percentage of Production Flip-Chip Package Substrate by Region, 2022 VS 2029
Figure 54. Flip-Chip Package Substrate Industry Value Chain
Figure 55. Marketing Channels

❖ 免責事項 ❖
http://www.globalresearch.jp/disclaimer

★リサーチレポート[ フリップチップパッケージ基板の世界市場見通し2023年-2029年(Flip-Chip Package Substrate Market, Global Outlook and Forecast 2023-2029)]についてメールでお問い合わせはこちらでお願いします。

GlobalResearch.jp

フリップチップパッケージ基板の世界市場見通し2023年-2029年

グローバル市場調査/マーケットリサーチ会社：レポート販売と委託調査サービス提供 www.GlobalResearch.jp