カテゴリー： 航空宇宙/防衛, IMARC, 世界

耐放射線性電子機器の世界市場2023-2028：産業動向、シェア、規模、成長、機会・予測

◆英語タイトル：Radiation-Hardened Electronics Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028

IMARCが発行した調査報告書（IMARC23FE0101）◆商品コード：IMARC23FE0101
◆発行会社（リサーチ会社）：IMARC
◆発行日：2023年2月1日
◆ページ数：223
◆レポート形式：英語 / PDF
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❖ レポートの概要 ❖

IMARC社の本調査資料によると、世界の耐放射線性電子機器市場規模が2022年を基準に13億ドルに達しています。今後、2028年には16億ドルになり、2023年から2028年の間に2.9％の成長率を示すと見込まれます。本資料では、耐放射線性電子機器の世界市場を調査し、序論、範囲・手法、エグゼクティブサマリー、イントロダクション、製品別（カスタムメイド、市販品）分析、材料別（シリコン、炭化ケイ素、窒化ガリウム、その他）分析、技術別（RHBD、RHBP、RHBS）分析、コンポーネント別（パワー管理、特定用途向け集積回路、ロジック、メモリ、その他）分析、地域別（北米、アジア太平洋、ヨーロッパ、中南米、中東・アフリカ）分析、SWOT分析、バリューチェーン分析、ファイブフォース分析、価格分析、競争状況など、以下のように掲載しています。また、企業情報として、Analog Devices Inc., BAE Systems plc, Cobham Plc (Advent International), Data Device Corporation (Transdigm Group Incorporated), Honeywell International Inc., Microchip Technology Inc, STMicroelectronics, Texas Instruments Incorporated, The Boeing Company, Xilinx Inc., etc.などが含まれています。
・序論
・範囲・手法
・エグゼクティブサマリー
・イントロダクション
・世界の耐放射線性電子機器市場規模：製品別
- カスタムメイド耐放射線性電子機器の市場規模
- 耐放射線性電子機器市販品の市場規模
・世界の耐放射線性電子機器市場規模：材料別
- シリコンの市場規模
- 炭化ケイ素の市場規模
- 窒化ガリウムの市場規模
- その他材料の市場規模
・世界の耐放射線性電子機器市場規模：技術別
- RHBDにおける市場規模
- RHBPにおける市場規模
- RHBSにおける市場規模
・世界の耐放射線性電子機器市場規模：コンポーネント別
- パワー管理の市場規模
- 特定用途向け集積回路の市場規模
- ロジックの市場規模
- メモリの市場規模
- その他コンポーネントの市場規模
・世界の耐放射線性電子機器市場規模：地域別
- 北米の耐放射線性電子機器市場規模
- アジア太平洋の耐放射線性電子機器市場規模
- ヨーロッパの耐放射線性電子機器市場規模
- 中南米の耐放射線性電子機器市場規模
- 中東・アフリカの耐放射線性電子機器市場規模
・SWOT分析
・バリューチェーン分析
・ファイブフォース分析
・価格分析
・競争状況

The global radiation-hardened electronics market size reached US$ 1.3 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 1.6 Billion by 2028, exhibiting a growth rate (CAGR) of 2.9% during 2023-2028.

Radiation-hardened electronics refer to various electronic components, packages and products that are primarily used for high-altitude applications. The materials used for the manufacturing of such components include silicon, silicon carbide, gallium nitride and hydrogenated amorphous silicon. These components are resistant to the damage caused by ionizing and high-energy radiations, and gamma and neutron radiation emitted by nuclear reactors. They are widely employed in satellites, aircraft and nuclear power plants in the form of switching regulators, microprocessors and power supply devices. Owing to this, they find extensive applications across various industries, including aviation, space, military and defense.

The global market is primarily being driven by the increasing number of space missions and exploratory activities. In line with this, the rising demand for communication satellites for intelligence, surveillance and reconnaissance (ISR) operations is also providing a boost to the market growth. Radiation-hardened electronics is crucial for protecting electronic equipment from physical damage and failure caused by harmful radiations in outer space. Furthermore, widespread product adoption for manufacturing power management devices is creating a positive impact on the market. These electronics are also used to manufacture diodes, transistors and metal-oxide-semiconductor field-effect transistors (MOSFET) for various defense and military applications. Additionally, various technological advancements, such as the development of highly reliable integrated circuits and improvements in the field-programmable gate array (FPGA) technology, are creating a positive outlook for the market. Other factors, including significant growth in the electronics industry and extensive research and development (R&D) activities, are projected to drive the market further.

Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global radiation-hardened electronics market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on product type, material type, technique, component type and application.

Breakup by Product Type:

Custom Made
Commercial-Off-the-Shelf

Breakup by Material Type:

Silicon
Silicon Carbide
Gallium Nitride
Others

Breakup by Technique:

Radiation Hardening by Design (RHBD)
Radiation Hardening by Process (RHBP)
Radiation Hardening by Software (RHBS)

Breakup by Component Type:

Power Management
Application Specific Integrated Circuit
Logic
Memory
Field-Programmable Gate Array
Others

Breakup by Application:

Space Satellites
Commercial Satellites
Military
Aerospace and Defense
Nuclear Power Plants
Others

Breakup by Region:

North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa

Competitive Landscape:
The report has also analysed the competitive landscape of the market with some of the key players being Analog Devices Inc., BAE Systems plc, Cobham Plc (Advent International), Data Device Corporation (Transdigm Group Incorporated), Honeywell International Inc., Microchip Technology Inc, STMicroelectronics, Texas Instruments Incorporated, The Boeing Company, Xilinx Inc., etc.

Key Questions Answered in This Report:
How has the global radiation-hardened electronics market performed so far and how will it perform in the coming years?
What are the key regional markets?
What has been the impact of COVID-19 on the global radiation-hardened electronics market?
What is the breakup of the market based on the product type?
What is the breakup of the market based on the material type?
What is the breakup of the market based on the technique?
What is the breakup of the market based on the component type?
What is the breakup of the market based on the application?
What are the various stages in the value chain of the industry?
What are the key driving factors and challenges in the industry?
What is the structure of the global radiation-hardened electronics market and who are the key players?
What is the degree of competition in the industry?

❖ レポートの目次 ❖

1 Preface
2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
4.1 Overview
4.2 Key Industry Trends
5 Global Radiation-Hardened Electronics Market
5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast
6 Market Breakup by Product Type
6.1 Custom Made
6.1.1 Market Trends
6.1.2 Market Forecast
6.2 Commercial-Off-the-Shelf
6.2.1 Market Trends
6.2.2 Market Forecast
7 Market Breakup by Material Type
7.1 Silicon
7.1.1 Market Trends
7.1.2 Market Forecast
7.2 Silicon Carbide
7.2.1 Market Trends
7.2.2 Market Forecast
7.3 Gallium Nitride
7.3.1 Market Trends
7.3.2 Market Forecast
7.4 Others
7.4.1 Market Trends
7.4.2 Market Forecast
8 Market Breakup by Technique
8.1 Radiation Hardening by Design (RHBD)
8.1.1 Market Trends
8.1.2 Market Forecast
8.2 Radiation Hardening by Process (RHBP)
8.2.1 Market Trends
8.2.2 Market Forecast
8.3 Radiation Hardening by Software (RHBS)
8.3.1 Market Trends
8.3.2 Market Forecast
9 Market Breakup by Component Type
9.1 Power Management
9.1.1 Market Trends
9.1.2 Market Forecast
9.2 Application Specific Integrated Circuit
9.2.1 Market Trends
9.2.2 Market Forecast
9.3 Logic
9.3.1 Market Trends
9.3.2 Market Forecast
9.4 Memory
9.4.1 Market Trends
9.4.2 Market Forecast
9.5 Field-Programmable Gate Array
9.5.1 Market Trends
9.5.2 Market Forecast
9.6 Others
9.6.1 Market Trends
9.6.2 Market Forecast
10 Market Breakup by Application
10.1 Space Satellites
10.1.1 Market Trends
10.1.2 Market Forecast
10.2 Commercial Satellites
10.2.1 Market Trends
10.2.2 Market Forecast
10.3 Military
10.3.1 Market Trends
10.3.2 Market Forecast
10.4 Aerospace and Defense
10.4.1 Market Trends
10.4.2 Market Forecast
10.5 Nuclear Power Plants
10.5.1 Market Trends
10.5.2 Market Forecast
10.6 Others
10.6.1 Market Trends
10.6.2 Market Forecast
11 Market Breakup by Region
11.1 North America
11.1.1 United States
11.1.1.1 Market Trends
11.1.1.2 Market Forecast
11.1.2 Canada
11.1.2.1 Market Trends
11.1.2.2 Market Forecast
11.2 Asia Pacific
11.2.1 China
11.2.1.1 Market Trends
11.2.1.2 Market Forecast
11.2.2 Japan
11.2.2.1 Market Trends
11.2.2.2 Market Forecast
11.2.3 India
11.2.3.1 Market Trends
11.2.3.2 Market Forecast
11.2.4 South Korea
11.2.4.1 Market Trends
11.2.4.2 Market Forecast
11.2.5 Australia
11.2.5.1 Market Trends
11.2.5.2 Market Forecast
11.2.6 Indonesia
11.2.6.1 Market Trends
11.2.6.2 Market Forecast
11.2.7 Others
11.2.7.1 Market Trends
11.2.7.2 Market Forecast
11.3 Europe
11.3.1 Germany
11.3.1.1 Market Trends
11.3.1.2 Market Forecast
11.3.2 France
11.3.2.1 Market Trends
11.3.2.2 Market Forecast
11.3.3 United Kingdom
11.3.3.1 Market Trends
11.3.3.2 Market Forecast
11.3.4 Italy
11.3.4.1 Market Trends
11.3.4.2 Market Forecast
11.3.5 Spain
11.3.5.1 Market Trends
11.3.5.2 Market Forecast
11.3.6 Russia
11.3.6.1 Market Trends
11.3.6.2 Market Forecast
11.3.7 Others
11.3.7.1 Market Trends
11.3.7.2 Market Forecast
11.4 Latin America
11.4.1 Brazil
11.4.1.1 Market Trends
11.4.1.2 Market Forecast
11.4.2 Mexico
11.4.2.1 Market Trends
11.4.2.2 Market Forecast
11.4.3 Others
11.4.3.1 Market Trends
11.4.3.2 Market Forecast
11.5 Middle East and Africa
11.5.1 Market Trends
11.5.2 Market Breakup by Country
11.5.3 Market Forecast
12 SWOT Analysis
12.1 Overview
12.2 Strengths
12.3 Weaknesses
12.4 Opportunities
12.5 Threats
13 Value Chain Analysis
14 Porters Five Forces Analysis
14.1 Overview
14.2 Bargaining Power of Buyers
14.3 Bargaining Power of Suppliers
14.4 Degree of Competition
14.5 Threat of New Entrants
14.6 Threat of Substitutes
15 Price Indicators
16 Competitive Landscape
16.1 Market Structure
16.2 Key Players
16.3 Profiles of Key Players
16.3.1 Analog Devices Inc.
16.3.1.1 Company Overview
16.3.1.2 Product Portfolio
16.3.1.3 Financials
16.3.1.4 SWOT Analysis
16.3.2 BAE Systems plc
16.3.2.1 Company Overview
16.3.2.2 Product Portfolio
16.3.2.3 Financials
16.3.3 Cobham Plc (Advent International)
16.3.3.1 Company Overview
16.3.3.2 Product Portfolio
16.3.3.3 Financials
16.3.3.4 SWOT Analysis
16.3.4 Data Device Corporation (Transdigm Group Incorporated)
16.3.4.1 Company Overview
16.3.4.2 Product Portfolio
16.3.5 Honeywell International Inc.
16.3.5.1 Company Overview
16.3.5.2 Product Portfolio
16.3.5.3 Financials
16.3.5.4 SWOT Analysis
16.3.6 Microchip Technology Inc.
16.3.6.1 Company Overview
16.3.6.2 Product Portfolio
16.3.6.3 Financials
16.3.6.4 SWOT Analysis
16.3.7 STMicroelectronics
16.3.7.1 Company Overview
16.3.7.2 Product Portfolio
16.3.7.3 Financials
16.3.8 Texas Instruments Incorporated
16.3.8.1 Company Overview
16.3.8.2 Product Portfolio
16.3.8.3 Financials
16.3.8.4 SWOT Analysis
16.3.9 The Boeing Company
16.3.9.1 Company Overview
16.3.9.2 Product Portfolio
16.3.9.3 Financials
16.3.9.4 SWOT Analysis
16.3.10 Xilinx Inc.
16.3.10.1 Company Overview
16.3.10.2 Product Portfolio
16.3.10.3 Financials
16.3.10.4 SWOT Analysis



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