カテゴリー： Market Monitor Global, 世界, 部品/材料

チップ封止材料の世界市場見通し2023年-2029年

◆英語タイトル：Chip Encapsulation Material Market, Global Outlook and Forecast 2023-2029
	◆商品コード：MMG23LY0661 ◆発行会社（リサーチ会社）：Market Monitor Global ◆発行日：2023年7月 ◆ページ数：66 ◆レポート形式：英語 / PDF ◆納品方法：Eメール（受注後2-3営業日） ◆調査対象地域：グローバル ◆産業分野：化学＆材料

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❖ レポートの概要 ❖

Global Chip Encapsulation Material Market 調査レポートは次の情報を含め、グローバルにおけるのチップ封止材料市場規模と予測を収録しています。・世界のチップ封止材料市場：売上、2018年-2023年、2024年-2029年
・世界のチップ封止材料市場：販売量、2018年-2023年、2024年-2029年
・世界のトップ5企業、2022年

世界のチップ封止材料市場は2022年に000Mドルと評価され、予測期間中に000％のCAGRで2029年までに000Mドルに達すると予測されています。アメリカ市場は2022年に000Mドルと推定されており、中国は2029年までに000Mドルに達すると予測されています。「基板」セグメントは今後6年間、000%の年平均成長率で2029年までに000Mドルに成長すると予測されています。

チップ封止材料のグローバル主要企業は、Shennan Circuit Company Limited、 Xingsen Technology、 Kangqiang Electronics、 Kyocera、 Mitsui High-tec, Inc.、 Chang Wah Technology、 Panasonic、 Henkel、 Sumitomo Bakelite、 Heraeus、 Tanakaなどです。2022年にトップ5企業がグローバル売上シェアの約000%を占めています。

マーケットモニターグローバル社は、チップ封止材料のメーカー、サプライヤー、流通業者、および業界の専門家を調査しました。これには、販売量、売上、需要、価格変動、製品タイプ、最近の動向と計画、産業トレンド、成長要因、課題、阻害要因、潜在的なリスクなどが含まれます。

【セグメント別マーケット分析】

世界のチップ封止材料市場：タイプ別、2018年-2023年、2024年-2029年
世界のチップ封止材料市場：タイプ別市場シェア、2022年
・基板、リードフレーム、ボンディングワイヤ、封止樹脂、その他

世界のチップ封止材料市場：用途別、2018年-2023年、2024年-2029年
世界のチップ封止材料市場：用途別市場シェア、2022年
・家電、自動車エレクトロニクス、IT・通信産業、その他

世界のチップ封止材料市場：地域・国別、2018年-2023年、2024年-2029年
世界のチップ封止材料市場：地域別市場シェア、2022年
・北米：アメリカ、カナダ、メキシコ
・ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア
・アジア：中国、日本、韓国、東南アジア、インド
・南米：ブラジル、アルゼンチン
・中東・アフリカ：トルコ、イスラエル、サウジアラビア、UAE

【競争分析】

また、当レポートは主要な参入企業の分析を提供します。
・主要企業におけるチップ封止材料のグローバル売上、2018年-2023年
・主要企業におけるチップ封止材料のグローバル売上シェア、2022年
・主要企業におけるチップ封止材料のグローバル販売量、2018年-2023年
・主要企業におけるチップ封止材料のグローバル販売量シェア、2022年

さらに、当レポートは主要企業の情報を提示します。
Shennan Circuit Company Limited、 Xingsen Technology、 Kangqiang Electronics、 Kyocera、 Mitsui High-tec, Inc.、 Chang Wah Technology、 Panasonic、 Henkel、 Sumitomo Bakelite、 Heraeus、 Tanaka

*************************************************************

・調査・分析レポートの概要
チップ封止材料市場の定義
市場セグメント
世界のチップ封止材料市場概要
当レポートの特徴・ベネフィット
調査手法と情報源

・世界のチップ封止材料市場規模
世界のチップ封止材料市場規模：2022年 VS 2029年
世界のチップ封止材料市場規模と予測 2018年-2029年

・競争状況
グローバルトップ企業
売上ベースでのグローバルトップ企業
企業別グローバルでのチップ封止材料の売上
グローバルトップ3およびトップ5企業、2022年売上ベース
グローバル企業のチップ封止材料製品タイプ
グローバルにおけるティア1、ティア2、ティア3企業

・タイプ別市場分析
タイプ区分：基板、リードフレーム、ボンディングワイヤ、封止樹脂、その他
チップ封止材料のタイプ別グローバル売上・予測

・用途別市場分析
用途区分：家電、自動車エレクトロニクス、IT・通信産業、その他
チップ封止材料の用途別グローバル売上・予測

・地域別市場分析
地域別チップ封止材料市場規模 2022年と2029年
地域別チップ封止材料売上・予測
北米市場：アメリカ、カナダ、メキシコ
ヨーロッパ市場：ドイツ、フランス、イギリス、イタリア、ロシア
アジア市場：中国、日本、韓国、東南アジア、インド
南米市場：ブラジル、アルゼンチン
中東・アフリカ市場：トルコ、イスラエル、サウジアラビア、UAE

・主要企業の情報（企業概要、事業概要、主要製品、売上、ニュースなど）
Shennan Circuit Company Limited、 Xingsen Technology、 Kangqiang Electronics、 Kyocera、 Mitsui High-tec, Inc.、 Chang Wah Technology、 Panasonic、 Henkel、 Sumitomo Bakelite、 Heraeus、 Tanaka
...

This report aims to provide a comprehensive presentation of the global market for Chip Encapsulation Material, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Encapsulation Material. This report contains market size and forecasts of Chip Encapsulation Material in global, including the following market information:
Global Chip Encapsulation Material Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)
The global Chip Encapsulation Material market was valued at US$ 24470 million in 2022 and is projected to reach US$ 33810 million by 2029, at a CAGR of 4.7% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global key players of chip encapsulation material include Shennan Circuit Company Limited, Xingsen Technology, Kangqiang Electronics, Kyocera, etc. Global top five manufacturers hold a share over 19%. In terms of product, substrate is the largest segment, with a share over 32%. And in terms of application, the largest application is consumer electronics, with a share over 35%.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Chip Encapsulation Material companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Chip Encapsulation Material Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global Chip Encapsulation Material Market Segment Percentages, by Type, 2022 (%)
Substrates
Lead Frame
Bonding Wires
Encapsulating Resin
Others
Global Chip Encapsulation Material Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global Chip Encapsulation Material Market Segment Percentages, by Application, 2022 (%)
Consumer Electronics
Automotive Electronics
IT and Communication Industry
Others
Global Chip Encapsulation Material Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global Chip Encapsulation Material Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Chip Encapsulation Material revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies Chip Encapsulation Material revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Shennan Circuit Company Limited
Xingsen Technology
Kangqiang Electronics
Kyocera
Mitsui High-tec, Inc.
Chang Wah Technology
Panasonic
Henkel
Sumitomo Bakelite
Heraeus
Tanaka
Outline of Major Chapters:
Chapter 1: Introduces the definition of Chip Encapsulation Material, market overview.
Chapter 2: Global Chip Encapsulation Material market size in revenue.
Chapter 3: Detailed analysis of Chip Encapsulation Material company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Chip Encapsulation Material in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.

❖ レポートの目次 ❖

1 Introduction to Research & Analysis Reports
1.1 Chip Encapsulation Material Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Chip Encapsulation Material Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Chip Encapsulation Material Overall Market Size
2.1 Global Chip Encapsulation Material Market Size: 2022 VS 2029
2.2 Global Chip Encapsulation Material Market Size, Prospects & Forecasts: 2018-2029
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
3.1 Top Chip Encapsulation Material Players in Global Market
3.2 Top Global Chip Encapsulation Material Companies Ranked by Revenue
3.3 Global Chip Encapsulation Material Revenue by Companies
3.4 Top 3 and Top 5 Chip Encapsulation Material Companies in Global Market, by Revenue in 2022
3.5 Global Companies Chip Encapsulation Material Product Type
3.6 Tier 1, Tier 2 and Tier 3 Chip Encapsulation Material Players in Global Market
3.6.1 List of Global Tier 1 Chip Encapsulation Material Companies
3.6.2 List of Global Tier 2 and Tier 3 Chip Encapsulation Material Companies
4 Market Sights by Product
4.1 Overview
4.1.1 By Type – Global Chip Encapsulation Material Market Size Markets, 2022 & 2029
4.1.2 Substrates
4.1.3 Lead Frame
4.1.4 Bonding Wires
4.1.5 Encapsulating Resin
4.1.6 Others
4.2 By Type – Global Chip Encapsulation Material Revenue & Forecasts
4.2.1 By Type – Global Chip Encapsulation Material Revenue, 2018-2023
4.2.2 By Type – Global Chip Encapsulation Material Revenue, 2024-2029
4.2.3 By Type – Global Chip Encapsulation Material Revenue Market Share, 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global Chip Encapsulation Material Market Size, 2022 & 2029
5.1.2 Consumer Electronics
5.1.3 Automotive Electronics
5.1.4 IT and Communication Industry
5.1.5 Others
5.2 By Application – Global Chip Encapsulation Material Revenue & Forecasts
5.2.1 By Application – Global Chip Encapsulation Material Revenue, 2018-2023
5.2.2 By Application – Global Chip Encapsulation Material Revenue, 2024-2029
5.2.3 By Application – Global Chip Encapsulation Material Revenue Market Share, 2018-2029
6 Sights by Region
6.1 By Region – Global Chip Encapsulation Material Market Size, 2022 & 2029
6.2 By Region – Global Chip Encapsulation Material Revenue & Forecasts
6.2.1 By Region – Global Chip Encapsulation Material Revenue, 2018-2023
6.2.2 By Region – Global Chip Encapsulation Material Revenue, 2024-2029
6.2.3 By Region – Global Chip Encapsulation Material Revenue Market Share, 2018-2029
6.3 North America
6.3.1 By Country – North America Chip Encapsulation Material Revenue, 2018-2029
6.3.2 US Chip Encapsulation Material Market Size, 2018-2029
6.3.3 Canada Chip Encapsulation Material Market Size, 2018-2029
6.3.4 Mexico Chip Encapsulation Material Market Size, 2018-2029
6.4 Europe
6.4.1 By Country – Europe Chip Encapsulation Material Revenue, 2018-2029
6.4.2 Germany Chip Encapsulation Material Market Size, 2018-2029
6.4.3 France Chip Encapsulation Material Market Size, 2018-2029
6.4.4 U.K. Chip Encapsulation Material Market Size, 2018-2029
6.4.5 Italy Chip Encapsulation Material Market Size, 2018-2029
6.4.6 Russia Chip Encapsulation Material Market Size, 2018-2029
6.4.7 Nordic Countries Chip Encapsulation Material Market Size, 2018-2029
6.4.8 Benelux Chip Encapsulation Material Market Size, 2018-2029
6.5 Asia
6.5.1 By Region – Asia Chip Encapsulation Material Revenue, 2018-2029
6.5.2 China Chip Encapsulation Material Market Size, 2018-2029
6.5.3 Japan Chip Encapsulation Material Market Size, 2018-2029
6.5.4 South Korea Chip Encapsulation Material Market Size, 2018-2029
6.5.5 Southeast Asia Chip Encapsulation Material Market Size, 2018-2029
6.5.6 India Chip Encapsulation Material Market Size, 2018-2029
6.6 South America
6.6.1 By Country – South America Chip Encapsulation Material Revenue, 2018-2029
6.6.2 Brazil Chip Encapsulation Material Market Size, 2018-2029
6.6.3 Argentina Chip Encapsulation Material Market Size, 2018-2029
6.7 Middle East & Africa
6.7.1 By Country – Middle East & Africa Chip Encapsulation Material Revenue, 2018-2029
6.7.2 Turkey Chip Encapsulation Material Market Size, 2018-2029
6.7.3 Israel Chip Encapsulation Material Market Size, 2018-2029
6.7.4 Saudi Arabia Chip Encapsulation Material Market Size, 2018-2029
6.7.5 UAE Chip Encapsulation Material Market Size, 2018-2029
7 Chip Encapsulation Material Companies Profiles
7.1 Shennan Circuit Company Limited
7.1.1 Shennan Circuit Company Limited Company Summary
7.1.2 Shennan Circuit Company Limited Business Overview
7.1.3 Shennan Circuit Company Limited Chip Encapsulation Material Major Product Offerings
7.1.4 Shennan Circuit Company Limited Chip Encapsulation Material Revenue in Global Market (2018-2023)
7.1.5 Shennan Circuit Company Limited Key News & Latest Developments
7.2 Xingsen Technology
7.2.1 Xingsen Technology Company Summary
7.2.2 Xingsen Technology Business Overview
7.2.3 Xingsen Technology Chip Encapsulation Material Major Product Offerings
7.2.4 Xingsen Technology Chip Encapsulation Material Revenue in Global Market (2018-2023)
7.2.5 Xingsen Technology Key News & Latest Developments
7.3 Kangqiang Electronics
7.3.1 Kangqiang Electronics Company Summary
7.3.2 Kangqiang Electronics Business Overview
7.3.3 Kangqiang Electronics Chip Encapsulation Material Major Product Offerings
7.3.4 Kangqiang Electronics Chip Encapsulation Material Revenue in Global Market (2018-2023)
7.3.5 Kangqiang Electronics Key News & Latest Developments
7.4 Kyocera
7.4.1 Kyocera Company Summary
7.4.2 Kyocera Business Overview
7.4.3 Kyocera Chip Encapsulation Material Major Product Offerings
7.4.4 Kyocera Chip Encapsulation Material Revenue in Global Market (2018-2023)
7.4.5 Kyocera Key News & Latest Developments
7.5 Mitsui High-tec, Inc.
7.5.1 Mitsui High-tec, Inc. Company Summary
7.5.2 Mitsui High-tec, Inc. Business Overview
7.5.3 Mitsui High-tec, Inc. Chip Encapsulation Material Major Product Offerings
7.5.4 Mitsui High-tec, Inc. Chip Encapsulation Material Revenue in Global Market (2018-2023)
7.5.5 Mitsui High-tec, Inc. Key News & Latest Developments
7.6 Chang Wah Technology
7.6.1 Chang Wah Technology Company Summary
7.6.2 Chang Wah Technology Business Overview
7.6.3 Chang Wah Technology Chip Encapsulation Material Major Product Offerings
7.6.4 Chang Wah Technology Chip Encapsulation Material Revenue in Global Market (2018-2023)
7.6.5 Chang Wah Technology Key News & Latest Developments
7.7 Panasonic
7.7.1 Panasonic Company Summary
7.7.2 Panasonic Business Overview
7.7.3 Panasonic Chip Encapsulation Material Major Product Offerings
7.7.4 Panasonic Chip Encapsulation Material Revenue in Global Market (2018-2023)
7.7.5 Panasonic Key News & Latest Developments
7.8 Henkel
7.8.1 Henkel Company Summary
7.8.2 Henkel Business Overview
7.8.3 Henkel Chip Encapsulation Material Major Product Offerings
7.8.4 Henkel Chip Encapsulation Material Revenue in Global Market (2018-2023)
7.8.5 Henkel Key News & Latest Developments
7.9 Sumitomo Bakelite
7.9.1 Sumitomo Bakelite Company Summary
7.9.2 Sumitomo Bakelite Business Overview
7.9.3 Sumitomo Bakelite Chip Encapsulation Material Major Product Offerings
7.9.4 Sumitomo Bakelite Chip Encapsulation Material Revenue in Global Market (2018-2023)
7.9.5 Sumitomo Bakelite Key News & Latest Developments
7.10 Heraeus
7.10.1 Heraeus Company Summary
7.10.2 Heraeus Business Overview
7.10.3 Heraeus Chip Encapsulation Material Major Product Offerings
7.10.4 Heraeus Chip Encapsulation Material Revenue in Global Market (2018-2023)
7.10.5 Heraeus Key News & Latest Developments
7.11 Tanaka
7.11.1 Tanaka Company Summary
7.11.2 Tanaka Business Overview
7.11.3 Tanaka Chip Encapsulation Material Major Product Offerings
7.11.4 Tanaka Chip Encapsulation Material Revenue in Global Market (2018-2023)
7.11.5 Tanaka Key News & Latest Developments
8 Conclusion
9 Appendix
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer

List of Tables
Table 1. Chip Encapsulation Material Market Opportunities & Trends in Global Market
Table 2. Chip Encapsulation Material Market Drivers in Global Market
Table 3. Chip Encapsulation Material Market Restraints in Global Market
Table 4. Key Players of Chip Encapsulation Material in Global Market
Table 5. Top Chip Encapsulation Material Players in Global Market, Ranking by Revenue (2022)
Table 6. Global Chip Encapsulation Material Revenue by Companies, (US$, Mn), 2018-2023
Table 7. Global Chip Encapsulation Material Revenue Share by Companies, 2018-2023
Table 8. Global Companies Chip Encapsulation Material Product Type
Table 9. List of Global Tier 1 Chip Encapsulation Material Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 10. List of Global Tier 2 and Tier 3 Chip Encapsulation Material Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 11. By Type – Global Chip Encapsulation Material Revenue, (US$, Mn), 2022 & 2029
Table 12. By Type - Chip Encapsulation Material Revenue in Global (US$, Mn), 2018-2023
Table 13. By Type - Chip Encapsulation Material Revenue in Global (US$, Mn), 2024-2029
Table 14. By Application – Global Chip Encapsulation Material Revenue, (US$, Mn), 2022 & 2029
Table 15. By Application - Chip Encapsulation Material Revenue in Global (US$, Mn), 2018-2023
Table 16. By Application - Chip Encapsulation Material Revenue in Global (US$, Mn), 2024-2029
Table 17. By Region – Global Chip Encapsulation Material Revenue, (US$, Mn), 2022 & 2029
Table 18. By Region - Global Chip Encapsulation Material Revenue (US$, Mn), 2018-2023
Table 19. By Region - Global Chip Encapsulation Material Revenue (US$, Mn), 2024-2029
Table 20. By Country - North America Chip Encapsulation Material Revenue, (US$, Mn), 2018-2023
Table 21. By Country - North America Chip Encapsulation Material Revenue, (US$, Mn), 2024-2029
Table 22. By Country - Europe Chip Encapsulation Material Revenue, (US$, Mn), 2018-2023
Table 23. By Country - Europe Chip Encapsulation Material Revenue, (US$, Mn), 2024-2029
Table 24. By Region - Asia Chip Encapsulation Material Revenue, (US$, Mn), 2018-2023
Table 25. By Region - Asia Chip Encapsulation Material Revenue, (US$, Mn), 2024-2029
Table 26. By Country - South America Chip Encapsulation Material Revenue, (US$, Mn), 2018-2023
Table 27. By Country - South America Chip Encapsulation Material Revenue, (US$, Mn), 2024-2029
Table 28. By Country - Middle East & Africa Chip Encapsulation Material Revenue, (US$, Mn), 2018-2023
Table 29. By Country - Middle East & Africa Chip Encapsulation Material Revenue, (US$, Mn), 2024-2029
Table 30. Shennan Circuit Company Limited Company Summary
Table 31. Shennan Circuit Company Limited Chip Encapsulation Material Product Offerings
Table 32. Shennan Circuit Company Limited Chip Encapsulation Material Revenue (US$, Mn) & (2018-2023)
Table 33. Shennan Circuit Company Limited Key News & Latest Developments
Table 34. Xingsen Technology Company Summary
Table 35. Xingsen Technology Chip Encapsulation Material Product Offerings
Table 36. Xingsen Technology Chip Encapsulation Material Revenue (US$, Mn) & (2018-2023)
Table 37. Xingsen Technology Key News & Latest Developments
Table 38. Kangqiang Electronics Company Summary
Table 39. Kangqiang Electronics Chip Encapsulation Material Product Offerings
Table 40. Kangqiang Electronics Chip Encapsulation Material Revenue (US$, Mn) & (2018-2023)
Table 41. Kangqiang Electronics Key News & Latest Developments
Table 42. Kyocera Company Summary
Table 43. Kyocera Chip Encapsulation Material Product Offerings
Table 44. Kyocera Chip Encapsulation Material Revenue (US$, Mn) & (2018-2023)
Table 45. Kyocera Key News & Latest Developments
Table 46. Mitsui High-tec, Inc. Company Summary
Table 47. Mitsui High-tec, Inc. Chip Encapsulation Material Product Offerings
Table 48. Mitsui High-tec, Inc. Chip Encapsulation Material Revenue (US$, Mn) & (2018-2023)
Table 49. Mitsui High-tec, Inc. Key News & Latest Developments
Table 50. Chang Wah Technology Company Summary
Table 51. Chang Wah Technology Chip Encapsulation Material Product Offerings
Table 52. Chang Wah Technology Chip Encapsulation Material Revenue (US$, Mn) & (2018-2023)
Table 53. Chang Wah Technology Key News & Latest Developments
Table 54. Panasonic Company Summary
Table 55. Panasonic Chip Encapsulation Material Product Offerings
Table 56. Panasonic Chip Encapsulation Material Revenue (US$, Mn) & (2018-2023)
Table 57. Panasonic Key News & Latest Developments
Table 58. Henkel Company Summary
Table 59. Henkel Chip Encapsulation Material Product Offerings
Table 60. Henkel Chip Encapsulation Material Revenue (US$, Mn) & (2018-2023)
Table 61. Henkel Key News & Latest Developments
Table 62. Sumitomo Bakelite Company Summary
Table 63. Sumitomo Bakelite Chip Encapsulation Material Product Offerings
Table 64. Sumitomo Bakelite Chip Encapsulation Material Revenue (US$, Mn) & (2018-2023)
Table 65. Sumitomo Bakelite Key News & Latest Developments
Table 66. Heraeus Company Summary
Table 67. Heraeus Chip Encapsulation Material Product Offerings
Table 68. Heraeus Chip Encapsulation Material Revenue (US$, Mn) & (2018-2023)
Table 69. Heraeus Key News & Latest Developments
Table 70. Tanaka Company Summary
Table 71. Tanaka Chip Encapsulation Material Product Offerings
Table 72. Tanaka Chip Encapsulation Material Revenue (US$, Mn) & (2018-2023)
Table 73. Tanaka Key News & Latest Developments
List of Figures
Figure 1. Chip Encapsulation Material Segment by Type in 2022
Figure 2. Chip Encapsulation Material Segment by Application in 2022
Figure 3. Global Chip Encapsulation Material Market Overview: 2022
Figure 4. Key Caveats
Figure 5. Global Chip Encapsulation Material Market Size: 2022 VS 2029 (US$, Mn)
Figure 6. Global Chip Encapsulation Material Revenue, 2018-2029 (US$, Mn)
Figure 7. The Top 3 and 5 Players Market Share by Chip Encapsulation Material Revenue in 2022
Figure 8. By Type - Global Chip Encapsulation Material Revenue Market Share, 2018-2029
Figure 9. By Application - Global Chip Encapsulation Material Revenue Market Share, 2018-2029
Figure 10. By Type - Global Chip Encapsulation Material Revenue, (US$, Mn), 2022 & 2029
Figure 11. By Type - Global Chip Encapsulation Material Revenue Market Share, 2018-2029
Figure 12. By Application - Global Chip Encapsulation Material Revenue, (US$, Mn), 2022 & 2029
Figure 13. By Application - Global Chip Encapsulation Material Revenue Market Share, 2018-2029
Figure 14. By Region - Global Chip Encapsulation Material Revenue Market Share, 2018-2029
Figure 15. By Country - North America Chip Encapsulation Material Revenue Market Share, 2018-2029
Figure 16. US Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 17. Canada Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 18. Mexico Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 19. By Country - Europe Chip Encapsulation Material Revenue Market Share, 2018-2029
Figure 20. Germany Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 21. France Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 22. U.K. Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 23. Italy Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 24. Russia Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 25. Nordic Countries Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 26. Benelux Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 27. By Region - Asia Chip Encapsulation Material Revenue Market Share, 2018-2029
Figure 28. China Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 29. Japan Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 30. South Korea Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 31. Southeast Asia Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 32. India Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 33. By Country - South America Chip Encapsulation Material Revenue Market Share, 2018-2029
Figure 34. Brazil Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 35. Argentina Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 36. By Country - Middle East & Africa Chip Encapsulation Material Revenue Market Share, 2018-2029
Figure 37. Turkey Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 38. Israel Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 39. Saudi Arabia Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 40. UAE Chip Encapsulation Material Revenue, (US$, Mn), 2018-2029
Figure 41. Shennan Circuit Company Limited Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 42. Xingsen Technology Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 43. Kangqiang Electronics Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 44. Kyocera Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 45. Mitsui High-tec, Inc. Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 46. Chang Wah Technology Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 47. Panasonic Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 48. Henkel Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 49. Sumitomo Bakelite Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 50. Heraeus Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 51. Tanaka Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2018-2023)

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